| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/10/2014 | US20140191407 Dielectric posts in metal layers |
| 07/10/2014 | US20140191406 Manufacturing method for semiconductor package, semiconductor package, and semiconductor device |
| 07/10/2014 | US20140191405 Method of forming patterns for semiconductor device |
| 07/10/2014 | US20140191404 Local interconnect structure and fabrication method |
| 07/10/2014 | US20140191403 Multi-die semiconductor package and method of manufacturing thereof |
| 07/10/2014 | US20140191402 Barrier Layer for Copper Interconnect |
| 07/10/2014 | US20140191401 Airgap interconnect with hood layer and method of formiing |
| 07/10/2014 | US20140191400 Semiconductor Devices and Methods of Manufacture Thereof |
| 07/10/2014 | US20140191399 Wiring material and semiconductor module using the same |
| 07/10/2014 | US20140191397 Package substrate and semiconductor package including the same |
| 07/10/2014 | US20140191396 Semiconductor package and method for fabricating base for semiconductor package |
| 07/10/2014 | US20140191395 Forming Interconnect Structures Using Pre-Ink-Printed Sheets |
| 07/10/2014 | US20140191394 Bumps for Chip Scale Packaging |
| 07/10/2014 | US20140191393 Semiconductor package and fabrication method thereof |
| 07/10/2014 | US20140191392 Post-Passivation Interconnect Structure and Methods for Forming the Same |
| 07/10/2014 | US20140191391 Elongated bump structures in package structure |
| 07/10/2014 | US20140191390 Metal Routing Architecture for Integrated Circuits |
| 07/10/2014 | US20140191389 Semiconductor device and method of manufacturing the same |
| 07/10/2014 | US20140191388 3d stacking semiconductor device and manufacturing method thereof |
| 07/10/2014 | US20140191387 Method of fabricating land grid array semiconductor package |
| 07/10/2014 | US20140191386 Semiconductor package and fabrication method thereof |
| 07/10/2014 | US20140191385 Process for Producing a Metal Device Housed in a Closed Housing within an Integrated Circuit, and Corresponding Integrated Circuit |
| 07/10/2014 | US20140191384 Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same |
| 07/10/2014 | US20140191383 Power device and method of packaging same |
| 07/10/2014 | US20140191382 Circuit substrate, method of manufacturing circuit substrate, and electronic component |
| 07/10/2014 | US20140191381 Integrated circuit module with dual leadframe |
| 07/10/2014 | US20140191380 Integrated circuit package and method of making |
| 07/10/2014 | US20140191379 Low-k chip packaging structure |
| 07/10/2014 | US20140191378 Integrated circuit package |
| 07/10/2014 | US20140191377 Integrated circuit package |
| 07/10/2014 | US20140191376 Semiconductor package and fabrication method thereof |
| 07/10/2014 | US20140191360 Esd protection device and method for producing the same |
| 07/10/2014 | US20140191337 Stacked Half-Bridge Package |
| 07/10/2014 | US20140191334 Stacked power semiconductor device using dual lead frame |
| 07/10/2014 | US20140191250 Method for manufacturing semiconductor device, and semiconductor device |
| 07/10/2014 | US20140191248 Semiconductor device |
| 07/10/2014 | US20140191235 Measuring current and resistance using combined diodes/resistor structure to monitor integrated circuit manufacturing process variations |
| 07/10/2014 | US20140191234 Three Dimensional Stacked Structure for Chips |
| 07/10/2014 | US20140190736 Radiation-curable rubber adhesive/sealant |
| 07/10/2014 | US20140190668 Cooling Apparatuses Having A Jet Orifice Surface With Alternating Vapor Guide Channels |
| 07/10/2014 | US20140190665 Modular Jet Impingement Cooling Apparatuses With Exchangeable Jet Plates |
| 07/10/2014 | DE202014005390U1 Doppelschichtiger Lead-Frame Double layered lead frame |
| 07/10/2014 | DE112012004488T5 Niederenergie-Ätzverfahren für eine stickstoffhaltige dielektrische Schicht Lower energy-etching method for a nitrogen-containing dielectric layer |
| 07/10/2014 | DE112012004476T5 Wärmesenken-Befestigungsmodul Heat sink retention module |
| 07/10/2014 | DE112012004167T5 Auf Wafer-Ebene aufgebrachte Wärmesenke To applied heat sink wafer level |
| 07/10/2014 | DE112012004162T5 Bindungsverfahren für Wafer und Struktur der Bindungsstelle For wafer bonding method and structure of the binding site |
| 07/10/2014 | DE112012004106T5 Abgeflachte Substratoroberfläche für ein Bonden eines Substrats Flattened Substratoroberfläche for bonding a substrate |
| 07/10/2014 | DE112012003926T5 Vorrichtung zum Einfüllen von Metall An apparatus for filling with metal |
| 07/10/2014 | DE112012003858T5 Hochpräzise selbstausrichtender Chip zur Ausbildung von eingebetteten Chip aufweisendem Gehäuse High-precision self-aligning chip to the formation of embedded chip-terminated housing |
| 07/10/2014 | DE10346474B4 Sensorbauteil mit einem Sensorchip, Sensorstapel und Verfahren zum Prüfen einer biochemischen Probe Sensor device having a sensor chip, the sensor stack and method of testing a biochemical sample |
| 07/10/2014 | DE102014100196A1 Verfahren zum elektrophoretischen Abscheiden (EPD) eines Films auf einer exponierten leitfähigen Oberfläche und ein elektrisches Bauteil daraus A method of electrophoretic deposition (EPD) of a film on an exposed conductive surface and an electrical component thereof |
| 07/10/2014 | DE102013101222B4 Halbleitervorrichtung und Verfahren für ihre Herstellung Semiconductor device and methods for their preparation |
| 07/10/2014 | DE102013100121A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
| 07/10/2014 | DE102012025495A1 Verfahren zur Herstellung eines Diodenlasermoduls und Diodenlasermodul A process for the preparation of a diode laser module and diode laser module |
| 07/10/2014 | DE102011076235B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 07/10/2014 | DE102009058428B4 Halbleitervorrichtung mit anorganischer Überzugsschicht, integrierter Schaltungschip mit dieser Halbleitervorrichtung und Verfahren zur Herstellung dieser Halbleitervorrichtung A semiconductor device comprising an inorganic coating layer, an integrated circuit chip with the semiconductor device and methods for manufacturing this semiconductor device, |
| 07/10/2014 | DE102009023417B4 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 07/10/2014 | DE102009008504B4 Ein Halbleiterbauelement und Verfahren A semiconductor device and method |
| 07/10/2014 | DE102007032269B4 Verbindungsstruktur und integrierte Schaltung sowie Verfahren zu deren Herstellung And integrated circuit interconnect structure and process for their preparation |
| 07/10/2014 | DE102006062804B4 Isolierender Flächenkörper und Verfahren zu seiner Herstellung und den isolierenden Flächenkörper aufweisendes Leistungsmodul Insulating sheet and method for its preparation and the insulating sheet exhibiting power module |
| 07/10/2014 | DE10048704B4 Verfahren für eine Vorrichtung mit Leistungshalbleitern und Vorrichtung A method for a device with power semiconductors and apparatus |
| 07/09/2014 | EP2752872A1 Semiconductor package with integrated interference shielding and method of manufacture therof |
| 07/09/2014 | EP2752455A1 Resin composition for sealing electrical and electronic parts, method for producing sealed electrical and electronic parts, and sealed electrical and electronic parts |
| 07/09/2014 | EP2752104A2 Enhanced clad metal base plate |
| 07/09/2014 | CN203708731U 间歇式冲击射流分形肋片冷却装置 Intermittent impinging jet cooling device fractal fins |
| 07/09/2014 | CN203708635U 功率器件安装组件 Power device installed components |
| 07/09/2014 | CN203707180U 具有温感功能的陶瓷基板 Ceramic substrate having a temperature sense function |
| 07/09/2014 | CN203707130U 一种集成电路芯片的latch-up保护结构 Latch-up protection structure for an integrated circuit chip |
| 07/09/2014 | CN203707119U 静电防护结构及平板x射线图像探测器 ESD protection structures and flat x-ray image detectors |
| 07/09/2014 | CN203707118U 一种改善半导体芯片封装可靠性的结构 A structure to improve the reliability of a semiconductor chip package |
| 07/09/2014 | CN203707117U 一种高密度集成引线框架 A high-density integrated lead frame |
| 07/09/2014 | CN203707116U 多芯片平铺正装有基岛复合式平脚金属框架结构 Multi-chip tile are equipped base island composite flat foot metal frame structure |
| 07/09/2014 | CN203707115U 单芯片正装无源器件无基岛复合式平脚金属框架结构 Single-chip passive components being installed without base island composite flat foot metal frame structure |
| 07/09/2014 | CN203707114U 一种利用浸锡银铜合金法制作的单芯片封装件 A method of making use of immersion tin-silver-copper alloy law single-chip package |
| 07/09/2014 | CN203707113U 一种能够提高焊接通过率的芯片 Capable of improving the rate of the chip by solder |
| 07/09/2014 | CN203707112U 一种晶体管封装结构 A transistor package structure |
| 07/09/2014 | CN203707111U 具有金属衬底的tl431芯片及其共晶结构 Tl431 chip and eutectic structure having a metal substrate |
| 07/09/2014 | CN203707110U 芯片叠晶藏线结构 Chips stacked crystal structure Tibet line |
| 07/09/2014 | CN203707109U 一种多集成三极管 A multi-integrated transistor |
| 07/09/2014 | CN203707108U 一种硅基圆片级扇出封装结构 A silicon-based fan-out wafer level package structure |
| 07/09/2014 | CN203707107U 一种igbt功率模块冷却装置 One kind igbt power module cooling device |
| 07/09/2014 | CN203707106U 基于铝基板的集成型共晶光源 Based on the aluminum plate integrated eutectic light |
| 07/09/2014 | CN203707105U 功率部件复合散热层及带复合散热层的功率部件 Power components and power dissipation layer composite parts with complex cooling layer |
| 07/09/2014 | CN203707104U 一种射频功率放大器的封装结构 The package structure of a radio-frequency power amplifier |
| 07/09/2014 | CN203697591U 一种高导热石墨复合块 A highly thermally conductive graphite composite block |
| 07/09/2014 | CN103918085A 芯片二极管以及二极管封装件 Chip diode and diode package |
| 07/09/2014 | CN103918076A 半导体模块 Semiconductor Modules |
| 07/09/2014 | CN103918075A 利用空间变化的电荷分布确定间距 Changes in the use of space charge distribution is determined pitch |
| 07/09/2014 | CN103918074A 微型表面安装装置封装 Miniature surface mount device package |
| 07/09/2014 | CN103918073A 半导体装置 Semiconductor device |
| 07/09/2014 | CN103918072A 电源模块冷却 Power module cooling |
| 07/09/2014 | CN103918071A 电子部件、集合基板及电子部件的制造方法 Manufacturing an electronic component, the collective substrate and the electronic component |
| 07/09/2014 | CN103918068A 用于穿过低k布线层来图案化穿板通孔的低k介电保护分隔物 For passing the low-k patterned wiring layer through the board through holes of the low-k dielectric protection partition |
| 07/09/2014 | CN103918067A 半导体模块及其制造方法 The semiconductor module and manufacturing method thereof |
| 07/09/2014 | CN103918062A 用于制造半导体器件的方法 The method for manufacturing a semiconductor device |
| 07/09/2014 | CN103917597A 光半导体密封材料用树脂组合物 Optical semiconductor sealing resin composition material |
| 07/09/2014 | CN103915449A 阵列基板及其制备方法、显示面板及其制备方法 Array substrate and its preparation method, the display panel and its preparation method |
| 07/09/2014 | CN103915440A 可多次编程器件、半导体器件的制作方法 The method can produce multiple programming devices, semiconductor device |
| 07/09/2014 | CN103915438A 具有低接触电阻率的互补金属氧化物半导体及其形成方法 With a low contact resistivity of complementary metal oxide semiconductor and method for forming |
| 07/09/2014 | CN103915436A 一种集成电路用rc触发式esd保护电路 An integrated circuit triggered by rc esd protection circuit |