| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/10/2008 | US20080164604 Heat dissipating semiconductor package |
| 07/10/2008 | US20080164603 Method and Apparatus for Providing Thermal Management on High-Power Integrated Circuit Devices |
| 07/10/2008 | US20080164602 Cap package for micro electro-mechanical system capable of minimizing electro-magnetic interference |
| 07/10/2008 | US20080164601 Chip package structure |
| 07/10/2008 | US20080164600 Ball grid array structures having tape-based circuitry |
| 07/10/2008 | US20080164599 Semiconductor module |
| 07/10/2008 | US20080164598 Semiconductor module |
| 07/10/2008 | US20080164597 Plate structure having chip embedded therein and the manufacturing method of the same |
| 07/10/2008 | US20080164596 Semiconductor package, manufacturing method thereof and IC chip |
| 07/10/2008 | US20080164595 Stackable semiconductor package and the method for making the same |
| 07/10/2008 | US20080164594 Cap package for micro electro-mechanical system |
| 07/10/2008 | US20080164593 Method of packaging semiconductor devices |
| 07/10/2008 | US20080164592 Apparatus and method for housing micromechanical systems |
| 07/10/2008 | US20080164591 Microelectronic component assemblies with recessed wire bonds and methods of making same |
| 07/10/2008 | US20080164590 Semiconductor power device |
| 07/10/2008 | US20080164589 Power device package comprising metal tab die attach paddle (dap) and method of fabricating the package |
| 07/10/2008 | US20080164588 High power semiconductor package |
| 07/10/2008 | US20080164587 Molding compound flow controller |
| 07/10/2008 | US20080164586 Thin semiconductor package having stackable lead frame and method of manufacturing the same |
| 07/10/2008 | US20080164585 Semiconductor device |
| 07/10/2008 | US20080164584 Method and structure for reduction of soft error rates in integrated circuits |
| 07/10/2008 | US20080164583 Chip package capable of minimizing electro-magnetic interference |
| 07/10/2008 | US20080164582 Semiconductor devices and methods of manufacture thereof |
| 07/10/2008 | US20080164581 Electronic device and process for manufacturing the same |
| 07/10/2008 | US20080164580 Chemical vapor deposition method for the incorporation of nitrogen into materials including germanium and antimony |
| 07/10/2008 | US20080164574 Integrated circuits with conductive features in through holes passing through other conductive features and through a semiconductor substrate |
| 07/10/2008 | US20080164573 Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density |
| 07/10/2008 | US20080164566 Method for forming a buried digit line with self aligning spacing layer and contact plugs during the formation of a semiconductor device, semiconductor devices, and systems including same |
| 07/10/2008 | US20080164558 Method for fabricating shallow trench isolation structures using diblock copolymer patterning |
| 07/10/2008 | US20080164545 Mems microphone package and method thereof |
| 07/10/2008 | US20080164543 Package, in particular for MEMS devices and method of making same |
| 07/10/2008 | US20080164542 Methods and systems for wafer level packaging of mems structures |
| 07/10/2008 | US20080164540 Method and apparatus for forming nickel silicide with low defect density in fet devices |
| 07/10/2008 | US20080164532 Embedded stressed nitride liners for cmos performance improvement |
| 07/10/2008 | US20080164527 Semiconductor device and method of manufacturing the same |
| 07/10/2008 | US20080164483 Semiconductor Device and Manufacturing Method Thereof, and Liquid Crystal Display Device |
| 07/10/2008 | US20080164480 Fabrication of Semiconductor Devices |
| 07/10/2008 | US20080164469 Semiconductor device with measurement pattern in scribe region |
| 07/10/2008 | US20080164468 Reinforced semiconductor structures |
| 07/10/2008 | DE69738172T2 Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat An integrated circuit on a substrate and a method for ultrabiegsamen a wire connection between a integrated circuit and a substrate ultrabiegsamen |
| 07/10/2008 | DE202008005708U1 Oberflächenmontierbares elektronisches Bauelement Surface mount electronic component |
| 07/10/2008 | DE202008003493U1 Kühlkörper Heat Sink |
| 07/10/2008 | DE19842078B4 Hochohmiges Substratmaterial, Verfahren zu dessen Herstellung sowie Substrat für elektronische Bauteile High-ohmic substrate material, process for its preparation as well as substrate for electronic components |
| 07/10/2008 | DE19549705B4 High-density packaging multi-chip semiconductor module - includes signal transmission substrate with wiring layer for transmitting signals and feeder substrate with containers for accommodating semiconductor bare chips which are bonded to wiring layer |
| 07/10/2008 | DE10222609B4 Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat A process for the production of structured layers on substrates and methods according coated substrate |
| 07/10/2008 | DE102007035897A1 TEG-Muster und Verfahren zum Testen eines Halbleiterbauteils mit demselben TEG pattern and method for testing a semiconductor device with the same |
| 07/10/2008 | DE102007001290A1 Module comprises semiconductor chip with mobile element, where substrate is made of glass or semiconductor material and covers main surface of semiconductor chip, and another substrate is made of glass or semiconductor material |
| 07/10/2008 | DE102007001289A1 Semiconductor module, has semiconductor chip provided with contact area, and dielectric layer applied on semiconductor chip, where dielectric layer includes fluorine-carbon compound e.g. fluorinated hydrocarbon compound |
| 07/10/2008 | DE102007001234A1 Halbleiterbaugruppe zum Anschluss an eine Transformatorwicklung und Transformatoranordnung Semiconductor assembly for connection to a transformer winding and transformer assembly |
| 07/10/2008 | DE102007001233A1 Windungselement für eine Spulenwicklung und Transformatoranordnung Winding element for a coil winding and transformer assembly |
| 07/10/2008 | DE102007001130A1 Verfahren zum Herstellen einer Durchkontaktierung in einer Schicht und Anordnung mit einer Schicht mit Durchkontaktierung A method of manufacturing a via in a layer and with a layer arrangement with through-hole plating |
| 07/10/2008 | DE102006060899A1 Anschlussdraht, Verfahren zur Herstellung eines solchen und Baugruppe Lead wire method for manufacturing such a module and |
| 07/10/2008 | DE102004042367B4 Leistungshalbleitermodul The power semiconductor module |
| 07/10/2008 | DE10040450B4 Halbleiterlaserbauelement mit einem Kühlelement The semiconductor laser device with a cooling element |
| 07/10/2008 | DE10032850B4 Elektrokeramisches Vielschichtbauelement Electric ceramic multilayer component |
| 07/10/2008 | DE10002426B4 Bandträger für Kugelgitteranordnung und Halbleitervorrichtung die diesen verwendet Tape carrier for BGA and semiconductor device uses this |
| 07/09/2008 | EP1942524A2 Flip Chip Shielded RF I/O Land Grid Array Package |
| 07/09/2008 | EP1942523A1 Semiconductor chip and semiconductor chip manufacturing method |
| 07/09/2008 | EP1941546A2 Device comprising an element with electrodes coupled to connections |
| 07/09/2008 | EP1941545A2 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement |
| 07/09/2008 | EP1941544A1 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts |
| 07/09/2008 | EP1941541A2 Redistribution layer for wafer-level chip scale package and method therefor |
| 07/09/2008 | EP1941316A2 Diffusion barrier layer for mems devices |
| 07/09/2008 | EP1743369A4 Micropede stacked die component assembly |
| 07/09/2008 | EP1708258B1 Composite ceramic substrate |
| 07/09/2008 | EP1350269B8 Self-passivating cu laser fuse |
| 07/09/2008 | EP1019963B1 Protective circuit |
| 07/09/2008 | CN201084749Y A LED encapsulation structure with a lens setting device |
| 07/09/2008 | CN201084746Y A low-cost high-power LED encapsulation structure |
| 07/09/2008 | CN201084731Y A two-color chip-type light-emitting diode |
| 07/09/2008 | CN201084730Y LED encapsulation structure |
| 07/09/2008 | CN201084729Y A semiconductor encapsulation substrate |
| 07/09/2008 | CN201084728Y A semiconductor leader framework |
| 07/09/2008 | CN201084727Y A footless encapsulation structure of semiconductor devices |
| 07/09/2008 | CN201084726Y Heat radiator |
| 07/09/2008 | CN201084725Y Heat sink structure improvement |
| 07/09/2008 | CN201084724Y Memory heat radiation module |
| 07/09/2008 | CN201084723Y Memory heat radiator |
| 07/09/2008 | CN201084722Y Heat pipe type CPU radiator |
| 07/09/2008 | CN201084094Y Computer mainframe board water cooled circulating heat radiating device |
| 07/09/2008 | CN201083371Y High power LED superconducting heat dispersion die set |
| 07/09/2008 | CN101218724A High current electrical switch and method |
| 07/09/2008 | CN101218682A LDMOS transistor |
| 07/09/2008 | CN101218674A Package, method of manufacturing the same and use thereof |
| 07/09/2008 | CN101218673A 半导体装置 Semiconductor device |
| 07/09/2008 | CN101218672A Micro-structured cooler and use thereof |
| 07/09/2008 | CN101218671A Heat dissipation device and power module |
| 07/09/2008 | CN101218670A Semiconductor device and method for manufacturing same |
| 07/09/2008 | CN101218669A Method for manufacturing electronic component, and electronic component |
| 07/09/2008 | CN101217859A Cooling system |
| 07/09/2008 | CN101217856A Heat radiator |
| 07/09/2008 | CN101217234A An electrostatic protection structure of high voltage drive integrated circuit |
| 07/09/2008 | CN101217156A Electronic element and cmos image sensor chip scale packages and manufacture method |
| 07/09/2008 | CN101217155A A TFT array base plate of double-layer wiring structure |
| 07/09/2008 | CN101217154A A grid electrode drive circuit structure and display panel |
| 07/09/2008 | CN101217153A An active member array structure and the corresponding manufacturing method |
| 07/09/2008 | CN101217152A Pixel structure and its making method |
| 07/09/2008 | CN101217149A A multi-bit programmable non-volatile memory unit, array and the corresponding manufacturing method |
| 07/09/2008 | CN101217148A A multi-bit programmable non-volatile memory unit, array and the corresponding manufacturing method |
| 07/09/2008 | CN101217147A A multi-bit programmable non-volatile memory unit, array and the corresponding manufacturing method |