| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/26/2008 | DE102006058694A1 Leistungshalbleitermodul mit Kontaktfedern Power semiconductor module with contact springs |
| 06/26/2008 | DE102006058692A1 Leistungshalbleitermodul mit Kontaktfedern Power semiconductor module with contact springs |
| 06/26/2008 | DE102006058010A1 Halbleiterbauelement mit Hohlraumstruktur und Herstellungsverfahren A semiconductor device structure and manufacturing method with cavity |
| 06/26/2008 | DE102006001601B4 Verfahren zur Herstellung eines Halbleiterwafers mit Rückseitenidentifizierung A method for producing a semiconductor wafer having back identification |
| 06/26/2008 | DE102005049248B4 Gehäuster DRAM-Chip für Hochgeschwindigkeitsanwendungen Of packaged DRAM chip for high-speed applications |
| 06/26/2008 | DE102005024945B4 Integrierte Halbleiterschaltungsanordnung sowie Verfahren zu deren Herstellung A semiconductor integrated circuit device and to methods for their preparation |
| 06/26/2008 | DE102004061307B4 Halbleiterbauteil mit Passivierungsschicht A semiconductor device comprising passivating |
| 06/26/2008 | DE102004051039B4 Leistungshalbleitermodul mit Druckkontakteinrichtung Power semiconductor module with a pressure-contact means |
| 06/25/2008 | EP1937047A1 Flexible heat cable device |
| 06/25/2008 | EP1937043A1 Method for producing high dielectric sheet |
| 06/25/2008 | EP1936686A2 Semiconductor Device, Method for Manufacturing the same, and Method for Mounting the same |
| 06/25/2008 | EP1936685A2 Semiconductor device |
| 06/25/2008 | EP1936684A1 Electronic device with a base plate |
| 06/25/2008 | EP1936683A1 Base plate for a heat sink and electronic device with a base plate |
| 06/25/2008 | EP1936682A1 Printed wiring board |
| 06/25/2008 | EP1936680A2 Interconnection element based on carbon nanotubes |
| 06/25/2008 | EP1936677A2 Wiring structure of printed wiring board and method for manufacturing the same |
| 06/25/2008 | EP1936676A2 Method of mounting electronic components, method of manufacturing an electronic component-embedded substrate, and electronic component-embedded substrate |
| 06/25/2008 | EP1936675A2 Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate |
| 06/25/2008 | EP1936259A1 Mounting system for mounting LEDs in the casing of a lamp unit or vehicle headlamp |
| 06/25/2008 | EP1935921A1 Member for semiconductor light emitting device and method for manufacturing such member, and semiconductor light emitting device using such member |
| 06/25/2008 | EP1935017A2 Fine-pitch routing in a lead frame based system-in-package (sip) device |
| 06/25/2008 | EP1935015A1 Semiconductor device |
| 06/25/2008 | EP1934995A1 A contact element and a contact arrangement |
| 06/25/2008 | EP1741137B1 Heat sink made from a diamond/copper composite material containing boron |
| 06/25/2008 | EP1687850A4 Crack stop for low k dielectrics |
| 06/25/2008 | EP1676297A4 HIGH PERFORMANCE STRESS-ENHANCED MOSFETs USING Si:C AND SiGe EPITAXIAL SOURCE/DRAIN AND METHOD OF MANUFACTURE |
| 06/25/2008 | EP1497864B1 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
| 06/25/2008 | EP1114448B1 A method of manufacturing a semiconductor device |
| 06/25/2008 | CN201078883Y Graphite heat radiating device |
| 06/25/2008 | CN201078803Y Encapsulation structure of electronic component |
| 06/25/2008 | CN201078689Y Radiating module structure |
| 06/25/2008 | CN201078683Y Section bar |
| 06/25/2008 | CN201078682Y Section bar |
| 06/25/2008 | CN201078677Y Upright post type LED heat radiator |
| 06/25/2008 | CN201078676Y LED light fitting with high efficiency and heat sinking |
| 06/25/2008 | CN201078667Y Three primary colors light emitting diode supporting frame |
| 06/25/2008 | CN101208800A Embedding thin film resistors in substrates in power delivery networks |
| 06/25/2008 | CN101208799A Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
| 06/25/2008 | CN101208798A Integrated circuit die containing metal- and particle-filled through-silicon vias |
| 06/25/2008 | CN101208797A Systems for low cost coaxial liquid cooling |
| 06/25/2008 | CN101208796A Heat sink for power module |
| 06/25/2008 | CN101208793A Carbon nanotube interconnect contacts |
| 06/25/2008 | CN101208790A 无铅半导体封装件 Lead-free semiconductor package |
| 06/25/2008 | CN101208788A Semiconductor device having firmly secured heat spreader |
| 06/25/2008 | CN101208752A Nonvolatile memory cell comprising a diode and a resistance-switching material |
| 06/25/2008 | CN101208732A Panel display apparatus |
| 06/25/2008 | CN101208574A Radiator |
| 06/25/2008 | CN101208003A Electronic apparatus cooling structure |
| 06/25/2008 | CN101208002A Heat radiating device and electronic device with heat radiating device |
| 06/25/2008 | CN101208001A Fixing device |
| 06/25/2008 | CN101208000A Heat radiation structure |
| 06/25/2008 | CN101207999A Heat radiation model set |
| 06/25/2008 | CN101207998A Heat conduction plate constitution and assistant tool for removing heat conduction plate |
| 06/25/2008 | CN101207997A Heat radiating device |
| 06/25/2008 | CN101207996A Radiator assembly |
| 06/25/2008 | CN101207995A Heat radiation model set and electronic device adopting the same |
| 06/25/2008 | CN101207989A Fixation structure of heat sinking element |
| 06/25/2008 | CN101207988A Buckling device of radiator |
| 06/25/2008 | CN101207986A Fixed flap and heat radiating device using the same and portable electronic device |
| 06/25/2008 | CN101207971A Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board |
| 06/25/2008 | CN101207970A Electronic component built-in substrate and method of manufacturing electronic component built-in substrate |
| 06/25/2008 | CN101207969A Electronic component built-in substrate and method for manufacturing the same |
| 06/25/2008 | CN101207175A Electronic cooling device and fabrication method thereof |
| 06/25/2008 | CN101207170A LED lead frame and method for manufacturing LED using the lead frame |
| 06/25/2008 | CN101207169A Luminous chip encapsulation body and light source component |
| 06/25/2008 | CN101207149A Phase change random access memory device with transistor, and method for fabricating a memory device |
| 06/25/2008 | CN101207147A Vertical type CMOS iamge sensor and method of manufacturing the same |
| 06/25/2008 | CN101207143A 图像检测器以及放射线检测系统 An image detector and a radiation detection system |
| 06/25/2008 | CN101207140A Array substrate and manufacturing method thereof |
| 06/25/2008 | CN101207139A Appraising device and method using the same |
| 06/25/2008 | CN101207138A Thin film transistor substrate and fabricating method thereof |
| 06/25/2008 | CN101207136A Non-volatile memory device and method of operating the same |
| 06/25/2008 | CN101207134A Disposable programmable non-volatile memory unit, array and method of manufacture |
| 06/25/2008 | CN101207122A SCR antistatic protection structure |
| 06/25/2008 | CN101207121A Esd protection circuit |
| 06/25/2008 | CN101207119A Chip electrostatic protection circuit with CMOS output drive |
| 06/25/2008 | CN101207118A 半导体芯片 Semiconductor chip |
| 06/25/2008 | CN101207117A System grade encapsulation body and fabrication methods thereof |
| 06/25/2008 | CN101207116A Semiconductor package on package having plug-socket type wire connection between packages |
| 06/25/2008 | CN101207115A Semiconductor integrated circuit |
| 06/25/2008 | CN101207114A Semiconductor device and manufacturing method of the same |
| 06/25/2008 | CN101207112A Light emitting diode radiating module and applied display apparatus |
| 06/25/2008 | CN101207111A Potted element |
| 06/25/2008 | CN101207110A Light emitting diode module |
| 06/25/2008 | CN101207109A Wiring structure of printed wiring board and method for forming the same |
| 06/25/2008 | CN101207108A Semiconductor device having a multilayer interconnection structure |
| 06/25/2008 | CN101207107A Semiconductor device and method of manufacturing the same |
| 06/25/2008 | CN101207106A 电路板及其制造方法 The circuit board and its manufacturing method |
| 06/25/2008 | CN101207105A Windowing type ball grid array substrate and semiconductor package |
| 06/25/2008 | CN101207104A Flush type capacitance ultra-low inductance design |
| 06/25/2008 | CN101207103A Semiconductor encapsulated element and method of manufacture thereof |
| 06/25/2008 | CN101207102A High-power diode supporting structure and encapsulation combination |
| 06/25/2008 | CN101207101A Pattern shielding structure for dry etching and method thereof |
| 06/25/2008 | CN101207100A Semiconductor component and manufacturing method thereof |
| 06/25/2008 | CN101207099A Structure of dielectric layers in built-up layers of wafer level package |
| 06/25/2008 | CN101207098A Soldering pad structure in semiconductor apparatus and related method |
| 06/25/2008 | CN101207097A Electrical terminal |
| 06/25/2008 | CN101207096A Semiconductor component with through-vias |
| 06/25/2008 | CN101207095A Encapsulation construction of ball lattice array for preventing glue overflow |