| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/09/2008 | CN101217146A A cell design structure of programmable non-volatile memory and the corresponding manufacturing method |
| 07/09/2008 | CN101217144A A deep ditch groove high-power MOS device and the corresponding manufacturing method |
| 07/09/2008 | CN101217142A A bar-shaped LED light source |
| 07/09/2008 | CN101217141A IC package and method of manufacturing the same |
| 07/09/2008 | CN101217139A Packaging structure to reduce noise jamming |
| 07/09/2008 | CN101217138A A measurement construction to enhance the electricity thickness measuring stability of an oxide layer of P trap bar |
| 07/09/2008 | CN101217137A A measurement construction to enhance the electricity thickness measuring accuracy of an oxide layer of P trap bar |
| 07/09/2008 | CN101217136A Wiring structure and method for manufacturing the same |
| 07/09/2008 | CN101217135A Package structure membrane of flip chip package |
| 07/09/2008 | CN101217134A A base plate structure and the corresponding sphere placement method of spheres array sealing |
| 07/09/2008 | CN101217133A Heat transfer apparatus and method therefor |
| 07/09/2008 | CN101217131A Pixel structure and its making method |
| 07/09/2008 | CN101217128A Method for making an integrated circuit having a via hole |
| 07/09/2008 | CN101217120A A sealing method and corresponding device of air tight type chip |
| 07/09/2008 | CN101217118A Methods for fabricating silicon carriers with conductive through-vias and its produced semiconductor |
| 07/09/2008 | CN101216877A Sliding type fingerprint sensing element and its method of preparation |
| 07/09/2008 | CN101216642A Flat-panel display lead wire structure |
| 07/09/2008 | CN101216163A Luminous diode lighting device |
| 07/09/2008 | CN101216156A LED surface light source for all-purpose illumination |
| 07/09/2008 | CN101216151A Large power solid-state illumination street light fitting |
| 07/09/2008 | CN101214149A Preparation method of flexible integration interconnection line for three-dimensional electricity interlinkage |
| 07/09/2008 | CN100401865C Heat spreader for emissive display device |
| 07/09/2008 | CN100401860C A pattern form object and a manufacturing method thereof |
| 07/09/2008 | CN100401600C Semiconductor laser device and optical pickup device having the device |
| 07/09/2008 | CN100401587C Interposer assembly for soldered electrical connections |
| 07/09/2008 | CN100401538C Process for producing optical semiconductor device |
| 07/09/2008 | CN100401534C Lighting device, backligh module, and light resource adjusting method of LED element |
| 07/09/2008 | CN100401522C Method for producing solid-state imaging device |
| 07/09/2008 | CN100401519C Semiconductor device and its manufacturing method |
| 07/09/2008 | CN100401517C 半导体装置 Semiconductor device |
| 07/09/2008 | CN100401515C Semiconductor device with inverted chip packer coating and its production thereof |
| 07/09/2008 | CN100401513C Semiconductor integrated circuit device having an ESD protection unit |
| 07/09/2008 | CN100401512C Electrostatic discharge protection circuit by use of silicon controlled rectifier |
| 07/09/2008 | CN100401511C Integrated circuit design for routing an electrical connection |
| 07/09/2008 | CN100401510C Semiconductor device, semiconductor body and method of manufacturing thereof |
| 07/09/2008 | CN100401509C Lead frame and semiconductor device |
| 07/09/2008 | CN100401508C High-performance passive phase-change radiation system and its application |
| 07/09/2008 | CN100401507C Heat abstractor and heat radiation method |
| 07/09/2008 | CN100401506C Heat sink for ball single array packaged chip and its application |
| 07/09/2008 | CN100401505C Radiating modules |
| 07/09/2008 | CN100401504C High-reliable semiconductor device using hermetic sealing of electrodes |
| 07/09/2008 | CN100401503C Semiconductor device and manufacturing method of the same |
| 07/09/2008 | CN100401502C Semiconductor element with uv protection layer |
| 07/09/2008 | CN100401501C Seal ring structure, semiconductor wafer, and method for reducing stress effect due to cutting |
| 07/09/2008 | CN100401488C Chip module with bond-wire connections with small loop height |
| 07/09/2008 | CN100401486C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/09/2008 | CN100401475C Material deposition from liquefied gas solution |
| 07/09/2008 | CN100401426C One-time programmable storage device using fuse/anti-fuse and vertical-orientation fuse specific storage unite |
| 07/09/2008 | CN100401420C Fuse circuit |
| 07/09/2008 | CN100401353C 半导体装置 Semiconductor device |
| 07/09/2008 | CN100401341C Wiring substrate and electrooptic device and their manufacturing method |
| 07/09/2008 | CN100401222C Electronic apparatus |
| 07/09/2008 | CN100401006C Radiating body containing diamond powder |
| 07/09/2008 | CN100400707C Method for forming ultra low k films using electron beam |
| 07/09/2008 | CN100400616C Thermoconductive composition |
| 07/09/2008 | CN100400614C Solidifiable resin composition for packing electronic equipment |
| 07/09/2008 | CN100400467C Heat sink having a high thermal conductivity, its manufacturing method and use |
| 07/08/2008 | US7398049 Wireless local loop antenna |
| 07/08/2008 | US7397672 Flip chip mounting substrate |
| 07/08/2008 | US7397664 Heatspreader for single-device and multi-device modules |
| 07/08/2008 | US7397662 Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board |
| 07/08/2008 | US7397260 Structure and method for monitoring stress-induced degradation of conductive interconnects |
| 07/08/2008 | US7397140 Chip module |
| 07/08/2008 | US7397139 Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more |
| 07/08/2008 | US7397138 Semiconductor device |
| 07/08/2008 | US7397137 Direct FET device for high frequency application |
| 07/08/2008 | US7397136 Multi-chip module and single-chip module for chips and proximity connectors |
| 07/08/2008 | US7397135 Top layers of metal for high performance IC's |
| 07/08/2008 | US7397134 Semiconductor device mounted on and electrically connected to circuit board |
| 07/08/2008 | US7397133 Submount for diode with single bottom electrode |
| 07/08/2008 | US7397132 Semiconductor device |
| 07/08/2008 | US7397130 Semiconductor devices with contact holes self-aligned in two directions |
| 07/08/2008 | US7397129 Interposers with flexible solder pad elements |
| 07/08/2008 | US7397128 Semiconductor device and method of manufacturing the same |
| 07/08/2008 | US7397127 Bonding and probing pad structures |
| 07/08/2008 | US7397126 Semiconductor device |
| 07/08/2008 | US7397125 Semiconductor device with bonding pad support structure |
| 07/08/2008 | US7397124 Process of metal interconnects |
| 07/08/2008 | US7397123 Semiconductor integrated circuit device and process for manufacturing the same |
| 07/08/2008 | US7397122 Metal wiring for semiconductor device and method for forming the same |
| 07/08/2008 | US7397121 Semiconductor chip with post-passivation scheme formed over passivation layer |
| 07/08/2008 | US7397120 Semiconductor package structure for vertical mount and method |
| 07/08/2008 | US7397119 Wafer-level diamond spreader |
| 07/08/2008 | US7397118 Ceramic chip-type electronic component and method of making the same |
| 07/08/2008 | US7397117 Chip package with die and substrate |
| 07/08/2008 | US7397116 Semiconductor apparatus and production method thereof suitable for electric power devices |
| 07/08/2008 | US7397115 Folding chip planar stack package |
| 07/08/2008 | US7397114 Semiconductor integrated circuit device and method of manufacturing the same |
| 07/08/2008 | US7397113 Semiconductor device |
| 07/08/2008 | US7397112 Semiconductor package and lead frame therefor |
| 07/08/2008 | US7397111 Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component |
| 07/08/2008 | US7397106 Laser fuse with efficient heat dissipation |
| 07/08/2008 | US7397103 Semiconductor with damage detection circuitry |
| 07/08/2008 | US7397097 Integrated released beam layer structure fabricated in trenches and manufacturing method thereof |
| 07/08/2008 | US7397089 ESD protection structure using contact-via chains as ballast resistors |
| 07/08/2008 | US7397088 Electrostatic discharge protection device for radio frequency applications based on an isolated L-NPN device |
| 07/08/2008 | US7397067 Microdisplay packaging system |
| 07/08/2008 | US7397023 Image sensor module with optical path delimiter and accurate alignment |
| 07/08/2008 | US7397001 Multi-strand substrate for ball-grid array assemblies and method |
| 07/08/2008 | US7397000 Wiring board and semiconductor package using the same |