| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/03/2008 | US20080157357 Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same |
| 07/03/2008 | US20080157356 Methods of forming stepped bumps and structures formed thereby |
| 07/03/2008 | US20080157355 Semiconductor device having multiple die redistribution layer |
| 07/03/2008 | US20080157353 Control of Standoff Height Between Packages with a Solder-Embedded Tape |
| 07/03/2008 | US20080157352 Reducing underfill keep out zone on substrate used in electronic device processing |
| 07/03/2008 | US20080157351 Semiconductor device fabricating method |
| 07/03/2008 | US20080157350 Package on package design to improve functionality and efficiency |
| 07/03/2008 | US20080157349 IC package having improved structure |
| 07/03/2008 | US20080157348 Thermal interface material with hotspot heat remover |
| 07/03/2008 | US20080157347 Heat spreader and semiconductor device using the same |
| 07/03/2008 | US20080157345 Curved heat spreader design for electronic assemblies |
| 07/03/2008 | US20080157344 Heat dissipation semiconductor pakage |
| 07/03/2008 | US20080157343 Ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages |
| 07/03/2008 | US20080157342 Package with a marking structure and method of the same |
| 07/03/2008 | US20080157341 RF module package |
| 07/03/2008 | US20080157340 RF module package |
| 07/03/2008 | US20080157339 Stacked MEMS Device |
| 07/03/2008 | US20080157338 Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device |
| 07/03/2008 | US20080157337 Semiconductor packaging substrate improving capability of electrostatic dissipation |
| 07/03/2008 | US20080157336 Wafer level package with die receiving through-hole and method of the same |
| 07/03/2008 | US20080157335 Strip patterned transmission line |
| 07/03/2008 | US20080157334 Memory module for improving impact resistance |
| 07/03/2008 | US20080157333 Chip package and manufacturing method thereof |
| 07/03/2008 | US20080157332 Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages |
| 07/03/2008 | US20080157331 Semiconductor device and method of manufacturing the same |
| 07/03/2008 | US20080157330 Semiconductor Device with Chip Mounted on a Substrate |
| 07/03/2008 | US20080157329 Electronic component contained substrate |
| 07/03/2008 | US20080157328 Semiconductor device and method for manufacturing same |
| 07/03/2008 | US20080157327 Package on package structure for semiconductor devices and method of the same |
| 07/03/2008 | US20080157326 Ic package and method of manufacturing the same |
| 07/03/2008 | US20080157325 Integrated circuit package with molded cavity |
| 07/03/2008 | US20080157324 Stacked die package with die interconnects |
| 07/03/2008 | US20080157323 Stacked packages |
| 07/03/2008 | US20080157322 Double side stacked die package |
| 07/03/2008 | US20080157321 Stackable integrated circuit package system with recess |
| 07/03/2008 | US20080157320 Laterally Interconnected IC Packages and Methods |
| 07/03/2008 | US20080157319 Mountable integrated circuit package-in-package system with adhesive spacing structures |
| 07/03/2008 | US20080157318 Bridge stack integrated circuit package-on-package system |
| 07/03/2008 | US20080157317 High capacity memory module using flexible substrate |
| 07/03/2008 | US20080157316 Multi-chips package and method of forming the same |
| 07/03/2008 | US20080157315 Package structures |
| 07/03/2008 | US20080157314 Structure and method for stochastic integrated circuit personalization |
| 07/03/2008 | US20080157312 Semiconductor image device package with die receiving through-hole and method of the same |
| 07/03/2008 | US20080157311 Semiconductor Package Having Leadframe with Exposed Anchor Pads |
| 07/03/2008 | US20080157310 Power device package |
| 07/03/2008 | US20080157309 Lead frame and method of manufacturing the same, and semiconductor device |
| 07/03/2008 | US20080157308 Multi-Die Semiconductor Package Structure and Method for Manufacturing the Same |
| 07/03/2008 | US20080157307 Lead frame |
| 07/03/2008 | US20080157306 Lead Frame |
| 07/03/2008 | US20080157305 Chip package structure |
| 07/03/2008 | US20080157304 Chip package structure |
| 07/03/2008 | US20080157303 Structure of super thin chip scale package and method of the same |
| 07/03/2008 | US20080157302 Stacked-package quad flat null lead package |
| 07/03/2008 | US20080157301 Leadframe package for mems microphone assembly |
| 07/03/2008 | US20080157300 Thermally Enhanced IC Package and Method |
| 07/03/2008 | US20080157299 Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads |
| 07/03/2008 | US20080157298 Stress Mitigation in Packaged Microchips |
| 07/03/2008 | US20080157297 Stress-Resistant Leadframe and Method |
| 07/03/2008 | US20080157296 Package having shield case |
| 07/03/2008 | US20080157295 Methods and apparatus for multichip module packaging |
| 07/03/2008 | US20080157294 Package level noise isolation |
| 07/03/2008 | US20080157293 Semiconductor device and fabrication method thereof |
| 07/03/2008 | US20080157291 Packaging implementation while mitigating threshold voltage shifting |
| 07/03/2008 | US20080157290 Method for fabricating semiconductor device |
| 07/03/2008 | US20080157289 Method to achieve a low cost transistor isolation dielectric process module with improved process control, process cost, and yield potential |
| 07/03/2008 | US20080157288 Semiconductor device and method of fabricating semiconductor device |
| 07/03/2008 | US20080157287 Semiconductor devices and methods of forming the same |
| 07/03/2008 | US20080157286 Semiconductor device having a indicator indicating cleavage direction |
| 07/03/2008 | US20080157285 Semiconductor device and manufacturing method thereof |
| 07/03/2008 | US20080157271 Semiconductor device having antifuse and method of manufacturing the same |
| 07/03/2008 | US20080157268 Fuse Element Using Low-K Dielectric |
| 07/03/2008 | US20080157265 Semiconductor device and method for fabricating the same |
| 07/03/2008 | US20080157260 High-z structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
| 07/03/2008 | US20080157251 Package for semiconductor device and packaging method thereof |
| 07/03/2008 | US20080157250 Sensor module package structure and method of the same |
| 07/03/2008 | US20080157218 Semiconductor device and method of fabricating the same, and nor gate circuit using the semiconductor device |
| 07/03/2008 | US20080157209 Integrated circuits and interconnect structure for integrated circuits |
| 07/03/2008 | US20080157204 Device for protecting semiconductor ic |
| 07/03/2008 | US20080157201 Electrically Programmable Fuse |
| 07/03/2008 | US20080157141 Cmos device and method of manufacturing the same |
| 07/03/2008 | US20080157078 Metrology Structure And Methods |
| 07/03/2008 | US20080157076 Semiconductor device with test pads and pad connection unit |
| 07/03/2008 | US20080157075 Test structure for estimating electromigration effects with increased robustness with respect to barrier defects in vias |
| 07/03/2008 | US20080157074 Method to measure ion beam angle |
| 07/03/2008 | US20080157070 Organic semiconductor element having multi protection layers and process of making the same |
| 07/03/2008 | US20080156522 Anisotropic Electrically Conductive Structure |
| 07/03/2008 | US20080156445 Transfer assembly for manufacturing electronic devices |
| 07/03/2008 | US20080156228 Pigment of nanopowders of vanadium and an additional element; exhibiting transparency to a visible wavelength of light that differs by more than 20%; nanopowders having a domain size of less than 100 nanometers |
| 07/03/2008 | US20080156095 Sensor Device, Sensor System and Methods for Manufacturing Them |
| 07/03/2008 | US20080155820 Wiring substrate, manufacturing method thereof, and semiconductor device |
| 07/03/2008 | DE112006002263T5 Verfahren und Systeme zur Positionierung eines Laserstrahlflecks relativ zu einer integrierten Halbleiterschaltung unter Verwendung eines Bearbeitungsziels als Messtechnikziel Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as objective measurement technique |
| 07/03/2008 | DE10351005B4 Barrierenschicht mit einer Titannitridbeschichtung für eine Kupfermetallisierungsschicht, die ein Dielektrikum mit kleinem ε aufweist Barrier layer with a titanium nitride coating for a copper metallization, comprising a dielectric having a small ε |
| 07/03/2008 | DE10309677B4 Mikroelektromechanisches Bauteil und Verfahren zur Herstellung eines mikroelektromechanischen Bauteils The micro-electro-mechanical component and process for producing a micro-electromechanical component |
| 07/03/2008 | DE10248644B4 Leistungshalbleitermodul The power semiconductor module |
| 07/03/2008 | DE10211729B4 Verfahren zur Herstellung eines elektronischen Halbleiterbauteils A method for producing a semiconductor electronic component |
| 07/03/2008 | DE102008003112A1 Semiconductor packing comprises packing substrate, contact positioning structure of one type, arranged in area of packing substrate, where contact positioning structure of another type is arranged in another area of packing substrate |
| 07/03/2008 | DE102007063342A1 Package structure for semiconductor device e.g. complementary metal oxide semiconductor (CMOS) image sensor has secondary contact pad that is formed at the lower surface of the substrate and under the connecting through hole structure |
| 07/03/2008 | DE102007063301A1 Radio frequency module package structure has substrate with die receiving perforations, conducting contacting connections and metallic perforations, where conducting disk is fixed under surface of substrate |
| 07/03/2008 | DE102007059162A1 Mehrchip-Verpackung und Verfahren zu deren Herstellung A multi-chip packaging and processes for their preparation |
| 07/03/2008 | DE102007051312A1 Device, particularly complimentary metal oxide semiconductor unit, comprises cooling element that is formed on lower substrate and image sensor is formed on cooling element |