| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/19/2008 | US20080142957 Three-dimensional package and method of making the same |
| 06/19/2008 | US20080142956 Stress management in BGA packaging |
| 06/19/2008 | US20080142955 Heat-dissipating structure and heat-dissipating semiconductor package having the same |
| 06/19/2008 | US20080142954 Multi-chip package having two or more heat spreaders |
| 06/19/2008 | US20080142953 Semiconductor device |
| 06/19/2008 | US20080142952 Semiconductor package |
| 06/19/2008 | US20080142951 Circuit board structure with embedded semiconductor chip |
| 06/19/2008 | US20080142950 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
| 06/19/2008 | US20080142949 Semiconductor Assembly for Improved Device Warpage and Solder Ball Coplanarity |
| 06/19/2008 | US20080142948 Semiconductor device |
| 06/19/2008 | US20080142947 Chip package and method of manufacturing the same |
| 06/19/2008 | US20080142946 Wafer level package with good cte performance |
| 06/19/2008 | US20080142945 Semiconductor package with redistribution layer of semiconductor chip directly contacted with substrate and method of fabricating the same |
| 06/19/2008 | US20080142944 Stacked package and method for manufacturing the package |
| 06/19/2008 | US20080142943 Integrated circuit package system with thermo-mechanical interlocking substrates |
| 06/19/2008 | US20080142942 Method and apparatus for multi-chip packaging |
| 06/19/2008 | US20080142941 3d electronic packaging structure with enhanced grounding performance and embedded antenna |
| 06/19/2008 | US20080142939 Tools structure for chip redistribution and method of the same |
| 06/19/2008 | US20080142938 Integrated circuit package system employing a support structure with a recess |
| 06/19/2008 | US20080142937 Leadframe on heat sink (lohs) semiconductor packages and fabrication methods thereof |
| 06/19/2008 | US20080142936 Semiconductor device package diepad having features formed by electroplating |
| 06/19/2008 | US20080142935 Lead-Frame Circuit Package |
| 06/19/2008 | US20080142934 Integrated circuit package with elevated edge leadframe |
| 06/19/2008 | US20080142933 Semiconductor Device and Fabricating Method Thereof |
| 06/19/2008 | US20080142932 Semiconductor Device with Plastic Housing Composition and Method for Producing the Same |
| 06/19/2008 | US20080142930 Porous composition of matter, and method of making same |
| 06/19/2008 | US20080142929 Method of producing a porous dielectric element and corresponding dielectric element |
| 06/19/2008 | US20080142928 Semiconductor component with through-vias |
| 06/19/2008 | US20080142927 Scribe-line structures and methods of forming the same |
| 06/19/2008 | US20080142911 Electromagnetic bandgap motion sensor device and method for making same |
| 06/19/2008 | US20080142901 Manufacturing method of semiconductor device |
| 06/19/2008 | US20080142892 Interconnect feature having one or more openings therein and method of manufacture therefor |
| 06/19/2008 | US20080142889 Strapping contact for charge protection |
| 06/19/2008 | US20080142887 Silicon nitride film and semiconductor device, and manufacturing method thereof |
| 06/19/2008 | US20080142847 Semiconductor apparatus having a large-size bus connection |
| 06/19/2008 | US20080142818 Flip chip type LED lighting device manufacturing method |
| 06/19/2008 | US20080142798 Semiconductor wafer |
| 06/19/2008 | US20080142363 Using cell voltage as a monitor for deposition coverage |
| 06/19/2008 | US20080142255 Printed circuit board and method of manufacturing printed circuit board |
| 06/19/2008 | US20080142195 Active condensation enhancement for alternate working fluids |
| 06/19/2008 | DE202008001996U1 Positionierungsvorrichtung für Wärmesenke Positioning device for heat sink |
| 06/19/2008 | DE10229532B4 Kühlvorrichtung für Halbleiterbauelemente A cooling apparatus for semiconductor devices |
| 06/19/2008 | DE102006061386B3 Integrierte Anordnung, ihre Verwendung und Verfahren zu ihrer Herstellung Integrated arrangement, their use and processes for their preparation |
| 06/19/2008 | DE102006058000A1 Blank assembly, particularly for microwave filter, has auxiliary blank, where auxiliary blank with its front side lies on front side of main blank such that each stripline contact is connected on front side of auxiliary blank |
| 06/19/2008 | DE102006057739A1 Electronic component has connecting finger, where section of connecting finger projecting out of covering is protected against atmospheric influences partly by protection unit, and protection unit comprises bitumen |
| 06/19/2008 | DE102006057248A1 Leistungshalbleitermodul The power semiconductor module |
| 06/19/2008 | DE102006037633B4 Halbleiterchip mit Beschädigungs-Detektierschaltung und ein Verfahren zum Herstellen eines Halbleiterchips Semiconductor chip having DAMAGE detecting circuit and a method for producing a semiconductor chip |
| 06/19/2008 | DE102004022177B4 Verfahren zur Herstellung eines Koplanarleitungssystem auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement zur Übertragung von elektromagnetischen Wellen A method for producing a Koplanarleitungssystem on a substrate and produced by such a process component for transmitting electromagnetic waves |
| 06/19/2008 | DE10164666B4 Halbleiterbauelement zum Schutz vor elektrostatischer Entladung Semiconductor device for protection against electrostatic discharge |
| 06/19/2008 | CA2641812A1 Lead-free solder alloy for high-temperature environments |
| 06/18/2008 | EP1933383A2 Silicon carbide diode voltage limiter |
| 06/18/2008 | EP1933380A2 Power semiconductor module with contact springs |
| 06/18/2008 | EP1933379A2 Power semiconductor module with contact springs |
| 06/18/2008 | EP1933377A2 Semiconductor device and method for manufacturing the same |
| 06/18/2008 | EP1933215A1 Manufacturing system, manufacturing method, management device, managing method, and program |
| 06/18/2008 | EP1933085A1 Light-emitting diode cluster lamp |
| 06/18/2008 | EP1932952A1 Method of surface treatment for the inhibition of wiskers |
| 06/18/2008 | EP1932407A2 Electrical module |
| 06/18/2008 | EP1932401A1 Method for fixing a light-emitting diode to a metallic heat-radiating element |
| 06/18/2008 | EP1932177A2 Wafer with scribe lanes comprising active circuits for die testing of complementary signal processing parts |
| 06/18/2008 | EP1932176A2 Wafer with scribe lanes comprising external pads and/or active circuits for die testing |
| 06/18/2008 | EP1932175A2 Die pad for semiconductor packages |
| 06/18/2008 | EP1932173A2 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices |
| 06/18/2008 | EP1931930A2 Spray cooling system for narrow gap transverse evaporative spray cooling |
| 06/18/2008 | EP1222725B1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 06/18/2008 | EP0959498B1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film |
| 06/18/2008 | CN201075572Y Electrostatic protecting device of laser diode |
| 06/18/2008 | CN201075390Y Photoreception crystal plate packaging module |
| 06/18/2008 | CN201075388Y Module assembly and circuit board assembly |
| 06/18/2008 | CN201075387Y Patch type power diode |
| 06/18/2008 | CN201075386Y Holding die set of central processing unit |
| 06/18/2008 | CN201075385Y Semiconductor separating device casing packaging structure |
| 06/18/2008 | CN201075193Y Radiating fin fastening structure for portable computers |
| 06/18/2008 | CN201074794Y Cooling device of LED lamp |
| 06/18/2008 | CN201074791Y High-power integration LED lamp |
| 06/18/2008 | CN201074790Y High-power LED lamp capable of cooling effectively |
| 06/18/2008 | CN201074744Y LED bar-shaped lamp with cooling function |
| 06/18/2008 | CN101203964A White semiconductor light emitting element and its manufacturing method |
| 06/18/2008 | CN101203956A Power supply unit of integrated circuit |
| 06/18/2008 | CN101203955A 电子控制单元及其制造方法 The method of manufacturing an electronic control unit and |
| 06/18/2008 | CN101203126A Dynamic control type electronic equipment dissipating heat method and system |
| 06/18/2008 | CN101203125A Fixed device |
| 06/18/2008 | CN101203124A Radiating assembly |
| 06/18/2008 | CN101203123A Radiating module and heat radiator |
| 06/18/2008 | CN101203122A Dual heat source radiating module |
| 06/18/2008 | CN101203121A Radiating assembly structure |
| 06/18/2008 | CN101203120A Heat radiating device |
| 06/18/2008 | CN101203119A Heat radiating device |
| 06/18/2008 | CN101203118A Heat radiating device |
| 06/18/2008 | CN101203117A Heat radiating device |
| 06/18/2008 | CN101203116A Air tightness cavity and moulding method, heat radiating device using the air tightness cavity |
| 06/18/2008 | CN101203115A Liquid cooling dissipating heat system and heat absorbing element thereof |
| 06/18/2008 | CN101203109A Fastener module and heat radiating device having the same |
| 06/18/2008 | CN101203089A Multilayer printed circuit board |
| 06/18/2008 | CN101202321A Illumination device and display device incorporating the same |
| 06/18/2008 | CN101202318A LED radiating module set |
| 06/18/2008 | CN101202317A LED radiating device combination |
| 06/18/2008 | CN101202313A Ultrafast recovery diode |
| 06/18/2008 | CN101202299A Organic light emitting diode display device and method of manufacturing the same |
| 06/18/2008 | CN101202297A Organic el device and liquid crystal display with peltier element |