Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2008
06/11/2008CN101197352A Packaging structure and its manufacturing method
06/11/2008CN101197351A Slow fusing type fuse structure of chip and its production method
06/11/2008CN101197350A Wafer with mark
06/11/2008CN101197349A Semiconductor element and wafer level chip size package having it
06/11/2008CN101197348A Multi-use polysilicon edge test structure
06/11/2008CN101197347A Interconnection and its forming method
06/11/2008CN101197346A Nano-fuse structural arrangements having blow protection barrier spaced from and surrounding fuse link
06/11/2008CN101197345A Mram cell structure and magnetoresistance random access memory structure
06/11/2008CN101197344A Packaging substrate and its manufacturing method
06/11/2008CN101197343A Semiconductor device including microstrip line and coplanar line
06/11/2008CN101197342A Packaging structure and its manufacturing method
06/11/2008CN101197341A Semiconductor packaging structure with intensification layer and encapsulation method thereof
06/11/2008CN101197340A Semiconductor element and wafer level chip size package having it
06/11/2008CN101197339A Soldered ball redistribution connecting structure
06/11/2008CN101197338A Semiconductor module, method for manufacturing semiconductor modules and mobile device
06/11/2008CN101197337A Fool-proof integrated circuit component
06/11/2008CN101197336A Structure and process for wl-csp with metal cover
06/11/2008CN101197335A Flip chip packaging structure with girth member and packaging method thereof
06/11/2008CN101197334A Power semiconductor module and production method thereof
06/11/2008CN101197329A SONOS flash memory and production method thereof
06/11/2008CN101197317A Phase change memory cell with thermal barrier and method for fabricating the same
06/11/2008CN101197315A Metal line pattern of semiconductor device and method of forming the same
06/11/2008CN101197314A Semiconductor device and fabricating method thereof
06/11/2008CN101197311A Metal connecting structure, semiconductor device and its manufacturing method
06/11/2008CN101197298A Method for manufacturing semiconductor device and semiconductor device
06/11/2008CN101197297A Wafer press welding and bonding method and structure thereof
06/11/2008CN101197295A Packaging structure and its encapsulation method
06/11/2008CN101197272A Method for forming metal front medium layer and its structure
06/11/2008CN101196771A Heat radiating device of notebook computer and its production method
06/11/2008CN101196279A LED lights for interior automotive lighting
06/11/2008CN101195700A Light emitting diode frame body component and manufacturing method thereof
06/11/2008CN100394677C AC generator for vehicles
06/11/2008CN100394623C Packing substrate structure of optical diode and preparing method
06/11/2008CN100394615C Semiconductor device
06/11/2008CN100394602C Electronic circuit device and method for manufacturing the same
06/11/2008CN100394601C Semiconductor chip, semiconductor wafer and semiconductor device and its manufacturing method
06/11/2008CN100394599C Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
06/11/2008CN100394598C Ultrathin stack components
06/11/2008CN100394597C Integrated circuit package with a capacitor
06/11/2008CN100394596C ESD protection device and semiconductor chip
06/11/2008CN100394595C Special new pattern identification sign for testing film layer thickness in semiconductor device
06/11/2008CN100394594C Semiconductor devices and connection structure for semiconductor devices
06/11/2008CN100394593C 半导体器件 Semiconductor devices
06/11/2008CN100394592C Gold bonding wire and method for manufacturing same
06/11/2008CN100394591C Functional coating of an SCFM preform
06/11/2008CN100394590C Manufacture structure and method for leadless chip carrier with embedded inductor
06/11/2008CN100394589C Semiconductor element thermal radiation arrangement and radiator
06/11/2008CN100394588C Integrated circuit device with built-in single temperature sensor
06/11/2008CN100394587C Radiator structure and producing method thereof
06/11/2008CN100394577C Alignment method and mounting method using the alignment method
06/11/2008CN100394571C LSI package, LSI element testing method, and semiconductor device manufacturing method
06/11/2008CN100394569C Method for preventing overflow of glue of package element
06/11/2008CN100394567C Submount and semiconductor device
06/11/2008CN100394566C Ic package and method of manufacturing same
06/11/2008CN100394565C Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
06/11/2008CN100394564C Wiring substrate and manufacturing method thereof
06/11/2008CN100394563C Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display
06/11/2008CN100394561C Semiconductor device and method of manufacturing the same
06/11/2008CN100394559C Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
06/11/2008CN100394533C Plasma display device
06/11/2008CN100394352C Cooling jacket
06/11/2008CN100394290C Semiconductor device having a low-resistance bus interconnect, method of manufacturing same, and display apparatus employing same
06/11/2008CN100393777C Siloxane-based resin and a semiconductor interlayer insulating film using the same
06/10/2008USRE40369 Heat sink and electronic device employing the same
06/10/2008US7386413 Switched length matched transmission path instrument
06/10/2008US7385835 Membrane 3D IC fabrication
06/10/2008US7385818 Cooling apparatus
06/10/2008US7385457 Flexible capacitive coupler assembly and method of manufacture
06/10/2008US7385299 Stackable integrated circuit package system with multiple interconnect interface
06/10/2008US7385298 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
06/10/2008US7385297 Under-bond pad structures for integrated circuit devices
06/10/2008US7385296 Sensor device having stopper for limitting displacement
06/10/2008US7385295 Fabrication of nano-gap electrode arrays by the construction and selective chemical etching of nano-crosswire stacks
06/10/2008US7385294 Semiconductor device having nickel silicide and method of fabricating nickel silicide
06/10/2008US7385293 Copper alloy, fabrication method thereof, and sputtering target
06/10/2008US7385292 Top layers of metal for high performance IC's
06/10/2008US7385291 Top layers of metal for high performance IC's
06/10/2008US7385290 Electrochemical reaction cell for a combined barrier layer and seed layer
06/10/2008US7385289 Semiconductor device using inorganic film between wiring layer and bonding pad
06/10/2008US7385288 Electronic packaging using conductive interproser connector
06/10/2008US7385287 Preventing damage to low-k materials during resist stripping
06/10/2008US7385286 Semiconductor module
06/10/2008US7385285 Light assembly
06/10/2008US7385284 Transponder incorporated into an electronic device
06/10/2008US7385283 Three dimensional integrated circuit and method of making the same
06/10/2008US7385282 Stacked-type chip package structure
06/10/2008US7385281 Semiconductor integrated circuit device
06/10/2008US7385280 Electronic device package and electronic equipment
06/10/2008US7385279 Semiconductor device and a method of manufacturing the same
06/10/2008US7385278 Strobe light control circuit and IGBT device
06/10/2008US7385277 Semiconductor chip and method of fabricating the same
06/10/2008US7385276 Semiconductor device, and method for manufacturing the same
06/10/2008US7385267 Nanosensors
06/10/2008US7385254 Structure for protection against radio disturbances
06/10/2008US7385253 Device for electrostatic discharge protection and circuit thereof
06/10/2008US7385252 ESD protection for high voltage applications
06/10/2008US7385250 Semiconductor device
06/10/2008US7385246 Depletable cathode low charge storage diode
06/10/2008US7385242 Semiconductor device having landing pad and fabrication method thereof
06/10/2008US7384864 Top layers of metal for high performance IC's