| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/18/2008 | CN101202296A Thin film transistor device, image display device and manufacturing method thereof |
| 06/18/2008 | CN101202292A Semiconductor memory device and method of manufacturing the same |
| 06/18/2008 | CN101202291A Array substrate and display panel having the same |
| 06/18/2008 | CN101202290A Pixel structure and method for repairing thereof |
| 06/18/2008 | CN101202289A Thin film transistor substrate and liquid crystal display apparatus having the same |
| 06/18/2008 | CN101202287A Array substrate, method of manufacturing the same, and method of repairing line in the same |
| 06/18/2008 | CN101202281A SCR electrostatic protection device and method of manufacture |
| 06/18/2008 | CN101202280A SCR electrostatic protection device and method of manufacture |
| 06/18/2008 | CN101202279A Electrostatic discharge protection circuit and integrated circuit |
| 06/18/2008 | CN101202278A Active element array base plate |
| 06/18/2008 | CN101202276A AC-LED single chip having three contact points |
| 06/18/2008 | CN101202275A Package having shield case |
| 06/18/2008 | CN101202274A Multi-chip electronic circuit module and a method of manufacturing |
| 06/18/2008 | CN101202273A LED module |
| 06/18/2008 | CN101202272A Sealing structure for MEMS devices and method of the same |
| 06/18/2008 | CN101202270A LED module set and method of manufacture |
| 06/18/2008 | CN101202269A Pixel structure having concave-convex line structures and method for making the same |
| 06/18/2008 | CN101202268A Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method |
| 06/18/2008 | CN101202267A Method and structure supplying electric connection for IC die |
| 06/18/2008 | CN101202266A Chip scale package for power devices and method for making the same |
| 06/18/2008 | CN101202265A Packaging board, semiconductor module, and portable apparatus |
| 06/18/2008 | CN101202264A Conducting wire rack of single lateral weld mat beat lines wafer encapsulation and wafer encapsulation structure |
| 06/18/2008 | CN101202263A Encapsulation structure and method for forming the same |
| 06/18/2008 | CN101202262A Semiconductor device and method for manufacturing the same |
| 06/18/2008 | CN101202261A Element mounting structure and element mounting method |
| 06/18/2008 | CN101202260A Semiconductor device package featuring encapsulated leadframe with projecting bumps or balls |
| 06/18/2008 | CN101202259A Chip stack encapsulation structure, inner embedded type chip packaging structure and method of manufacture |
| 06/18/2008 | CN101202258A Power semiconductor module with contact springs |
| 06/18/2008 | CN101202257A Semiconductor device and method for manufacturing the same |
| 06/18/2008 | CN101202256A Power amplifier |
| 06/18/2008 | CN101202255A Semiconductor device radiator |
| 06/18/2008 | CN101202254A Semiconductor device and method for manufacturing the same |
| 06/18/2008 | CN101202253A Wafer level package with good coefficient of thermal expansion efficiency performance and method of the same |
| 06/18/2008 | CN101202252A Glue film and chip encapsulation manufacture process using the glue film |
| 06/18/2008 | CN101202214A Method of forming pre-metal dielectric layer of semiconductor device |
| 06/18/2008 | CN101202213A Self-assembled lamellar microdomains and method of alignment |
| 06/18/2008 | CN101202208A Manufacture method of electronic component |
| 06/18/2008 | CN101201676A Radiating device |
| 06/18/2008 | CN101201538A Soft template with alignment mark |
| 06/18/2008 | CN101201271A Internal modulation type ferro-electricity non-refrigeration infrared focal plane prober |
| 06/18/2008 | CN101201157A Single end LED energy-saving lamp and drive circuit thereof |
| 06/18/2008 | CN101201156A Device of LED lamp |
| 06/18/2008 | CN101201155A High-power LED street light fitting |
| 06/18/2008 | CN101201154A Light fitting of high-power LED street light with external heat sink |
| 06/18/2008 | CN101200014A Fabricating process for heat dissipating device |
| 06/18/2008 | CN100396167C Bonding pads for a printed circuit board and formation method thereof |
| 06/18/2008 | CN100395918C Device of antenna and heat radiation metal plate and manufacturing method |
| 06/18/2008 | CN100395894C Organic electroluminescent display device and method for fabricating the same |
| 06/18/2008 | CN100395890C Integrated circuit structure and method of providing source voltage to integrated circuit |
| 06/18/2008 | CN100395889C Encapsulation structure for multiple chips |
| 06/18/2008 | CN100395888C Semiconductor packer and its production |
| 06/18/2008 | CN100395887C Integrated circuit packaging structure and manufacturing method thereof |
| 06/18/2008 | CN100395886C Semiconductor device manufacturing method |
| 06/18/2008 | CN100395880C Semiconductor structure and producing method thereof |
| 06/18/2008 | CN100395871C Method of heat treatment and heat treatment apparatus |
| 06/18/2008 | CN100395303C Extrudable bridged grease-like heat radiating material, container sealingly filled with material, method of mfg. container, and method of radiating heat by use thereof |
| 06/18/2008 | CA2613270A1 Device comprising integrated electronic components having a divider for separating ventilated zones |
| 06/17/2008 | USRE40383 Stud and rider for use on matrix trays |
| 06/17/2008 | US7388753 Methods and apparatuses for thermal dissipation |
| 06/17/2008 | US7388751 Method and apparatus for attaching a processor and corresponding heat sink to a circuit board |
| 06/17/2008 | US7388750 Plasma display module |
| 06/17/2008 | US7388746 Heatsink assembly |
| 06/17/2008 | US7388385 Wafer dicing system |
| 06/17/2008 | US7388297 Semiconductor device with reduced thickness of the semiconductor substrate |
| 06/17/2008 | US7388296 a substrate main body made of a glass-ceramic containing Al2O3 ceramic, having a front and back surfaces; a pad formed on surace of substrate main body contains same ceramic as substrate, Fe converted into Fe2O3; and Cu; a conductor pin provided in an upright position on pad via solder; antiwarping |
| 06/17/2008 | US7388295 Multi-chip module |
| 06/17/2008 | US7388294 Semiconductor components having stacked dice |
| 06/17/2008 | US7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
| 06/17/2008 | US7388292 Top layers of metal for high performance IC's |
| 06/17/2008 | US7388291 Semiconductor device and method of fabricating the same |
| 06/17/2008 | US7388290 Spacer patterned, high dielectric constant capacitor and methods for fabricating the same |
| 06/17/2008 | US7388289 Local multilayered metallization |
| 06/17/2008 | US7388288 Flip chip metallization method and devices |
| 06/17/2008 | US7388287 Semiconductor package |
| 06/17/2008 | US7388286 Semiconductor package having enhanced heat dissipation and method of fabricating the same |
| 06/17/2008 | US7388285 Hermetically sealed package for optical, electronic, opto-electronic and other devices |
| 06/17/2008 | US7388284 Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit |
| 06/17/2008 | US7388283 Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
| 06/17/2008 | US7388281 Encapsulated electronic component and production method |
| 06/17/2008 | US7388280 Package stacking lead frame system |
| 06/17/2008 | US7388279 Tapered dielectric and conductor structures and applications thereof |
| 06/17/2008 | US7388277 Chip and wafer integration process using vertical connections |
| 06/17/2008 | US7388275 Electronic package with integrated capacitor |
| 06/17/2008 | US7388272 Chip package and producing method thereof |
| 06/17/2008 | US7388224 Structure for determining thermal cycle reliability |
| 06/17/2008 | US7388192 Image sensing module and process for packaging the same |
| 06/17/2008 | US7387959 Method of fabricating integrated circuitry |
| 06/17/2008 | US7387957 Fabrication process for a semiconductor integrated circuit device |
| 06/17/2008 | US7387950 Method for forming a metal structure |
| 06/17/2008 | US7387948 Structure and method of forming a semiconductor material wafer |
| 06/17/2008 | US7387945 Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same |
| 06/17/2008 | US7387915 Method for manufacturing heat sink of semiconductor device |
| 06/17/2008 | US7387914 Semiconductor device and process for fabrication thereof |
| 06/17/2008 | US7387912 Packaging of electronic chips with air-bridge structures |
| 06/17/2008 | US7387911 Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking |
| 06/17/2008 | US7387910 Method of bonding solder pads of flip-chip package |
| 06/17/2008 | US7387902 Methods for packaging image sensitive electronic devices |
| 06/17/2008 | US7387838 consists essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt % and MgO in a range of 10-25 wt %; high frequency (i.e., gigahertz range) |
| 06/17/2008 | US7387827 Interconnection designs and materials having improved strength and fatigue life |
| 06/17/2008 | US7387741 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |