| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/08/2008 | US7396763 Semiconductor package using flexible film and method of manufacturing the same |
| 07/08/2008 | US7396756 Top layers of metal for high performance IC's |
| 07/08/2008 | US7396753 Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same |
| 07/08/2008 | US7396741 Method for connecting substrate and composite element |
| 07/08/2008 | US7396735 Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same |
| 07/08/2008 | US7396704 Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus |
| 07/08/2008 | US7396702 Module assembly and method for stacked BGA packages |
| 07/08/2008 | US7396700 Method for fabricating thermally enhanced semiconductor device |
| 07/08/2008 | US7396621 Exposure control method and method of manufacturing a semiconductor device |
| 07/08/2008 | US7396480 Method for front end of line fabrication |
| 07/08/2008 | US7396478 Multiple internal seal ring micro-electro-mechanical system vacuum packaging method |
| 07/08/2008 | CA2438242C Thermal interface pad utilizing low melting metal with retention matrix |
| 07/03/2008 | WO2008079794A1 Semiconductor device with metal feature and method of preparation |
| 07/03/2008 | WO2008079662A1 Semiconductor chip shape alteration |
| 07/03/2008 | WO2008079625A1 Method for incorporating existing silicon die into 3d integrated stack |
| 07/03/2008 | WO2008079310A1 Microelectronic assemblies having compliancy and methods therefor |
| 07/03/2008 | WO2008078899A1 Semiconductor package and manufacturing method thereof |
| 07/03/2008 | WO2008078898A1 High frequency module and manufacturing method thereof |
| 07/03/2008 | WO2008078788A1 Heat dissipating substrate and electronic device using the same |
| 07/03/2008 | WO2008078746A1 Semiconductor element mounting structure and semiconductor element mounting method |
| 07/03/2008 | WO2008078737A1 Electronic apparatus cooling device and cooling method |
| 07/03/2008 | WO2008078679A1 Graphite material and method for manufacturing the same |
| 07/03/2008 | WO2008078663A1 Curable silicone composition and electronic component |
| 07/03/2008 | WO2008078649A1 Semiconductor device and method for manufacturing the same |
| 07/03/2008 | WO2008078268A1 Semiconductor component with inertly encapsulated metal surface layers |
| 07/03/2008 | WO2008077659A1 Electrical component |
| 07/03/2008 | WO2008057837A9 Systems and methods to passivate on-die redistribution interconnects |
| 07/03/2008 | WO2008052940A3 Test structure for detection of defect devices with lowered resistance |
| 07/03/2008 | WO2008042478A9 Wide band and radio frequency waveguide and hybrid integration in a silicon package |
| 07/03/2008 | WO2008035270A3 Method of manufacturing a vertical contact in a semiconductor substrate |
| 07/03/2008 | WO2008034814A3 Benzoxazine-containing formulations polymerizable/curable at low temperature |
| 07/03/2008 | WO2008020009A3 Method for picking and placing semiconductor chips and pick-and-place robot |
| 07/03/2008 | WO2008008581A3 An electronics package with an integrated circuit device having post wafer fabrication integrated passive components |
| 07/03/2008 | WO2007081546A3 Clipless and wireless semiconductor die package and method for making the same |
| 07/03/2008 | WO2007079456A3 Substrate and method for mounting silicon device |
| 07/03/2008 | WO2007067998A3 Device and method for assembling a top and bottom exposed packaged semiconductor |
| 07/03/2008 | US20080160682 Semiconductor device having fuse circuit on cell region and method of fabricating the same |
| 07/03/2008 | US20080160681 Manufacture including shield structure |
| 07/03/2008 | US20080160678 Method for fabricating semiconductor package |
| 07/03/2008 | US20080160658 Mold structure for packaging led chips and method thereof |
| 07/03/2008 | US20080158885 Light emitting diode module |
| 07/03/2008 | US20080158846 Chip mount, methods of making same and methods for mounting chips thereon |
| 07/03/2008 | US20080158841 Printed circuit board and method for manufacturing printed circuit board |
| 07/03/2008 | US20080158838 Printed circuit board and method for manufacturing printed circuit board |
| 07/03/2008 | US20080158835 Ic card and semiconductor integrated circuit device package |
| 07/03/2008 | US20080158746 Universal Energy Conditioning Interposer with Circuit Architecture |
| 07/03/2008 | US20080158564 Monitoring a photolithographic process using a scatterometry target |
| 07/03/2008 | US20080157803 Die testing using top surface test pads |
| 07/03/2008 | US20080157800 TEG pattern and method for testing semiconductor device using the same |
| 07/03/2008 | US20080157789 Rotating contact element and methods of fabrication |
| 07/03/2008 | US20080157407 Three dimensional ic device and alignment methods of ic device substrates |
| 07/03/2008 | US20080157406 Recyclable stamp device and recyclable stamp process for wafer bond |
| 07/03/2008 | US20080157405 Chip stack with precision alignment, high yield assembly and thermal conductivity |
| 07/03/2008 | US20080157404 Trench structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
| 07/03/2008 | US20080157403 Semocondutor device having multiple-layer hard mask with opposite stresses and method for fabricating the same |
| 07/03/2008 | US20080157402 Dual molded multi-chip package system |
| 07/03/2008 | US20080157401 Integrated circuit package with top pad |
| 07/03/2008 | US20080157400 Semiconductor module |
| 07/03/2008 | US20080157399 Pmd layer of semiconductor device |
| 07/03/2008 | US20080157398 Semiconductor device package having pseudo chips |
| 07/03/2008 | US20080157397 Flip-chip packages and methods of manufacturing the same |
| 07/03/2008 | US20080157396 Wafer level package with die receiving through-hole and method of the same |
| 07/03/2008 | US20080157395 Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers |
| 07/03/2008 | US20080157394 Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages |
| 07/03/2008 | US20080157393 Semiconductor device |
| 07/03/2008 | US20080157392 Methods of forming stepped bumps and structures formed thereby |
| 07/03/2008 | US20080157391 RF semiconductor devices and methods for fabricating the same |
| 07/03/2008 | US20080157390 Method of forming low-k dielectric layer and structure thereof |
| 07/03/2008 | US20080157389 Semiconductor package and module printed circuit board for mounting the same |
| 07/03/2008 | US20080157388 Semiconductor Device and Fabricating Method Thereof |
| 07/03/2008 | US20080157387 Semiconductor device and method of fabricating the same |
| 07/03/2008 | US20080157386 Semiconductor Device Having Dummy Pattern and the Method for Fabricating the Same |
| 07/03/2008 | US20080157385 IC package with integral vertical passive delay cells |
| 07/03/2008 | US20080157384 Alignment Key of Semiconductor Device and Method of Manufacturing the Same |
| 07/03/2008 | US20080157383 Semiconductor device with gate stack structure |
| 07/03/2008 | US20080157382 Direct termination of a wiring metal in a semiconductor device |
| 07/03/2008 | US20080157381 Semiconductor integrated circuit |
| 07/03/2008 | US20080157380 Method for forming metal interconnection of semiconductor device |
| 07/03/2008 | US20080157379 Semiconductor device having metal wiring and method for fabricating the same |
| 07/03/2008 | US20080157378 Semiconductor device, and method of manufacturing same |
| 07/03/2008 | US20080157377 Semiconductor device and fabricating method thereof |
| 07/03/2008 | US20080157376 Semiconductor Device and Method for Manufacturing the Same |
| 07/03/2008 | US20080157375 Semiconductor device having a metal interconnection and method of fabricating the same |
| 07/03/2008 | US20080157374 Semiconductor device and fabricating method thereof |
| 07/03/2008 | US20080157373 Metal Line of Semiconductor Device and Method of Forming the Same |
| 07/03/2008 | US20080157372 Metal Line of Semiconductor Device and Manufacturing Method Thereof |
| 07/03/2008 | US20080157371 Metal Line of Semiconductor Device and Method of Manufacturing the Same |
| 07/03/2008 | US20080157370 Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same |
| 07/03/2008 | US20080157369 Multi-layered metal line of semiconductor device for preventing diffusion between metal lines and method for forming the same |
| 07/03/2008 | US20080157368 Multi-layered metal line of semiconductor device having excellent diffusion barrier and method for forming the same |
| 07/03/2008 | US20080157367 Multi-layer metal wiring of semiconductor device preventing mutual metal diffusion between metal wirings and method for forming the same |
| 07/03/2008 | US20080157366 Semiconductor device and fabricating method thereof |
| 07/03/2008 | US20080157365 Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate, and method therefor |
| 07/03/2008 | US20080157364 Fan-out, display substrate having the same and method for manufacturing the display substrate |
| 07/03/2008 | US20080157363 Method of forming the nanoscale conductive structure and a semiconductor device formed thereby |
| 07/03/2008 | US20080157362 Method to reduce UBM undercut |
| 07/03/2008 | US20080157361 Semiconductor components having through interconnects and methods of fabrication |
| 07/03/2008 | US20080157360 Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same |
| 07/03/2008 | US20080157359 Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component |
| 07/03/2008 | US20080157358 Wafer level package with die receiving through-hole and method of the same |