| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/02/2008 | CN101211898A Packaging structure for electrostatic protection, electromagnetic isolation and antioxidation and method of manufacture |
| 07/02/2008 | CN101211897A Multi-chip semiconductor packaging structure and encapsulation method |
| 07/02/2008 | CN101211896A Image sensing module |
| 07/02/2008 | CN101211895A Structure for supervising memory array unit interval and the method |
| 07/02/2008 | CN101211894A TEG pattern and semiconductor device test method using same |
| 07/02/2008 | CN101211893A Semiconductor device and fabrication method thereof |
| 07/02/2008 | CN101211892A Multi-layer metal wiring of semiconductor device and method for forming the same |
| 07/02/2008 | CN101211891A Connection structure, electro-optical device, and method for production of electro-optical device |
| 07/02/2008 | CN101211890A Metal line of semiconductor device and method of manufacturing the same |
| 07/02/2008 | CN101211889A Semiconductor module |
| 07/02/2008 | CN101211888A Wiring substrate, manufacturing method thereof, and semiconductor device |
| 07/02/2008 | CN101211887A Lead wire frame |
| 07/02/2008 | CN101211886A Outer pin-free wire holder packaging structure |
| 07/02/2008 | CN101211885A Braze welding joint, electronic component, semiconductor device and method for manufacturing electronic component |
| 07/02/2008 | CN101211884A Chip packaging structure and method of manufacture |
| 07/02/2008 | CN101211883A 芯片封装结构 Chip package structure |
| 07/02/2008 | CN101211882A Printed circuit board and element module packaging structure and encapsulation method |
| 07/02/2008 | CN101211881A Semiconductor chip packaging structure and encapsulation method |
| 07/02/2008 | CN101211880A Connection device between packaging substrate and chip thereon |
| 07/02/2008 | CN101211879A Signal transmission structure |
| 07/02/2008 | CN101211878A Interconnection structure and its forming method |
| 07/02/2008 | CN101211877A 半导体装置 Semiconductor device |
| 07/02/2008 | CN101211876A 半导体装置 Semiconductor device |
| 07/02/2008 | CN101211875A Wafer metal lead wire and its manufacture method |
| 07/02/2008 | CN101211874A Structure of super thin chip scale package and method of the same |
| 07/02/2008 | CN101211873A Package for semiconductor device and packaging method thereof |
| 07/02/2008 | CN101211872A Radiation-type semiconductor package member and its used radiation structure |
| 07/02/2008 | CN101211871A Data memory heat radiating device |
| 07/02/2008 | CN101211870A Radiating module and its fixation structure |
| 07/02/2008 | CN101211869A Radiating module and its heat conduction pipe |
| 07/02/2008 | CN101211868A Packaging structure suitable for leadless technology |
| 07/02/2008 | CN101211867A Near substrate size adhesive crystal integrated circuit wafer packaging structure |
| 07/02/2008 | CN101211866A Silicon based compliant substrate material for zinc oxide epitaxial film growth |
| 07/02/2008 | CN101211864A Liquid crystal display device and its manufacture method |
| 07/02/2008 | CN101211863A Liquid crystal display device and its manufacture method |
| 07/02/2008 | CN101211862A Transflective liquid crystal display device and fabrication method thereof |
| 07/02/2008 | CN101211859A Method of fabricating flash memory device |
| 07/02/2008 | CN101211856A Method of manufacturing semiconductor device |
| 07/02/2008 | CN101211845A Semiconductor fabrication process for manufacturing adjacent contact body and semiconductor apparatus |
| 07/02/2008 | CN101211826A Semiconductor component and method of manufacture |
| 07/02/2008 | CN101211824A Method for forming metal interconnection of semiconductor device and semiconductor device |
| 07/02/2008 | CN101211822A Semiconductor device having a metal interconnection and method of fabricating the same |
| 07/02/2008 | CN101211819A Semiconductor device metal connection hole preparation method |
| 07/02/2008 | CN101211800A Method for preventing water vapor and mobile ion entering into internal circuit and corresponding bonding window |
| 07/02/2008 | CN101211794A Method for manufacturing a leadframe, packaging method for semiconductor element and semiconductor package product |
| 07/02/2008 | CN101211793A Chip grade packaging structure and its method for making |
| 07/02/2008 | CN101211792A Semi-conductor package and its manufacture method and stacking structure |
| 07/02/2008 | CN101211791A Wafer-grade chip packaging process and chip packaging structure |
| 07/02/2008 | CN101211790A Multi-layer substrates mutual coupling structure manufacture method and the mutual coupling structure |
| 07/02/2008 | CN101211776A Pmd layer of semiconductor device |
| 07/02/2008 | CN101211073A Substrate circuit connected structure and its detection method |
| 07/02/2008 | CN101210845A Semiconductor device and electronic device using the same |
| 07/02/2008 | CN101210785A Bionic power drive type heat pipe radiator |
| 07/02/2008 | CN101210670A Open type multilayer composite LED heat radiation system |
| 07/02/2008 | CN100399589C Wafer with highly efficient heat radiation and brightness |
| 07/02/2008 | CN100399569C Picture element structure and liquid crystal display and manufacturing method thereof |
| 07/02/2008 | CN100399564C Integrated circuit structure with welding pad on top of active circuit |
| 07/02/2008 | CN100399563C Semiconductor component |
| 07/02/2008 | CN100399562C Power supply wiring structure |
| 07/02/2008 | CN100399561C Semiconductor device and method of manufacturing the same |
| 07/02/2008 | CN100399560C IC structure and its forming method |
| 07/02/2008 | CN100399559C Microelectrode short-circuit-proof squeegee structure |
| 07/02/2008 | CN100399558C Semiconductor device and manufacturing method of the same |
| 07/02/2008 | CN100399557C Flexible base palte in use for packing semiconductor, and onload packaging structure |
| 07/02/2008 | CN100399556C Cooling assembly comprising micro-jets |
| 07/02/2008 | CN100399555C Heat sink with step fin |
| 07/02/2008 | CN100399554C Fan device with transfer mechanism |
| 07/02/2008 | CN100399553C Heat sink with visible logo |
| 07/02/2008 | CN100399552C Semiconductor element |
| 07/02/2008 | CN100399551C Device mounting board |
| 07/02/2008 | CN100399550C Sensor device and ceramic encapsulation shell for mounting electronic pieces |
| 07/02/2008 | CN100399549C Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| 07/02/2008 | CN100399548C Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
| 07/02/2008 | CN100399547C Flexible wiring board for tape carrier package having improved flame resistance |
| 07/02/2008 | CN100399542C Interconnect structure and method of forming the same |
| 07/02/2008 | CN100399541C Manufacturing method of semiconductor device |
| 07/02/2008 | CN100399526C Method for checking distribution of semiconductor device |
| 07/02/2008 | CN100399524C Electroplated CoWP composite structures as copper barrier layers |
| 07/02/2008 | CN100399520C Semiconductor device having multilevel wiring structure and method for fabricating the same |
| 07/02/2008 | CN100399232C Airflow generating device and electronic apparatus |
| 07/02/2008 | CN100399133C LCD panel protective circuit and LCD |
| 07/02/2008 | CN100398956C Radiating system for electric refrigerator via Internet and its working method |
| 07/02/2008 | CN100398592C Flame-proof agent and flame-proof resin composition comprising same, and its uses |
| 07/01/2008 | US7395518 Back end of line clone test vehicle |
| 07/01/2008 | US7395166 Connector including an integrated circuit powered by a connection to a conductor terminating in the connector |
| 07/01/2008 | US7394665 LSI package provided with interface module and method of mounting the same |
| 07/01/2008 | US7394663 Electronic component built-in module and method of manufacturing the same |
| 07/01/2008 | US7394662 Optimization of the number of power outputs for an integrated circuit |
| 07/01/2008 | US7394659 Apparatus and methods for cooling semiconductor integrated circuit package structures |
| 07/01/2008 | US7394658 Heat sink with twist lock mounting mechanism |
| 07/01/2008 | US7394657 Method of obtaining enhanced localized thermal interface regions by particle stacking |
| 07/01/2008 | US7394656 Heat dissipation device |
| 07/01/2008 | US7394476 Methods and systems for thermal-based laser processing a multi-material device |
| 07/01/2008 | US7394267 Compliant contact pin assembly and card system |
| 07/01/2008 | US7394164 Semiconductor device having bumps in a same row for staggered probing |
| 07/01/2008 | US7394163 Method of mounting semiconductor chip |
| 07/01/2008 | US7394161 Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto |
| 07/01/2008 | US7394160 Printed wires arrangement for in-line memory (IMM) module |
| 07/01/2008 | US7394159 Delamination reduction between vias and conductive pads |
| 07/01/2008 | US7394158 Solderable top metal for SiC device |