| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/25/2008 | CN101207094A 半导体装置 Semiconductor device |
| 06/25/2008 | CN101207093A SiGe relaxation backing material and method for preparing the same |
| 06/25/2008 | CN101207092A 液晶显示器件及其制造方法 The liquid crystal display device and manufacturing method thereof |
| 06/25/2008 | CN101207088A Method for manufacturing bore field extension structure of non-volatile memory |
| 06/25/2008 | CN101207079A Integrated circuit, semiconductor device and manufacturing method thereof |
| 06/25/2008 | CN101207078A Inverted metamorphic solar cell with bypass diode |
| 06/25/2008 | CN101207077A Image sensor and manufacturing method thereof |
| 06/25/2008 | CN101207074A Integrated circuit having a metal element |
| 06/25/2008 | CN101207068A Method for manufacturing of semiconductor device metal connecting hole and semiconductor device |
| 06/25/2008 | CN101207067A Method for manufacturing inlaid structure |
| 06/25/2008 | CN101207055A Gestapelte halbleiterbausteine |
| 06/25/2008 | CN101207054A Method for fabricating a circuit |
| 06/25/2008 | CN101207053A Semiconductor device manufacturing method |
| 06/25/2008 | CN101207050A Light emitting device package and method for manufacturing the same |
| 06/25/2008 | CN101207045A Heat dissipation type semiconductor package part and method for making the same |
| 06/25/2008 | CN101207044A Heat dissipation type semiconductor package part and method for making the same |
| 06/25/2008 | CN101207036A Method for etching throughhole |
| 06/25/2008 | CN101206848A Multicolor field control display |
| 06/25/2008 | CN101206369A Pixels array module group and flat display device |
| 06/25/2008 | CN101206024A Method for LED lamp IC working temperature |
| 06/25/2008 | CN101205444A Adhesive film composition, associated dicing die bonding film, and die package |
| 06/25/2008 | CN101204608A Application of chip assembly LED on photon treatment field |
| 06/25/2008 | CN100397782C Duplexer and electronic equipment using the same duplexer |
| 06/25/2008 | CN100397769C Circuit structure of small inductor |
| 06/25/2008 | CN100397763C Microminiature power converter |
| 06/25/2008 | CN100397742C Voltage limiting protection for high frequency power device |
| 06/25/2008 | CN100397669C LED light source packaging structure for low-temperature coburning ceramic by thermoelectric separating design |
| 06/25/2008 | CN100397664C Optical semiconductor device and method of manufacturing same |
| 06/25/2008 | CN100397658C Semiconductor devices with reduced impact from alien particles |
| 06/25/2008 | CN100397648C MOS type semiconductor device having electrostatic discharge protection arrangement |
| 06/25/2008 | CN100397647C Semiconductor structure and method for ESD protection circuit |
| 06/25/2008 | CN100397645C Integrated circuit having a strengthened passivation structure |
| 06/25/2008 | CN100397641C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/25/2008 | CN100397640C Circuit component built-in module and method for manufacturing the same |
| 06/25/2008 | CN100397639C Structure and method for forming multiple lead line frame semiconductor device |
| 06/25/2008 | CN100397638C Electrostatic discharge protection circuit of power chip |
| 06/25/2008 | CN100397637C Semiconductor device |
| 06/25/2008 | CN100397636C Semiconductor device and its making method |
| 06/25/2008 | CN100397635C Wiring pad with edge reinforcing structure for integrated circuit |
| 06/25/2008 | CN100397634C Semiconductor package including redistribution pattern and method of manufacturing the same |
| 06/25/2008 | CN100397633C Wiring structure for a pad section in a semiconductor device |
| 06/25/2008 | CN100397632C Modular heat sink decoupling capacitor array and printed circuit board assembly |
| 06/25/2008 | CN100397631C Method and apparatus for cooling a portable computer |
| 06/25/2008 | CN100397630C Device and method for package warp compensation in an integrated heat spreader |
| 06/25/2008 | CN100397629C Semiconductor device and method of manufacturing the same |
| 06/25/2008 | CN100397628C Electrical or electronic component and method of producing same |
| 06/25/2008 | CN100397627C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/25/2008 | CN100397626C Resin encapsulated electronic component unit and method of manufacturing the same |
| 06/25/2008 | CN100397625C 半导体装置 Semiconductor device |
| 06/25/2008 | CN100397624C Wiring circuit board |
| 06/25/2008 | CN100397623C 半导体芯片侧接触方法 The semiconductor chip side contact method |
| 06/25/2008 | CN100397613C Multiple thickness semiconductor interconnect and method for manufacturing the same |
| 06/25/2008 | CN100397612C Use of conductive electrolessly deposited etch stop layers, liner layers, and via plugs in interconnect structures |
| 06/25/2008 | CN100397609C Focusing ion beam modifying integrated circuit method and integrated circuit |
| 06/25/2008 | CN100397606C Method for detecting IC on-line defect and making process monitor circuit structure |
| 06/25/2008 | CN100397602C Semiconductor copper bond pad surface protection |
| 06/25/2008 | CN100397601C Method for manufacturing semiconductor device and semiconductor device |
| 06/25/2008 | CN100397600C Transistor modular assembling method and its equipment |
| 06/25/2008 | CN100397599C Lead frame making method, semiconductor device making method and semiconductor device |
| 06/25/2008 | CN100397593C Method for the production of structured layers on substrates |
| 06/25/2008 | CN100397564C Wafer laser marker method |
| 06/25/2008 | CN100397525C Wired circuit board |
| 06/25/2008 | CN100397294C Electronic apparatus including printed wiring board provided with heat generating component |
| 06/24/2008 | US7391637 Semiconductor memory device with high permeability composite films to reduce noise in high speed interconnects |
| 06/24/2008 | US7391618 Electronic component unit |
| 06/24/2008 | US7391616 Plasma display device |
| 06/24/2008 | US7391611 Heat-dissipating device and a housing thereof |
| 06/24/2008 | US7391292 Inductors having interconnect and inductor portions to provide combined magnetic fields |
| 06/24/2008 | US7391143 Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit |
| 06/24/2008 | US7391142 Acoustic resonator support, acoustic resonator and corresponding integrated circuit |
| 06/24/2008 | US7391122 Techniques for flip chip package migration |
| 06/24/2008 | US7391121 Semiconductor device with a number of bonding leads and method for producing the same |
| 06/24/2008 | US7391120 Increasing the adhesion of an adhesive connection in housings |
| 06/24/2008 | US7391118 Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same |
| 06/24/2008 | US7391117 Method for fabricating semiconductor components with conductive spring contacts |
| 06/24/2008 | US7391116 Fretting and whisker resistant coating system and method |
| 06/24/2008 | US7391115 Semiconductor device and manufacturing method thereof |
| 06/24/2008 | US7391114 Electrode pad section for external connection |
| 06/24/2008 | US7391113 Semiconductor device |
| 06/24/2008 | US7391112 Capping copper bumps |
| 06/24/2008 | US7391111 Systems and methods for maintaining performance at a reduced power |
| 06/24/2008 | US7391110 Apparatus for providing capacitive decoupling between on-die power and ground conductors |
| 06/24/2008 | US7391108 Package of solid-state imaging device |
| 06/24/2008 | US7391107 Signal routing on redistribution layer |
| 06/24/2008 | US7391106 Stack type package |
| 06/24/2008 | US7391105 Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same |
| 06/24/2008 | US7391104 Non-stick detection method and mechanism for array molded laminate packages |
| 06/24/2008 | US7391103 Electronic module having plug contacts and method for producing it |
| 06/24/2008 | US7391102 Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
| 06/24/2008 | US7391101 Semiconductor pressure sensor |
| 06/24/2008 | US7391100 Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
| 06/24/2008 | US7391099 Optical modulator module |
| 06/24/2008 | US7391094 Semiconductor structure and method of making same |
| 06/24/2008 | US7391092 Integrated circuit including a temperature monitor element and thermal conducting layer |
| 06/24/2008 | US7391083 Semiconductor device and a method of manufacturing the same |
| 06/24/2008 | US7391082 Semiconductor integrated circuit having resistor |
| 06/24/2008 | US7391069 Semiconductor device and manufacturing method thereof |
| 06/24/2008 | US7391061 Light emitting diode with thermal spreading layer |
| 06/24/2008 | US7391053 Inspection substrate for display device |
| 06/24/2008 | US7391002 Solid state imaging device having electromagnetic wave absorber attached to a mounting board |