| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/17/2008 | WO2008084867A1 Semiconductor device and process for producing the semiconductor device |
| 07/17/2008 | WO2008084597A1 Heat generator cooling structure and driving apparatus fitted with the same |
| 07/17/2008 | WO2008084512A1 Radiating material and radiating sheet molded from radiating material |
| 07/17/2008 | WO2008084440A1 Method of forming an interconnect structure |
| 07/17/2008 | WO2008083905A1 Spacers for wafer bonding |
| 07/17/2008 | WO2008083853A1 Electronic component module and method for production thereof |
| 07/17/2008 | WO2008083838A1 Semiconductor module for connecting to a transformer winding, and transformer arrangement |
| 07/17/2008 | WO2008083727A1 Transistor clamping apparatus |
| 07/17/2008 | WO2008067242A3 Semiconductor device with leadframe finger lock |
| 07/17/2008 | WO2008063742A3 Method of packaging a semiconductor device and a prefabricated connector |
| 07/17/2008 | WO2008020402A3 Testing for correct undercutting of an electrode during an etching step |
| 07/17/2008 | WO2008008587A3 A stacked-die electronics package with planar and three-dimensional inductor elements |
| 07/17/2008 | WO2008005593A3 Apparatus for providing radio frequency shielding and heat dissipation for electronic components |
| 07/17/2008 | WO2007059551A8 Low area screen printed metal contact structure and method |
| 07/17/2008 | US20080171421 Manufacturing method of semiconductor device with smoothing |
| 07/17/2008 | US20080170196 Contact Structure, Display Device and Electronic Device |
| 07/17/2008 | US20080169834 Signal isolators using micro-transformers |
| 07/17/2008 | US20080169574 Direct Die Attachment |
| 07/17/2008 | US20080169573 Circuit substrate and the semiconductor package having the same |
| 07/17/2008 | US20080169571 Semiconductor device and method for manufacturing the same |
| 07/17/2008 | US20080169570 Method for manufacturing a semiconductor device using a reflow sputtering technique |
| 07/17/2008 | US20080169569 Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device |
| 07/17/2008 | US20080169568 Structure and method of making interconnect element having metal traces embedded in surface of dielectric |
| 07/17/2008 | US20080169567 Spacer Patterns Using Assist Layer for High Density Semiconductor Devices |
| 07/17/2008 | US20080169566 Press-Fit Diode Having a Silver-Plated Wire Termination |
| 07/17/2008 | US20080169565 Metal capping process for beol interconnect with air gaps |
| 07/17/2008 | US20080169564 Multi-layer substrate and electronic device having the same |
| 07/17/2008 | US20080169563 Semiconductor package and method of manufacturing the same |
| 07/17/2008 | US20080169562 Semiconductor device having conductive bumps and fabrication method thereof |
| 07/17/2008 | US20080169561 Semiconductor device and manufacturing method thereof |
| 07/17/2008 | US20080169560 Semiconductor device and package including the same |
| 07/17/2008 | US20080169559 Bump structure with annular support and manufacturing method thereof |
| 07/17/2008 | US20080169558 Redistribution circuit structure and manufacturing method thereof |
| 07/17/2008 | US20080169557 System-in-package packaging for minimizing bond wire contamination and yield loss |
| 07/17/2008 | US20080169556 Chip package module heat sink |
| 07/17/2008 | US20080169555 Anchor structure for an integrated circuit |
| 07/17/2008 | US20080169554 Plastic semiconductor packages having improved metal land-locking features |
| 07/17/2008 | US20080169553 Fabrication of a Micro-Electromechanical System (Mems) Device From a Complementary Metal Oxide Semiconductor (Cmos) |
| 07/17/2008 | US20080169552 Semiconductor device and programming method |
| 07/17/2008 | US20080169551 IC chip package with near substrate scale chip attachment |
| 07/17/2008 | US20080169550 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
| 07/17/2008 | US20080169549 Stacked integrated circuit package system and method of manufacture therefor |
| 07/17/2008 | US20080169548 Semiconductor package having a semiconductor chip in a substrate and method of fabricating the same |
| 07/17/2008 | US20080169547 Semiconductor modules with enhanced joint reliability |
| 07/17/2008 | US20080169546 Stack type semiconductor chip package having different type of chips and fabrication method thereof |
| 07/17/2008 | US20080169545 Stacked structure of semiconductor devices, semiconductor device package, and methods of fabricating the same |
| 07/17/2008 | US20080169544 Semiconductor device and method of fabricating the same |
| 07/17/2008 | US20080169543 Two dimensional stacking using interposers |
| 07/17/2008 | US20080169542 Semiconductor device and manufacturing method thereof |
| 07/17/2008 | US20080169541 Enhanced durability multimedia card |
| 07/17/2008 | US20080169540 Lead frame structure of light emitting diode |
| 07/17/2008 | US20080169539 Under bump metallurgy structure of a package and method of making same |
| 07/17/2008 | US20080169538 Semiconductor Device |
| 07/17/2008 | US20080169537 Semiconductor device |
| 07/17/2008 | US20080169536 Semiconductor device and signal terminating method thereof |
| 07/17/2008 | US20080169533 Die saw crack stopper |
| 07/17/2008 | US20080169529 Efuse containing sige stack |
| 07/17/2008 | US20080169520 Dieletric film layered product, semiconductor apparatus and production methods of the same |
| 07/17/2008 | US20080169467 Semiconductor device |
| 07/17/2008 | US20080169466 Test Cells for semiconductor yield improvement |
| 07/17/2008 | US20080169465 Semiconductor probe structure using impact-ionization metal oxide semiconductor device, information storing device therewith and manufacturing method thereof |
| 07/17/2008 | US20080169282 Temperature measurement and control of wafer support in thermal processing chamber |
| 07/17/2008 | US20080169123 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 07/17/2008 | US20080169120 Printed circuit board and method of manufacturing printed ciruit board |
| 07/17/2008 | US20080168647 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 07/17/2008 | DE202008006148U1 Kühlkörper Heat Sink |
| 07/17/2008 | DE102008003160A1 Wafer Level Package (WLP) mit Die-Aufnahmebohrung und Verfahren zu deren Herstellung Wafer Level Package (WLP) using the receiving bore and processes for their preparation |
| 07/17/2008 | DE102007063341A1 Wafer Level Package (WLP) mit Die-Aufnahmebohrung und Verfahren zu deren Herstellung Wafer Level Package (WLP) using the receiving bore and processes for their preparation |
| 07/17/2008 | DE102007062787A1 Semiconductor arrangement for use in integrated circuit, has organic solderability preservative material applied to one of substrate and semiconductor chip, and copper wire wire-bonded to one of chip and substrate by material |
| 07/17/2008 | DE102007002157A1 Semiconductor arrangement e.g. flap-ship-suitable power semiconductor arrangement, has drain-contact-soldering ball electrically connected with electrode plating, and source and gate soldering balls connected source and gate contact layers |
| 07/17/2008 | DE102007002156A1 Semiconductor arrangement, comprises heat sink body, which is provided for dissipating heat from semiconductor component, where heat sink has electric conductive body with recess for receiving semiconductor component |
| 07/17/2008 | DE102007001706A1 Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse Housing for optoelectronic device and arrangement of an optoelectronic component in a housing |
| 07/17/2008 | DE102007001518A1 Vorrichtung und Verfahren zum Häusen mikromechanischer Systeme Apparatus and method for housing micromechanical systems |
| 07/16/2008 | EP1945013A1 Multilayer printed wiring board and method for manufacturing same |
| 07/16/2008 | EP1944802A2 Method for manufacturing a leadframe, packaging method for using the leadframe and semiconductor package product |
| 07/16/2008 | EP1944797A1 Highly conductive composition for wafer coating |
| 07/16/2008 | EP1944116A1 Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material |
| 07/16/2008 | EP1943684A2 Photodiode chip having a high limit frequency |
| 07/16/2008 | EP1943679A1 High density, high q capacitor on top of protective layer |
| 07/16/2008 | EP1943675A1 Metal interconnect structure for a microelectronic element |
| 07/16/2008 | EP1943674A1 Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed fingers |
| 07/16/2008 | EP1943672A2 Methods and apparatus for flip-chip-on-lead semiconductor package |
| 07/16/2008 | EP1943549A2 Composite layer having improved adhesion, and fluid focus lens incorporating same |
| 07/16/2008 | EP1943311A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto |
| 07/16/2008 | EP1807868A4 Stacked die module |
| 07/16/2008 | EP1682858B1 An integrated thermal sensor for microwave transistors |
| 07/16/2008 | EP1645174A4 Tower heat sink with sintered grooved wick |
| 07/16/2008 | EP1417709A4 High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing |
| 07/16/2008 | EP1154471B1 Semiconductor chip with bump contacts |
| 07/16/2008 | CN201087982Y Heat pipe straddle heat radiating device |
| 07/16/2008 | CN201087904Y Light emitting diode chip packaging structure with ceramic as substrate |
| 07/16/2008 | CN101223639A Memory module systems and methods |
| 07/16/2008 | CN101223638A Schottky diode with improved surge capability |
| 07/16/2008 | CN101223235A Epoxy resin composition for encapsulation and electronic part device |
| 07/16/2008 | CN101223207A Epoxy resin composition and semiconductor device |
| 07/16/2008 | CN101222838A Sunflower embedded heat pipe radiator |
| 07/16/2008 | CN101222837A Heat radiating device |
| 07/16/2008 | CN101222836A Direct conduction-Peltier effect refrigeration mixed cooling method and device |
| 07/16/2008 | CN101222835A Heat radiating device |
| 07/16/2008 | CN101222834A Buckling device of radiator |