Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2008
07/03/2008DE102007050417A1 Leistungsmodul mit einem in sich geschlossenen Kühlungssystem Power module with a self-contained cooling system
07/03/2008DE102006062473A1 Semiconductor device for use in semiconductor component, has chip with active and rear sides, where chip is arranged over one side of substrate, and completely encapsulated with only one material
07/03/2008DE102006062034A1 Chain structure for electromigration testing, has cable segment and another cable segment, which are formed in metallization layer that is formed by semiconductor substrate
07/03/2008DE102006061586A1 Verbindungsnetzwerk zwischen Halbleiterstrukturen Interconnection network between semiconductor structures
07/03/2008DE102006060770A1 Herstellungsverfahren für eine integrierte Halbleiterstruktur und entsprechende Halbleiterstruktur Manufacturing method of an integrated semiconductor structure and corresponding semiconductor structure
07/03/2008DE102006019244B4 Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung desselben The same benefits and semiconductor component of a composite plate with semiconductor chips and plastic housing composition and methods of making
07/03/2008DE102005007333B4 Mehrchip-Gehäuse mit seriellen Hochgeschwindigkeitskommunikationen zwischen Halbleiterformen Multi-chip package with high-speed serial communications between semiconductor forms
07/03/2008DE102004021927B4 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul A process for the inner electrical insulation of a substrate for a power semiconductor module
07/02/2008EP1939986A2 Local wireless communications within a device
07/02/2008EP1939980A1 Adjustable integrated circuit antenna structure
07/02/2008EP1939979A1 An integrated circuit antenna structure
07/02/2008EP1939975A1 Integrated circuit/printed circuit board substrate structure and communications
07/02/2008EP1939939A2 A lamp and method of producing a lamp
07/02/2008EP1939938A2 Semiconductor device, method of fabricating the same and copper leads
07/02/2008EP1939937A2 Bidirectional switch module
07/02/2008EP1939936A2 Electronic component
07/02/2008EP1939935A2 Indium Compositions
07/02/2008EP1939929A1 Solder layer, heat sink using such solder layer and method for manufacturing such heat sink
07/02/2008EP1938383A1 Integrated circuit mounting for thermal stress relief useable in a multi-chip module
07/02/2008EP1938382A2 High current semiconductor device system having low resistance and inductance
07/02/2008EP1938377A1 Monolithically integrable circuit arrangement
07/02/2008EP1938375A2 Leadframes for improved moisture reliability of semiconductor devices
07/02/2008EP1938373A2 Ic component comprising a cooling arrangement
07/02/2008EP1938372A1 Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
07/02/2008EP1938369A2 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures
07/02/2008EP1661160A4 Supercritical fluid-assisted deposition of materials on semiconductor substrates
07/02/2008CN201081880Y Heat sink and heat radiation device with the same
07/02/2008CN201081879Y Heat radiation fin device
07/02/2008CN201081815Y Porcelain insulator encapsulation shell for electronic component
07/02/2008CN201081209Y High power profile LED projection lamp
07/02/2008CN201081205Y Steam-chamber heat dissipation structure for high power LED street lamp
07/02/2008CN201081170Y Bake-free encapsulated high-efficiency high-heat dissipation performance high-power LED light source
07/02/2008CN201081166Y Multiple-channel heat radiating high power LED device
07/02/2008CN101213891A Ceramic electronic component and method for manufacturing the same
07/02/2008CN101213890A Multilayer circuit board and manufacturing method thereof
07/02/2008CN101213677A Housing body and method for production thereof
07/02/2008CN101213665A Electronic device
07/02/2008CN101213664A Wire bonded semiconductor device having low inductance and noise
07/02/2008CN101213663A Semiconductor die package and method for making the same
07/02/2008CN101213662A Die package with asymmetric leadframe connection
07/02/2008CN101213661A Package, subassembly and methods of manufacturing thereof
07/02/2008CN101213660A Heat exchange enhancement
07/02/2008CN101213659A 热交换增强 Heat exchange enhancement
07/02/2008CN101213658A Semiconductor device and semiconductor device assembly
07/02/2008CN101213657A Epoxy bleedout-preventing agent
07/02/2008CN101213656A Semiconductor device with reduced metal layer stress
07/02/2008CN101213076A Solder joints for copper metallization having reduced interfacial voids
07/02/2008CN101212892A Plug-in unit and electronic apparatus
07/02/2008CN101212891A Heat sink fan
07/02/2008CN101212889A Heat radiator
07/02/2008CN101212888A Bionic power driven radiator that simulates cardiac structure
07/02/2008CN101212887A Heat radiator
07/02/2008CN101212886A Heat radiator
07/02/2008CN101212885A Heat radiation module
07/02/2008CN101212884A Heat radiator
07/02/2008CN101212883A Heat radiator combination
07/02/2008CN101212881A Heat radiator
07/02/2008CN101212880A Heat radiator
07/02/2008CN101212864A Inter-connecting structure between multi-layer base board and producing method
07/02/2008CN101212863A Flexible printed wiring board and semiconductor device
07/02/2008CN101212126A Heat spreader and semiconductor device using the same
07/02/2008CN101212014A Light emitting diode
07/02/2008CN101212007A Electroluminescent module
07/02/2008CN101212005A Luminous diode lead wire holder
07/02/2008CN101211998A Luminous diode and heat radiating device combination
07/02/2008CN101211997A Luminous diode and heat radiating device combination
07/02/2008CN101211996A LED module group
07/02/2008CN101211989A Silicon based compliant substrate material possessing thin hafnium nitride compliant layer
07/02/2008CN101211971A Semiconductor device and producing method thereof
07/02/2008CN101211970A Semiconductor device and producing method thereof
07/02/2008CN101211968A Manufacture method for thyristor for electro-static discharge
07/02/2008CN101211963A Organic light emitting display and fabricating method thereof
07/02/2008CN101211956A CMOS image sensor and manufacturing method thereof
07/02/2008CN101211955A Image sensor and method for manufacturing the same
07/02/2008CN101211952A CMOS image sensor and its manufacture method
07/02/2008CN101211945A Semiconductor image element package structure with die receiving through-hole and method of the same
07/02/2008CN101211942A CMOS image sensor and method of manufacturing thereof
07/02/2008CN101211939A CMOS-device and manufacture method of the cmos device
07/02/2008CN101211938A Image sensor and method for manufacturing the same
07/02/2008CN101211932A Image sensing subassembly wafer-grade packaging structure
07/02/2008CN101211931A Semiconductor device and electronic device
07/02/2008CN101211930A Thin film transistor array substrate and method of manufacturing the same
07/02/2008CN101211929A Thin film transistor substrate and its producing method
07/02/2008CN101211928A Nonvolatile memory device and method for fabricating the same
07/02/2008CN101211923A Structure of semiconductor device for decreasing chip area and manufacturing method thereof
07/02/2008CN101211915A Semiconductor capacitor and manufacturing method
07/02/2008CN101211914A Spiral inductor
07/02/2008CN101211913A Semiconductor device and method of fabricating the same
07/02/2008CN101211911A Semiconductor integrated circuit
07/02/2008CN101211910A Device for protecting semiconductor ic
07/02/2008CN101211909A ESD protection circuit
07/02/2008CN101211908A Discharging unit for enhancing protection circuit over current capability and its manufacture method
07/02/2008CN101211906A Packaged chip structure
07/02/2008CN101211905A Press-loading valve stack for large power all-controlled semiconductor device
07/02/2008CN101211904A Bidirectional switch module
07/02/2008CN101211903A RF module package structure and its forming method
07/02/2008CN101211902A 半导体装置 Semiconductor device
07/02/2008CN101211901A Electronic component contained substrate
07/02/2008CN101211900A Electronic component contained substrate
07/02/2008CN101211899A Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same