Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2008
07/01/2008US7394157 Integrated circuit and seed layers
07/01/2008US7394156 Semiconductor integrated circuit device and method of producing the same
07/01/2008US7394155 Top and sidewall bridged interconnect structure and method
07/01/2008US7394154 Embedded barrier for dielectric encapsulation
07/01/2008US7394153 Encapsulation of electronic devices
07/01/2008US7394151 Semiconductor package with plated connection
07/01/2008US7394150 Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
07/01/2008US7394149 Thin multichip flex-module
07/01/2008US7394148 Module having stacked chip scale semiconductor packages
07/01/2008US7394147 Semiconductor package
07/01/2008US7394146 MOSFET package
07/01/2008US7394134 Semiconductor device with electrostatic discharge protection
07/01/2008US7394132 Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection
07/01/2008US7394125 Recessed channel with separated ONO memory device
07/01/2008US7394110 Planar vertical resistor and bond pad resistor
07/01/2008US7394029 Module, method of manufacturing module, and electronic apparatus using module
07/01/2008US7394026 Multilayer wiring board
07/01/2008US7393778 Semiconductor device and method for fabricating the same
07/01/2008US7393776 Method of forming closed air gap interconnects and structures formed thereby
07/01/2008US7393775 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor
07/01/2008US7393772 Wirebond structure and method to connect to a microelectronic die
07/01/2008US7393770 Backside method for fabricating semiconductor components with conductive interconnects
07/01/2008US7393759 Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device
07/01/2008US7393755 Dummy fill for integrated circuits
07/01/2008US7393754 Tape carrier type semiconductor device and method of producing the same
07/01/2008US7393749 Charge balance field effect transistor
07/01/2008US7393731 Semiconductor device and method of manufacturing the same
07/01/2008US7393721 Semiconductor chip with metallization levels, and a method for formation in interconnect structures
07/01/2008US7393719 Increased stand-off height integrated circuit assemblies, systems, and methods
07/01/2008US7393718 Unmolded package for a semiconductor device
07/01/2008US7393712 Fluidic MEMS device
07/01/2008US7393711 Method of producing a digital fingerprint sensor and the corresponding sensor
07/01/2008US7393706 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
07/01/2008US7393619 Method and lithographic structure for measuring lengths of lines and spaces
07/01/2008US7393596 Aluminum/ceramic bonding substrate and method for producing same
07/01/2008US7393489 Mold die for molding chip array, molding equipment including the same, and method for molding chip array
07/01/2008US7393471 Silicone rubber connector suitable for use in electrically inspecting integrated circuits having conductive parts extending in a thickness-wise direction insulated from one another, and a diamond-like carbon film covering one or both sides; surface resistivity 1x108 to 1x1014 Omega/squ.; 1-500 nm thick
07/01/2008US7393419 Conductive adhesive rework method
06/2008
06/26/2008WO2008076955A2 Microball mounting method and mounting device
06/26/2008WO2008076428A1 Chip capacitor embedded pwb
06/26/2008WO2008076080A2 A clamping assembly
06/26/2008WO2008075908A1 Method of manufacturing semiconductor package
06/26/2008WO2008075655A1 Lead frame fixing material
06/26/2008WO2008075654A1 Lead frame, method for manufacturing the lead frame, and semiconductor device having the lead frame mounted thereon
06/26/2008WO2008075574A1 Radiating material
06/26/2008WO2008075537A1 Electrode structure and method for forming bump
06/26/2008WO2008075452A1 Heat exchanger for use in cooling of semiconductor element and method for manufacturing the same
06/26/2008WO2008075409A1 Base for power module, method for producing base for power module and power module
06/26/2008WO2008075401A1 Board structure, process for manufacturing circuit board, method of inspecting circuit board and electronic equipment
06/26/2008WO2008075328A1 A method of fabricating heat sinks and heat exchangers
06/26/2008WO2008075315A2 Brazed flip-chip mounting of integrated circuits
06/26/2008WO2008075245A2 Pulsating fluid cooling with frequency control
06/26/2008WO2008075223A2 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
06/26/2008WO2008074672A1 Improving adhesion of diffusion barrier on cu containing interconnect element
06/26/2008WO2008074446A1 Semiconductor component
06/26/2008WO2008074185A1 Integrated circuit package and its manufacturing method, memory system
06/26/2008WO2008074164A1 Semiconductor module
06/26/2008WO2008057770A3 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
06/26/2008WO2008055579A3 Chip module for an rfid system
06/26/2008WO2008054680A3 A metallization layer stack without a terminal aluminum metal layer
06/26/2008WO2008044717A3 Cooling apparatus and electronic device comprising same
06/26/2008WO2008043934A3 Method for individually marking integrated circuits and integrated circuit marked according to said method
06/26/2008WO2008042304A3 Interconnect structure using through wafer vias and method of fabrication
06/26/2008WO2008036568A3 An integrated circuit micro-cooler having multi-layers of tubes of a cnt array
06/26/2008WO2008032150A3 Simultaneous bidirectional cable interface
06/26/2008WO2007139852A9 Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
06/26/2008WO2006039669A3 E-fuse with reverse bias p-n junction
06/26/2008US20080154365 Method for integrating pre-fabricated chip structures into functional electronic systems
06/26/2008US20080153250 Method and structures for indexing dice
06/26/2008US20080153211 Insulated power semiconductor module with reduced partial discharge and manufacturing method
06/26/2008US20080153210 Electronic assembly having an indium wetting layer on a thermally conductive body
06/26/2008US20080153209 Thinned die integrated circuit package
06/26/2008US20080153204 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
06/26/2008US20080153012 Method of measuring the overlay accuracy of a multi-exposure process
06/26/2008US20080151590 Method and apparatus for protection against process-induced charging
06/26/2008US20080151522 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
06/26/2008US20080151521 Circuit board with improved ground plane
06/26/2008US20080151520 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
06/26/2008US20080151519 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
06/26/2008US20080151517 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
06/26/2008US20080151498 Heat-Radiating Device with a Guide Structure
06/26/2008US20080151486 Accessible electronic storage apparatus
06/26/2008US20080150834 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
06/26/2008US20080150170 Capillary-flow underfill compositions, packages containing same, and systems containing same
06/26/2008US20080150169 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
06/26/2008US20080150168 Information storage medium on which is stored an interconnection program, interconnection method, interconnection apparatus, and semiconductor device
06/26/2008US20080150167 Semiconductor package and method of manufacturing the same
06/26/2008US20080150166 Method for forming metal wiring in semiconductor device
06/26/2008US20080150165 Selective processing of semiconductor nanowires by polarized visible radiation
06/26/2008US20080150164 Carrier structure embedded with semiconductor chips and method for manufacturing the same
06/26/2008US20080150163 Mounting structure for semiconductor element
06/26/2008US20080150162 Semiconductor device
06/26/2008US20080150161 Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process
06/26/2008US20080150160 Dicing technique for flip-chip usp wafers
06/26/2008US20080150159 Semiconductor Package with Perforated Substrate
06/26/2008US20080150158 Integrated circuit package system with offset stacked die
06/26/2008US20080150157 Semiconductor device and manufacturing method of the same
06/26/2008US20080150156 Stacked die package with stud spacers
06/26/2008US20080150155 Stacked-die packages with silicon vias and surface activated bonding
06/26/2008US20080150154 Method for fabricating a circuit
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