Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2008
06/10/2008US7384863 Semiconductor device and method for manufacturing the same
06/10/2008US7384854 Method of forming low capacitance ESD robust diodes
06/10/2008US7384824 Structure and programming of laser fuse
06/10/2008US7384822 Package for semiconductor components and method for producing the same
06/10/2008US7384821 Diamond composite heat spreader having thermal conductivity gradients and associated methods
06/10/2008US7384820 Method of manufacturing a semiconductor device
06/10/2008US7384818 Electronic package for image sensor, and the packaging method thereof
06/10/2008US7384805 Transfer mold semiconductor packaging processes
06/10/2008US7384801 Integrated circuit with inductor having horizontal magnetic flux lines
06/10/2008US7384698 Metal article intended for at least partially coating with a substance and a method for producing the same
06/10/2008US7384682 Reacted with a polyarylene ether flexibilizer; thermoplastic poly(2,3-epoxy-2-methyl ether) thermoplastic; spheriodal particle filler; higher fracture toughness, lower viscosity or increased thermal shock resistance at below -40 degrees C.; encapsulated semiconductor chips
06/10/2008US7384447 Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same
06/10/2008US7383770 Printing device for electronic parts having a roller and a squeegee arrangement
06/10/2008CA2359035C Resin composition, molded products formed therefrom and use thereof
06/10/2008CA2326455C Wafer-pair having deposited layer sealed chambers
06/10/2008CA2276885C Molding for holding heat sinks in a clamped stack
06/05/2008WO2008067494A1 Integrated circuit with built-in heating circuitry to reverse operational degeneration
06/05/2008WO2008067293A2 Abrasive powder coatings and methods for inhibiting tin whisker growth
06/05/2008WO2008067258A2 Semiconductor chip embedded in an insulator and having two-way heat extraction
06/05/2008WO2008067249A2 Chip on leads
06/05/2008WO2008067242A2 Semiconductor device with leadframe finger lock
06/05/2008WO2008066894A2 Substrate for a flexible microelectronic assembly
06/05/2008WO2008066764A1 Heat dissipation system for photovoltaic array interconnection sytem
06/05/2008WO2008066173A1 Amorphous carbon film, semiconductor device, film forming method, film forming apparatus and storage medium
06/05/2008WO2008066172A1 Film forming method, film forming apparatus, storage medium and semiconductor device
06/05/2008WO2008066087A1 Fine structure device, method for manufacturing the fine structure device and substrate for sealing
06/05/2008WO2008066060A1 Method for producing polymer, composition for forming insulating film, and silica insulating film and method for producing the same
06/05/2008WO2008066059A1 Semiconductor device and semiconductor device manufacturing method
06/05/2008WO2008066030A1 Al ALLOY FILM FOR DISPLAY DEVICE, DISPLAY DEVICE, AND SPUTTERING TARGET
06/05/2008WO2008066028A1 Interposer with built-in passive part
06/05/2008WO2008065944A1 Photosensitive siloxane composition, hardened film formed therefrom and device having the hardened film
06/05/2008WO2008065925A1 SEMICONDUCTOR DEVICE Cu WIRING AND METHOD FOR MANUFACTURING THE SAME
06/05/2008WO2008065896A1 Method for manufacturing semiconductor device having dual-face electrode structure and semiconductor device manufactured by the method
06/05/2008WO2008065602A1 Pulsating cooling system
06/05/2008WO2008065125A1 Fabrication of a diffusion barrier cap on copper containing conductive elements
06/05/2008WO2008064718A1 Electronic component module and method for the production thereof
06/05/2008WO2008064627A1 Circuit arrangement for supplying an integrated circuit with energy
06/05/2008WO2008064524A1 Outdoor-type high-power light emitting diode illumination device
06/05/2008WO2008064491A1 Superconducting shielding for use with an intergrated circuit for quantum computing
06/05/2008WO2008048628A3 Aligned crystalline semiconducting film on a glass substrate and methods of making
06/05/2008WO2008042193A3 Cold plate and mating manifold plate for ic device cooling system enabling the shipment of cooling system pre-charged with liquid coolant
06/05/2008WO2008020392A3 Semiconductor component and assembly with projecting electrode
06/05/2008WO2008020361A3 Deformable integrated circuit device
06/05/2008WO2007089723A3 Thermal enhanced package
06/05/2008WO2007070533A3 Electrical microfilament to circuit interface
06/05/2008WO2007067954A3 Thermal enhanced upper and dual heat sink exposed molded leadless package
06/05/2008WO2005121681A3 Counter flow micro heat exchanger for optimal performance
06/05/2008US20080132059 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device
06/05/2008US20080132026 Optimum padset for wire bonding rf technologies with high-q inductors
06/05/2008US20080132006 Packaged microelectronic devices and methods for packaging microelectronic devices
06/05/2008US20080132005 Electroplating method for a semiconductor device
06/05/2008US20080132003 Semiconductor chip package and method for fabricating the same
06/05/2008US20080132000 Chip scale package and method for marking chip scale packages
06/05/2008US20080131997 Integrated circuit package with chip-side signal connections
06/05/2008US20080131817 monitoring substrate comprising single-crystalline silicon, polycrystalline silicon, amorphous silicon or silicon oxide and a conditioning layer comprising hexamethyldisilazane, used with pattern-transferring system to transfer of the photomask's pattern to the photoresist layers; semiconductor
06/05/2008US20080131796 Method and test structure for estimating focus settings in a lithography process based on cd measurements
06/05/2008US20080130242 Using the wave soldering process to attach motherboard chipset heat sinks
06/05/2008US20080130237 Wafer Having Thermal Circuit And Power Supplier Therefor
06/05/2008US20080128924 Semiconductor Device Having In-Chip Critical Dimension and Focus Patterns
06/05/2008US20080128923 Glass for Semiconductor Encapsulation and Outer Tube for Semiconductor Encapsulation, and Semiconductor Electronic Parts
06/05/2008US20080128922 Epoxy resin composition for encapsulating semiconductor and semiconductor device
06/05/2008US20080128920 Resin-sealed electronic device and method of manufacturing the same
06/05/2008US20080128919 Wire bond integrated circuit package for high speed i/o
06/05/2008US20080128918 Manufacturing method for electronic component, electronic component, and electronic equipment
06/05/2008US20080128917 Semiconductor device and manufacturing method therefor
06/05/2008US20080128916 Semiconductor device including microstrip line and coplanar line
06/05/2008US20080128915 Semiconductor package and method for manufacturing the same
06/05/2008US20080128914 Semiconductor device and method of manufacturing the same
06/05/2008US20080128913 Tungsten interconnect super structure for semiconductor power devices
06/05/2008US20080128912 Protective coating comprising a water dispersed binder of formaldehyde-free polyurethanes and/or acrylic latex, a non-formaldehyde polycarbodiimide cross-linker, ammonium zirconium carbonate and a microbiocide; pH of7-9; urability, wear resistance, antisoilants and waterproofing; "green" fabrics
06/05/2008US20080128911 Semiconductor package and method for manufacturing the same
06/05/2008US20080128910 Post Passivation Interconnection Process And Structures
06/05/2008US20080128909 Interconnects with Direct Metalization and Conductive Polymer
06/05/2008US20080128908 Microcircuit package having ductile layer
06/05/2008US20080128907 Semiconductor structure with liner
06/05/2008US20080128906 Semiconductor device and manufacturing method thereof
06/05/2008US20080128905 Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
06/05/2008US20080128904 Semiconductor device and method of manufacturing semiconductor device
06/05/2008US20080128903 Semiconductor module, method for manufacturing semiconductor modules and mobile device
06/05/2008US20080128902 Semiconductor chip and tab package having the same
06/05/2008US20080128901 Micro-electro-mechanical systems device and integrated circuit device integrated in a three-dimensional semiconductor structure
06/05/2008US20080128900 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
06/05/2008US20080128899 System for clamping heat sink
06/05/2008US20080128898 Integrated thermal systems
06/05/2008US20080128897 Heat spreader for a multi-chip package
06/05/2008US20080128896 Semiconductor apparatus and manufacturing method thereof
06/05/2008US20080128895 Wafer applied thermal-mechanical interface
06/05/2008US20080128894 Support body for semiconductor element, method for manufacturing the same and semiconductor device
06/05/2008US20080128893 Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit
06/05/2008US20080128892 Intergrated Circuits Device Having a Reinforcement Structure
06/05/2008US20080128891 Semiconductor package substrate and methods for forming same, In particular for mems devices
06/05/2008US20080128890 Chip package and fabricating process thereof
06/05/2008US20080128889 Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof
06/05/2008US20080128888 System-in-package (SiP) and method of manufacturing the same
06/05/2008US20080128887 Semiconductor Device
06/05/2008US20080128886 Substrate for a flexible microelectronic assembly and a method of fabricating thereof
06/05/2008US20080128885 Stress decoupling structures for flip-chip assembly
06/05/2008US20080128884 Stacked Die Package
06/05/2008US20080128883 High i/o semiconductor chip package and method of manufacturing the same
06/05/2008US20080128882 Chip stack package and method of manufacturing the same
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