| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/23/2008 | CN101226902A Pixel structure of liquid crystal display panel and manufacturing method thereof |
| 07/23/2008 | CN101226901A Thin film transistor, thin film transistor substrate, and method of manufacturing the same |
| 07/23/2008 | CN101226890A Blanking type encapsulation constitution without external pin and manufacturing method thereof |
| 07/23/2008 | CN101226889A Reconfiguration line structure and manufacturing method thereof |
| 07/23/2008 | CN101226888A Heat sinking type chip packaging technology and constitution |
| 07/23/2008 | CN101226883A Semiconductor rectifier device and manufacturing method thereof |
| 07/23/2008 | CN101225946A LED lighting device capable of recovery heat |
| 07/23/2008 | CN100405885C Fan structure |
| 07/23/2008 | CN100405883C Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 07/23/2008 | CN100405881C Wiring board |
| 07/23/2008 | CN100405633C Method of manufacturing a laminated structure, laminated structure, display device and display unit with laminated structure |
| 07/23/2008 | CN100405624C Integrated thermoelectric cooling devices and methods for fabricating same |
| 07/23/2008 | CN100405623C Thermoelectric generator |
| 07/23/2008 | CN100405596C Method for wireless data interchange between circuit units within a package, and circuit arrangement for performing the method |
| 07/23/2008 | CN100405595C Semiconductor device and manufacturing process therefor |
| 07/23/2008 | CN100405594C Interposer for decoupling integrated circuits on a circuit board |
| 07/23/2008 | CN100405593C Bond pad structures and semiconductor devices |
| 07/23/2008 | CN100405592C Multipurpose LED support |
| 07/23/2008 | CN100405591C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/23/2008 | CN100405590C Semiconductor device and method of manufacturing the same |
| 07/23/2008 | CN100405589C Semiconductor device and method of manufacturing the same |
| 07/23/2008 | CN100405588C Integrated heat-pipe radiator with outside diversion |
| 07/23/2008 | CN100405587C Radiator and its manufacturing method |
| 07/23/2008 | CN100405586C Heat radiation module assembly |
| 07/23/2008 | CN100405585C Crack stop device for low K dielectrics, and its forming method |
| 07/23/2008 | CN100405584C 半导体装置 Semiconductor device |
| 07/23/2008 | CN100405583C High-frequency wiring structure and method for producing the same |
| 07/23/2008 | CN100405575C Method for forming contact holes on display device |
| 07/23/2008 | CN100405564C Lead frame and method of manufacturing the same |
| 07/23/2008 | CN100405563C Wafer level package structure of image sensing element and its package method |
| 07/23/2008 | CN100405562C Method for producing wiring base board |
| 07/23/2008 | CN100405561C Method for producing integrated structure |
| 07/23/2008 | CN100405548C Technique and structure for making convex |
| 07/23/2008 | CN100405506C Conducting material with anisotropy |
| 07/23/2008 | CN100405188C Liquid crystal display device and its producing method |
| 07/23/2008 | CN100404597C Thermally conductive adhesive composition and process for device attachment |
| 07/22/2008 | US7403394 Heatsink locking device |
| 07/22/2008 | US7403390 Ultra dense multipurpose server |
| 07/22/2008 | US7403361 Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit |
| 07/22/2008 | US7403239 Thin film transistor array panel for liquid crystal display |
| 07/22/2008 | US7402995 Jig device for transporting and testing integrated circuit chip |
| 07/22/2008 | US7402914 Semiconductor device featuring overlay-mark used in photolithography process |
| 07/22/2008 | US7402913 High density nanostructured interconnection |
| 07/22/2008 | US7402912 Method and power control structure for managing plurality of voltage islands |
| 07/22/2008 | US7402911 Multi-chip device and method for producing a multi-chip device |
| 07/22/2008 | US7402910 Solder, microelectromechanical component and device, and a process for producing a component or device |
| 07/22/2008 | US7402909 Microelectronic package interconnect and method of fabrication thereof |
| 07/22/2008 | US7402908 Intermediate semiconductor device structures |
| 07/22/2008 | US7402907 Semiconductor device and manufacturing method thereof |
| 07/22/2008 | US7402906 Enhanced die-down ball grid array and method for making the same |
| 07/22/2008 | US7402905 Methods of fabrication of wafer-level vacuum packaged devices |
| 07/22/2008 | US7402904 Semiconductor device having wires that vary in wiring pitch |
| 07/22/2008 | US7402903 Semiconductor device |
| 07/22/2008 | US7402902 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 07/22/2008 | US7402901 Semiconductor device and method of manufacturing semiconductor device |
| 07/22/2008 | US7402900 Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
| 07/22/2008 | US7402898 Semiconductor package, method for fabricating the same, and semiconductor device |
| 07/22/2008 | US7402897 Vertical system integration |
| 07/22/2008 | US7402896 Integrated circuit (IC) carrier assembly incorporating serpentine suspension |
| 07/22/2008 | US7402895 Semiconductor package structure and method of manufacture |
| 07/22/2008 | US7402894 Integrated circuit carrier |
| 07/22/2008 | US7402893 System and method for improved auto-boating |
| 07/22/2008 | US7402892 Printed circuit board for connecting of multi-wire cabling to surge protectors |
| 07/22/2008 | US7402888 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit |
| 07/22/2008 | US7402887 Semiconductor device having fuse area surrounded by protection means |
| 07/22/2008 | US7402883 Back end of the line structures with liner and noble metal layer |
| 07/22/2008 | US7402878 Packaging method for microstructure and semiconductor devices |
| 07/22/2008 | US7402869 Apparatus and method for breakdown protection of a source follower circuit |
| 07/22/2008 | US7402868 System and method for protecting semiconductor devices |
| 07/22/2008 | US7402867 Semiconductor device |
| 07/22/2008 | US7402855 Split-channel antifuse array architecture |
| 07/22/2008 | US7402846 Electrostatic discharge (ESD) protection structure and a circuit using the same |
| 07/22/2008 | US7402841 Gallium nitride-based compound semiconductor light-emitting device and electrode for the same |
| 07/22/2008 | US7402770 Nano structure electrode design |
| 07/22/2008 | US7402532 Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer |
| 07/22/2008 | US7402513 Method for forming interlayer insulation film |
| 07/22/2008 | US7402511 Configuration for testing the bonding positions of conductive drops and test method for using the same |
| 07/22/2008 | US7402509 Method of forming self-passivating interconnects and resulting devices |
| 07/22/2008 | US7402508 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board |
| 07/22/2008 | US7402503 Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
| 07/22/2008 | US7402502 Method of manufacturing a semiconductor device by using a matrix frame |
| 07/22/2008 | US7402464 Fuse box of semiconductor device and fabrication method thereof |
| 07/22/2008 | US7402462 Folded frame carrier for MOSFET BGA |
| 07/22/2008 | US7402461 Method of connecting base materials |
| 07/22/2008 | US7402460 Method for production of contactless chip cards and for production of electrical units comprising chips with contact elements |
| 07/22/2008 | US7402458 Stress relieved flat frame for DMD window |
| 07/22/2008 | US7402457 Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces |
| 07/22/2008 | US7402454 Molded integrated circuit package with exposed active area |
| 07/22/2008 | US7402446 Method of manufacturing an electroluminescence device |
| 07/22/2008 | US7402442 Physically highly secure multi-chip assembly |
| 07/22/2008 | US7402340 Carbon particles dispersed in a graphite-based matrix in which the c axis of the graphene layers of the graphite are parallel, thermal conductivity kappa short-parallel perpendicular to the c axis is at least 400-1000 W/m*k, and the thermal conductivity kappa bottom parallel to the c axis is 10-100 W/m*k |
| 07/22/2008 | US7402182 High-power LGA socket |
| 07/22/2008 | US7402029 Remedies to prevent cracking in a liquid system |
| 07/22/2008 | US7401642 Heat sink with heat pipes |
| 07/17/2008 | WO2008085999A1 Thermal interface materials and methods for making thereof |
| 07/17/2008 | WO2008085687A2 Method of packaging semiconductor devices |
| 07/17/2008 | WO2008085559A2 Integrated circuit micro-cooler having tubes of a cnt array in essentially the same height over a surface |
| 07/17/2008 | WO2008085391A2 Stacked packages |
| 07/17/2008 | WO2008085257A1 Process integration scheme to lower overall dielectric constant in beol interconnect structures |
| 07/17/2008 | WO2008084870A1 Cooling structure for semiconductor device |