| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/16/2008 | CN101222833A Sunflower integral heat pipe radiator |
| 07/16/2008 | CN101222832A Cooling device for electronic equipments |
| 07/16/2008 | CN101222117A Semiconductor light emitting device and method for fabricating same |
| 07/16/2008 | CN101222013A Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component |
| 07/16/2008 | CN101222012A LED package |
| 07/16/2008 | CN101222007A Light emitting diode with heat radiating device (3) |
| 07/16/2008 | CN101222006A Light emitting diode with heat radiating device (2) |
| 07/16/2008 | CN101222005A Packaging structure of light emitting diode |
| 07/16/2008 | CN101222004A Package structure of light emitting diode and its manufacturing method |
| 07/16/2008 | CN101221990A Semiconductor device and method of manufacturing the same |
| 07/16/2008 | CN101221977A Organic light emitting display |
| 07/16/2008 | CN101221974A Organic electro-luminescent display device |
| 07/16/2008 | CN101221973A Organic light emitting display device and method for fabricating the same |
| 07/16/2008 | CN101221963A Electronic assembly for image sensor device and fabrication method thereof |
| 07/16/2008 | CN101221961A Pixel structure and its production method |
| 07/16/2008 | CN101221960A 像素结构 Pixel structure |
| 07/16/2008 | CN101221959A Thin film transistor substrate and fabricating method thereof |
| 07/16/2008 | CN101221958A Thin film transistor array panel having a means for visual inspection and a method of performing visual inspection |
| 07/16/2008 | CN101221952A Semiconductor structure for protecting internal integrated circuit and its manufacturing method |
| 07/16/2008 | CN101221951A Chip for reducing ohm voltage drop and method thereof |
| 07/16/2008 | CN101221950A Resistor structure and its forming method |
| 07/16/2008 | CN101221949A Face-centred cubic structure capacitor and manufacturing method thereof |
| 07/16/2008 | CN101221948A Bonding pad structure for optoelectronic device and fabricating method thereof |
| 07/16/2008 | CN101221946A System-in-package packaging for minimizing bond wire contamination and yield loss |
| 07/16/2008 | CN101221945A Packaging body capable of repeatedly stacking |
| 07/16/2008 | CN101221944A Cooling type semiconductor packaging member |
| 07/16/2008 | CN101221943A Electrostatic discharge protection structure, element and its production method |
| 07/16/2008 | CN101221942A Wiring structure and wiring designing method |
| 07/16/2008 | CN101221941A Substrate and production method for packaging structure |
| 07/16/2008 | CN101221940A 厚膜电路元件及其制造方法 Thick film circuit device and manufacturing method |
| 07/16/2008 | CN101221939A Package structure for optoelectronic device and fabrication method thereof |
| 07/16/2008 | CN101221938A Semiconductor device with switch circuit |
| 07/16/2008 | CN101221937A Wafer level package with die receiving through-hole and method of the same |
| 07/16/2008 | CN101221936A Wafer level package with die receiving through-hole and method of the same |
| 07/16/2008 | CN101221935A Transparent conductive film and method for producing the same |
| 07/16/2008 | CN101221934A Glass heat pipe radiator |
| 07/16/2008 | CN101221933A Electronic device with a base plate |
| 07/16/2008 | CN101221932A Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure |
| 07/16/2008 | CN101221931A Radiator without base plate |
| 07/16/2008 | CN101221930A Chip packaging structure and its packaging method |
| 07/16/2008 | CN101221929A Packaging structure and its radiating module |
| 07/16/2008 | CN101221926A LCD unit structure and manufacturing method thereof |
| 07/16/2008 | CN101221925A Method of manufacturing liquid crystal display |
| 07/16/2008 | CN101221921A Semiconductor integrated circuit and process for forming same |
| 07/16/2008 | CN101221914A Semiconductor device has conductive projection and its manufacturing method |
| 07/16/2008 | CN101221913A Semiconductor device has conductive projection and its manufacturing method |
| 07/16/2008 | CN101221912A Multi-layer projection structure and manufacturing method thereof |
| 07/16/2008 | CN101221909A Cooling type packaging member production method and its applied cooling structure |
| 07/16/2008 | CN101221908A Substrate technique and structure with projection |
| 07/16/2008 | CN101221898A Method for manufacturing metallic substrate with high quality surface |
| 07/16/2008 | CN101221847A Label type polymer base ESD protection device and manufacturing method thereof |
| 07/16/2008 | CN101221629A Input/output pads placement for a smart card chip |
| 07/16/2008 | CN101221592A Heuristic method for optimizing and configuring vertical through hole in VLSI multi-layer power supply network |
| 07/16/2008 | CN101221329A Data driver with multilevel voltage generating circuit, and liquid crystal display apparatus |
| 07/16/2008 | CN101221023A Vapor augmented heatsink with multi-wick structure |
| 07/16/2008 | CN101220946A Method for improving cooling effect of LED light source module group |
| 07/16/2008 | CN101220945A Cooling type integrated lamp cap of LED light source |
| 07/16/2008 | CN101220944A Heat pipe radiation of high power LED automobile lamp |
| 07/16/2008 | CN101220943A Integral LED lamp |
| 07/16/2008 | CN101220937A LED light source module group |
| 07/16/2008 | CN101220936A LED light source supporting body |
| 07/16/2008 | CN101220935A LED light source supporting body |
| 07/16/2008 | CN101220934A LED illumination device |
| 07/16/2008 | CN101220933A LED illumination device |
| 07/16/2008 | CN101220932A LED light source module group |
| 07/16/2008 | CN101220921A High power LED vehicle high beam |
| 07/16/2008 | CN101220917A LED road lamp |
| 07/16/2008 | CN101220916A LED road lamp light source module group |
| 07/16/2008 | CN101220908A Modularized semiconductor light source |
| 07/16/2008 | CN101220253A Single-component stable luminescent device embedding composition at room temperature |
| 07/16/2008 | CN101220207A Thermally conductive silicone composition and thermally conductive silicone formed product |
| 07/16/2008 | CN101219576A Wireless enabled device |
| 07/16/2008 | CN101219259A Application of chip integration LED in photon burn treatment and photon burn treating equipment |
| 07/16/2008 | CN100403568C Electrode of gallium nitride base III-V class compound semiconductor |
| 07/16/2008 | CN100403544C 摄像机模块及其制造方法 Camera module and its manufacturing method |
| 07/16/2008 | CN100403540C Integrated circuit component and forming method thereof |
| 07/16/2008 | CN100403538C Equipment, system, and method for optical emission of signals in enhanced response IC |
| 07/16/2008 | CN100403537C Semiconductor device and its manufacturing method |
| 07/16/2008 | CN100403536C Electrostatic discharging protection device capable of bearing high-voltage and negative voltage |
| 07/16/2008 | CN100403535C Static discharge device capable of controlling triggering voltage |
| 07/16/2008 | CN100403534C Microelectronic substrate with integrated devices and its manufacturing method |
| 07/16/2008 | CN100403533C Coiled strip for packaging |
| 07/16/2008 | CN100403532C Heat elimination type packaging structure in sphere grid array |
| 07/16/2008 | CN100403531C Circuit device and portable device |
| 07/16/2008 | CN100403530C Semiconductor packing process |
| 07/16/2008 | CN100403529C High performance air cooled heat sinks used in high density packaging applications and its forming method |
| 07/16/2008 | CN100403528C Heatsink arrangement for semiconductor device |
| 07/16/2008 | CN100403527C Micron scale chip size packaging radiation structure |
| 07/16/2008 | CN100403526C Radiating structure and package of semiconductor device |
| 07/16/2008 | CN100403517C Dual mosaic structure, interconnect structure and methods for fabricating the same |
| 07/16/2008 | CN100403512C Interconnect structure with low-resistance inlaid copper/barrier and method for manufacturing the same |
| 07/16/2008 | CN100403504C Packaged substrate technology and chip package |
| 07/16/2008 | CN100403502C Auxiliary design device of semiconductor device |
| 07/16/2008 | CN100403501C Method and apparatus for filling vias |
| 07/16/2008 | CN100403500C Circuit device manufacturing method |
| 07/16/2008 | CN100403495C Semiconductor manufacturing method and its structure |
| 07/16/2008 | CN100403491C Semiconductor device manufacturing method |
| 07/16/2008 | CN100403225C Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components |
| 07/16/2008 | CN100403140C Liquid crystal display device and method for manufacturing liquid crystal display device |
| 07/16/2008 | CN100403031C Method and apparatus for detecting bearing failure |