Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/09/2014CN103915424A 半导体模块封装 Semiconductor module package
07/09/2014CN103915423A 一种芯片三维堆叠封装结构及封装方法 A chip package structure and three-dimensional stacked packaging method
07/09/2014CN103915422A 用于半导体结构的方法和装置 Method and apparatus for a semiconductor structure
07/09/2014CN103915421A 用于形成堆叠封装件的方法和装置 Method and apparatus for forming the stacked package
07/09/2014CN103915420A 静电放电保护装置和用于制造静电放电保护装置的方法 ESD protection device and method of manufacturing the ESD protection device for
07/09/2014CN103915419A 半导体装置的硅穿孔双向修补电路 Silicon via bidirectional semiconductor device repair circuit
07/09/2014CN103915418A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915417A 一种测试器件群测试键 A test device group test button
07/09/2014CN103915416A 具有薄膜覆晶封装的电子装置 Electronic device having a thin film flip chip package
07/09/2014CN103915415A 集成电路的可靠性分析测试结构及其测试方法 Structural reliability analysis and testing of integrated circuits and test methods
07/09/2014CN103915414A 倒装芯片晶片级封装及其方法 Flip chip and wafer level packaging method
07/09/2014CN103915413A 层叠封装接合结构 Package on Package engagement structure
07/09/2014CN103915412A 用于集成电路的金属布线结构 Metal wiring structure for an integrated circuit
07/09/2014CN103915411A 电编程熔丝结构 Electrically programmable fuse structure
07/09/2014CN103915410A 半导体器件和半导体器件的制作方法 Fabrication of a semiconductor device and a semiconductor device
07/09/2014CN103915409A 电化隔离元件及其制造方法 Galvanic isolation element and manufacturing method thereof
07/09/2014CN103915408A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915407A 集成电路的可配置电路和网状结构 An integrated circuit configurable circuitry and network structure
07/09/2014CN103915406A 信号路径和制造多重图案化的半导体器件的方法 Multiple signal paths and a method of manufacturing a semiconductor device patterning
07/09/2014CN103915405A 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
07/09/2014CN103915404A 用于增加内外电极间的结合力的电子结构及电子封装构件 Electronic structure and electronic packaging member for increasing the bonding force between the inner and outer electrodes
07/09/2014CN103915403A 双列直插封装的框架 Dual In-line Package framework
07/09/2014CN103915402A 光电模块结构 Photovoltaic module structure
07/09/2014CN103915401A 封装结构中的细长凸块结构 Package structure elongated bump structure
07/09/2014CN103915400A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915399A 半导体器件 Semiconductor devices
07/09/2014CN103915398A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/09/2014CN103915397A 多裸晶、高电流晶圆级封装 Multi-Die, high current wafer level packaging
07/09/2014CN103915396A 层叠封装接合结构及其形成方法 Layered structure and method of forming the bonding package
07/09/2014CN103915395A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915394A 半导体封装结构及其制作方法 Semiconductor package and method of making
07/09/2014CN103915393A 光电封装体及其制造方法 Package and method for manufacturing the photoelectric
07/09/2014CN103915392A 基板、半导体结构以及其相关制造方法 A substrate, a semiconductor structure and its associated manufacturing method
07/09/2014CN103915391A 半导体封装件及其制法 Semiconductor package Jiqizhifa
07/09/2014CN103915377A 具有减小的应力的隔离线结构、制造的方法和设计结构 Isolated line structure having a reduced stress, and the design of the structure produced by the method
07/09/2014CN103915376A 具有自对准气隙的半导体器件及其制造方法 Semiconductor device and manufacturing method thereof having a self-aligned air gap
07/09/2014CN103915375A 用于先进后端工艺线互连的组合大马士革和减薄金属刻蚀的系统及方法 Back-end technology for advanced interconnect line combinations Damascus and thinning systems and metal etching method
07/09/2014CN103915374A 钝化后互连结构及其形成方法 Interconnect structure and method of forming passivation
07/09/2014CN103915315A Mim电容及其形成方法 Mim capacitor and method for forming
07/09/2014CN103913916A 一种阵列基板及其制造方法、液晶显示屏 An arrayed substrate and manufacturing method, a liquid crystal display
07/09/2014CN103911616A 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 Method etchant composition, method of forming a metal pattern and an array substrate
07/09/2014CN103911526A 功率半导体装置用铝合金细线 Power semiconductor devices with thin aluminum
07/09/2014CN103911107A 低粘度环氧树脂灌封胶和将其用于灌封500kV高压带电显示器的用途 Low viscosity epoxy potting and encapsulating it for 500kV high-voltage live display purposes
07/09/2014CN102723322B 锗硅工艺中监控发射极和基极因接触孔而串通的测试结构 SiGe process monitoring due to the emitter and base contact holes and collusion test structure
07/09/2014CN102723293B 芯片倒装单面三维线路先蚀后封制造方法及其封装结构 Flip-chip single line after the first three letters etched manufacturing method and package structure
07/09/2014CN102723280B 单面三维线路芯片倒装先蚀后封制造方法 After the one-sided first three lines of flip chip seal erosion manufacturing method
07/09/2014CN102623422B 散热装置 Cooling devices
07/09/2014CN102593082B 印刷基板单元、电子设备以及半导体封装 A printed circuit board unit, an electronic device and a semiconductor package
07/09/2014CN102473699B 具有降低的编程电压的鳍片反熔丝 Fins with reduced programming voltage antifuse
07/09/2014CN102449763B 非易失性存储元件以及其制造方法 Non-volatile storage element and a manufacturing method thereof
07/09/2014CN102365247B 玻璃组合物及使用其的被覆元件和封接元件 Glass compositions and the use thereof covering element and sealing element
07/09/2014CN102347288B 集成电路装置 The integrated circuit device
07/09/2014CN102316671B 多层陶瓷基板 Multilayer ceramic substrate
07/09/2014CN102203939B 热管和电子装置 Heat pipes and electronic equipment
07/09/2014CN102187277B 喷涂用正型感光性树脂组合物及使用该组合物的贯通电极的制造方法 Spray coating the positive photosensitive resin composition and a production method of the composition through electrode
07/09/2014CN102177582B 用于在测试集成在半导体晶片上的多个电子器件期间并行供应电力的电路 For parallel power supply circuit during a plurality of electronic devices integrated on a semiconductor wafer test of
07/09/2014CN102163585B 半导体装置 Semiconductor device
07/09/2014CN102160184B 显示装置 Display device
07/09/2014CN101911485B 压电器件 Piezoelectric devices
07/09/2014CN101752356B 半导体芯片冷却装置 Semiconductor chip cooling device
07/09/2014CN101724354B 树脂组合物及采用该树脂组合物制作的半导体装置 The resin composition and semiconductor device using the resin composition prepared
07/09/2014CN101661915B 液冷式冷却装置 Liquid-cooling device
07/09/2014CN101496164B 电子芯片接触点结构 Electronic chip contact point structure
07/09/2014CN101379612B 半导体装置 Semiconductor device
07/08/2014US8775998 Support device of three-dimensional integrated circuit and method thereof
07/08/2014US8774887 Analyte monitoring device and methods of use
07/08/2014US8773857 Heat sink mounting device
07/08/2014US8772953 Semiconductor device and programming method
07/08/2014US8772949 Enhanced capture pads for through semiconductor vias
07/08/2014US8772947 Methods for packaging microelectronic devices and microelectronic devices formed using such methods
07/08/2014US8772946 Reduced stress TSV and interposer structures
07/08/2014US8772945 Through silicon via with embedded barrier pad
07/08/2014US8772944 Semiconductor device and method for manufacturing semiconductor device
07/08/2014US8772942 Interconnect structure employing a Mn-group VIIIB alloy liner
07/08/2014US8772941 Circuit structure with low dielectric constant regions
07/08/2014US8772940 Semiconductor device
07/08/2014US8772939 Polishing systems and methods for removing conductive material from microelectronic substrates
07/08/2014US8772937 Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines
07/08/2014US8772936 Semiconductor device with a copper line and method for manufacturing the same
07/08/2014US8772935 Semiconductor device and method of manufacturing the same
07/08/2014US8772934 Aluminum interconnection apparatus
07/08/2014US8772933 Interconnect structure and method of making same
07/08/2014US8772932 Electronic device package
07/08/2014US8772931 Dual-function integrated circuit
07/08/2014US8772930 Increased surface area electrical contacts for microelectronic packages
07/08/2014US8772929 Package for three dimensional integrated circuit
07/08/2014US8772928 Integrated circuit chip with reduced IR drop
07/08/2014US8772927 Semiconductor package structures having liquid cooler integrated with first level chip package modules
07/08/2014US8772926 Production method of cooler
07/08/2014US8772925 Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
07/08/2014US8772923 Semiconductor device having leads with cutout and method of manufacturing the same
07/08/2014US8772921 Interposer for semiconductor package
07/08/2014US8772920 Interconnection and assembly of three-dimensional chip packages
07/08/2014US8772919 Image sensor package with trench insulator and fabrication method thereof
07/08/2014US8772918 Semiconductor die package and embedded printed circuit board
07/08/2014US8772917 Semiconductor device having an antenna
07/08/2014US8772916 Integrated circuit package system employing mold flash prevention technology
07/08/2014US8772915 Mask programmable interface selection
07/08/2014US8772914 Semiconductor device
07/08/2014US8772913 Stiffened semiconductor die package
1 ... 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 ... 2262