| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/12/2008 | US20080135974 Method and apparatus for performing metalization in an integrated circuit process |
| 06/12/2008 | US20080135973 Semiconductor device comprising high-withstand voltage mosfet and its manufacturing method |
| 06/12/2008 | US20080135966 Smart card capable of sensing light |
| 06/12/2008 | US20080135960 Semiconductor device and electronic device |
| 06/12/2008 | US20080135941 Modulated trigger device |
| 06/12/2008 | US20080135939 Fabrication method of semiconductor package and structure thereof |
| 06/12/2008 | US20080135937 Tft containing coalesced nanoparticles |
| 06/12/2008 | US20080135931 Power Semiconductor Devices Having Termination Structures and Methods of Manufacture |
| 06/12/2008 | US20080135917 Method to form uniform tunnel oxide for flash devices and the resulting structures |
| 06/12/2008 | US20080135905 Selective coupling of voltage feeds for body bias voltage in an integrated circuit device |
| 06/12/2008 | US20080135882 Semiconductor element |
| 06/12/2008 | US20080135881 Semiconductor device, layout design method thereof, and layout design device using the same |
| 06/12/2008 | US20080135841 Semiconductor wafer, method of manufacturing the same and method of manufacturing semiconductor chip |
| 06/12/2008 | US20080135840 Test structure |
| 06/12/2008 | US20080135629 Security marking and security mark |
| 06/12/2008 | US20080135413 Method of delivering a treatment substance to a target substance in a treatment zone |
| 06/12/2008 | DE112006001844T5 Verfahren zum Herstellen einer Elektronikkomponente und Elektronikkomponente A method of manufacturing an electronic component and electronic component |
| 06/12/2008 | DE10345982B4 Verfahren zur Minimierung von mikroskopischen und makroskopischen Ausrichtungsfehlern einer Mehrfachschicht A method for minimizing microscopic and macroscopic alignment errors of a multiple layer |
| 06/12/2008 | DE10343502B4 Verfahren zum Herstellen einer wärmeleitenden Verbindung A method of manufacturing a thermally conductive compound |
| 06/12/2008 | DE10326273B4 Verfahren zur Reduzierung der Scheibenkontaminierung durch Entfernen von Metallisierungsunterlagenschichten am Scheibenrand Method for reducing the Scheibenkontaminierung by removing Metallisierungsunterlagenschichten at the wafer edge |
| 06/12/2008 | DE102007059181A1 Struktur und Verfahren für WL-CSP mit Metalldeckschicht Structure and process for WL-CSP with metal facing |
| 06/12/2008 | DE102007059161A1 Multi-Chip Package Struktur und Verfahren zu deren Herstellung Multi-chip package structure and methods for their preparation |
| 06/12/2008 | DE102007058190A1 Bildsensormodul Image sensor module |
| 06/12/2008 | DE102007049388A1 Method for forming a device with integrated circuits, involves lining of opening in electrically insulated layer with metal layer, where metal layer is nitrated with higher concentration of nitrogen related to part of metal layer |
| 06/12/2008 | DE102007038937A1 Baugruppenanordnung Assembly arrangement |
| 06/12/2008 | DE102007032074A1 Elektronische Komponenten darin verkapselndes elektronisches Gehäuse Electronic components therein encapsulating electronic enclosure |
| 06/12/2008 | DE102007003481A1 Speicherchip und Einschiebekarte mit demselben darauf Memory chip and Einschiebekarte the same on |
| 06/12/2008 | DE102006058068A1 Halbleiterbauelement mit Halbleiterchip und passivem Bauelement sowie Verfahren zu dessen Herstellung A semiconductor device having semiconductor chip and a passive element as well as method for its preparation |
| 06/12/2008 | DE102006057930A1 Electronic circuit, has substrate, applied on electronic component and frame is provided on substrate and frame is partially conductive and frame has carbon fiber for generating conductivity |
| 06/12/2008 | DE10164913B4 Film forming material, useful for the production of semiconductor devices, has a low dielectric constant and comprises siloxane resin and polycarbosilane. |
| 06/11/2008 | EP1930946A2 Wiring substrate and method for manufacturing the same |
| 06/11/2008 | EP1930945A1 Semiconductor power module |
| 06/11/2008 | EP1930944A2 Wafer applied thermal-mechanical interface |
| 06/11/2008 | EP1930943A1 Heat sink module and process for producing the same |
| 06/11/2008 | EP1930942A1 A heat sinking module construction for heating component |
| 06/11/2008 | EP1930843A1 Backing film adapted for preventing electronic module electrostatic discharges and method of manufacturing a module implementing the backing film |
| 06/11/2008 | EP1930682A1 Heat pipe and method of manufacturing the same |
| 06/11/2008 | EP1929540A2 Land grid array semiconductor device packages, assemblies including same, and methods of fabrication |
| 06/11/2008 | EP1929523A1 Radio frequency over-molded leadframe package |
| 06/11/2008 | EP1929522A1 Integrated circuit comprising at least one integrated transmission line |
| 06/11/2008 | EP1929521A2 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
| 06/11/2008 | EP1929520A2 Microelectronic devices and microelectronic support devices, and associated assemblies and methods |
| 06/11/2008 | EP1929519A2 Pakaged electronic devices and process of manufacturing same |
| 06/11/2008 | EP1929390A1 Semiconductor integrated circuit having current leakage reduction scheme |
| 06/11/2008 | EP1790048A4 Connector or other circuit element having an indirectly coupled integrated circuit |
| 06/11/2008 | EP1340250B1 Bump formation method and bump forming apparatus to semiconductor wafer |
| 06/11/2008 | EP1325519B1 Semiconductor apparatus with improved ESD withstanding voltage |
| 06/11/2008 | EP1024953B1 Use of glass laminate as a substrate in semiconductor devices |
| 06/11/2008 | CN201072764Y Heat radiating device of LED light source |
| 06/11/2008 | CN201072763Y Anti-electric shock high power LED structure |
| 06/11/2008 | CN201072758Y Graphic pattern ground mat of package substrate |
| 06/11/2008 | CN201072757Y Thin film flip-chip packaging |
| 06/11/2008 | CN201072756Y Mixed optoelectronic packaging outer casing |
| 06/11/2008 | CN201072112Y Horizontal type LED lamp with air convection warehouse |
| 06/11/2008 | CN201072111Y Vertical type LED lamp with air convection warehouse |
| 06/11/2008 | CN201072108Y Heat radiating device of LED energy-saving lamp |
| 06/11/2008 | CN201072098Y Switchable high power LED chip |
| 06/11/2008 | CN201072088Y Packaging structure and light source of luminous element |
| 06/11/2008 | CN201072087Y High luminous efficiency LED light emitting diode |
| 06/11/2008 | CN201072050Y Heat radiating device of road lamp |
| 06/11/2008 | CN201072037Y Mine lamp head with heat radiating device |
| 06/11/2008 | CN101199248A 多层印刷线路板 Multilayer printed circuit boards |
| 06/11/2008 | CN101199247A Printed wiring board |
| 06/11/2008 | CN101199246A Method for manufacturing a circuit board structure, and a circuit board structure |
| 06/11/2008 | CN101199242A Method for manufacturing a circuit board structure, and a circuit board structure |
| 06/11/2008 | CN101199052A Packaging logic and memory integrated circuits |
| 06/11/2008 | CN101199051A System for supplying carbon dioxide |
| 06/11/2008 | CN101199050A Gap-change sensing through capacitive techniques |
| 06/11/2008 | CN101199037A High performance stress-enhanced mosfets using si:c and sige epitaxial source/drain and method of manufacture |
| 06/11/2008 | CN101198909A Masking of repeated overlay and alignment marks to allow reuse of photomasks in a vertical structure |
| 06/11/2008 | CN101198243A Radiating module |
| 06/11/2008 | CN101198242A Double-heat source radiating module |
| 06/11/2008 | CN101198241A Ceramic radiating module and host board having the module |
| 06/11/2008 | CN101197408A Light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
| 06/11/2008 | CN101197397A Semiconductor device and method of manufacturing the same |
| 06/11/2008 | CN101197391A 有机电致发光显示器件 Organic electroluminescent display device |
| 06/11/2008 | CN101197390A Organic light emitting display apparatus |
| 06/11/2008 | CN101197389A AC illuminating body and AC illuminating device |
| 06/11/2008 | CN101197384A Imagine sensor package and forming method of the same |
| 06/11/2008 | CN101197383A Accurately locating image chip packaging structure |
| 06/11/2008 | CN101197382A Slight image chip packaging structure |
| 06/11/2008 | CN101197381A Display apparatus and electronic apparatus |
| 06/11/2008 | CN101197380A Semiconductor device and electro-optical device |
| 06/11/2008 | CN101197378A Non-volatile ROM and method of fabricating the same |
| 06/11/2008 | CN101197373A Semiconductor device, manufacturing method thereof, and SRAM cell |
| 06/11/2008 | CN101197372A Semiconductor device and resin sealing type semiconductor device |
| 06/11/2008 | CN101197366A Esd protection circuit for an integrated circuit with a negative voltage input terminal |
| 06/11/2008 | CN101197365A Semiconductor storage device |
| 06/11/2008 | CN101197364A Layout circuit with stable guiding current and IC chip with the same |
| 06/11/2008 | CN101197363A Double-joint grounding circuit and power supply circuit, and IC chip with the same |
| 06/11/2008 | CN101197362A Metal capacitance in CMOS/BiCMOS technique |
| 06/11/2008 | CN101197361A Power module and method of manufacturing the same |
| 06/11/2008 | CN101197360A Multi-chips package and method of forming the same |
| 06/11/2008 | CN101197359A Image sensor module |
| 06/11/2008 | CN101197358A Electronic circuit device and method for producing the same |
| 06/11/2008 | CN101197357A Light emitting diode package, and light source unit and backlight unit including the same |
| 06/11/2008 | CN101197356A Multi-chip package structure and its forming method |
| 06/11/2008 | CN101197355A Electronic device and method for producing the same, lbd display unit and method for producing the same |
| 06/11/2008 | CN101197354A Stack packaging structure |
| 06/11/2008 | CN101197353A 可堆叠式半导体封装结构 Stackable semiconductor package structure |