| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/24/2008 | US20080173986 Multilayer silicon nitride deposition for a semiconductor device |
| 07/24/2008 | US20080173985 Dielectric cap having material with optical band gap to substantially block uv radiation during curing treatment, and related methods |
| 07/24/2008 | US20080173984 MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS |
| 07/24/2008 | US20080173983 Semiconductor device and method for manufacturing the same |
| 07/24/2008 | US20080173973 Semiconductor integrated circuit device |
| 07/24/2008 | US20080173972 Method of wafer thinning |
| 07/24/2008 | US20080173961 Semiconductor device, magnetic sensor, and magnetic sensor unit |
| 07/24/2008 | US20080173945 ESD protection scheme for semiconductor devices having dummy pads |
| 07/24/2008 | US20080173914 Semiconductor device and storage medium |
| 07/24/2008 | US20080173869 Method and structure for reducing prior level edge interference with critical dimension measurement |
| 07/24/2008 | US20080173868 Method and resulting structure for fabricating test key structures in dram structures |
| 07/24/2008 | US20080173477 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 07/24/2008 | US20080173476 Embedded waveguide and embedded electromagnetic shielding |
| 07/24/2008 | US20080173429 Thin sheet type heat pipe |
| 07/24/2008 | US20080172871 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module |
| 07/24/2008 | DE202008006122U1 Kühlvorrichtung Cooler |
| 07/24/2008 | DE112007000055T5 Leadframe, aufweisend einen Kühlkörper tragenden Teil, Verfahren zur Herstellung einer Baugruppe mit Licht emittierender Diode unter Verwendung eines solchen, und eine mittels des Verfahrens hergestellte Baugruppe mit Licht emittierender Diode Lead frame, comprising a heat sink supporting part, method of manufacturing a module with light emitting diode using such, and a produced by the process of assembly with light emitting diode |
| 07/24/2008 | DE10333465B4 Elektronisches Bauteil mit Halbleiterchip, Verfahren zur Herstellung desselben sowie Verfahren zur Herstellung eines Halbleiterwafers mit Kontaktflecken , The same electronic component having the semiconductor chip as well as method for the production process for producing a semiconductor wafer having contact pads |
| 07/24/2008 | DE102007003920A1 Liquid radiator for one or multiple electrical or electronic units, has lower cooling plate and upper cooling plate, where one or multiple cooling units are arranged and coolant channels are designed as slots |
| 07/24/2008 | DE102007002858A1 Electronic component, has carrier unit including separating unit partially overlapping with electrical contact point, where separating unit is partially free from mechanically penetratable material e.g. silicone or epoxy resin |
| 07/24/2008 | DE10049274B4 Kühlvorrichtung und Verfahren zu deren Herstellung Cooling device and process for their preparation |
| 07/24/2008 | CA2673270A1 Method for applying markings to substrate surfaces by means of a transfer method |
| 07/23/2008 | EP1947692A1 Method for manufacturing laminated lead frame and laminated lead frame |
| 07/23/2008 | EP1947691A1 Circuit carrier laminate and circuit carrier for mounting a semiconductor chip of a smartcard module, and manufacturing methods thereof |
| 07/23/2008 | EP1947690A1 Circuit carrier laminate and circuit carrier for mounting a semiconductor chip of a smartcard module, and manufacturing methods thereof |
| 07/23/2008 | EP1947594A1 Circuit carrier laminate and circuit carrier for mounting a semicaonductor chip of a smartcard module, and manufacturing methods thereof |
| 07/23/2008 | EP1947410A1 Evaporative compact high intensity cooler |
| 07/23/2008 | EP1947128A1 Thermosetting resin composition and photosemiconductor encapsulation material |
| 07/23/2008 | EP1946371A2 Electrically programmable fuse |
| 07/23/2008 | EP1946370A2 Surface treatments for contact pads used in semiconductor chip packages and methods of providing such surface treatments |
| 07/23/2008 | EP1946369A1 An air cavity package for a semiconductor die and methods of forming the air cavity package |
| 07/23/2008 | EP1946364A1 Methods of packaging a semiconductor die and package formed by the methods |
| 07/23/2008 | EP1946032A1 Structured thermal transfer article |
| 07/23/2008 | EP1945840A2 Interconnects and heat dissipators based on nanostructures |
| 07/23/2008 | EP1877809B1 Assembly for regulating the temperature of an integrated circuit |
| 07/23/2008 | EP1817794B1 Rectangular semiconductor support for microelectronics and method for making same |
| 07/23/2008 | EP1719176A4 Semiconductor package with crossing conductor assembly and method of manufacture |
| 07/23/2008 | EP1665333A4 Coupler resource module |
| 07/23/2008 | EP1628243B1 Ic card and ic card making method |
| 07/23/2008 | EP1545828A4 Method and appartus for high volume assembly of radio frequency identification tags |
| 07/23/2008 | EP1471588B1 Semiconductor device having fuel cell and its manufacturing method |
| 07/23/2008 | EP1016132B1 Capacitors in integrated circuits |
| 07/23/2008 | CN201091031Y LED chip packaging structure with high efficiency lateral luminous effect |
| 07/23/2008 | CN101228640A Systems and methods for producing white-light light emitting diodes |
| 07/23/2008 | CN101228627A Electronic module assembly with heat spreader |
| 07/23/2008 | CN101228626A A package for a die |
| 07/23/2008 | CN101228625A Semiconductor package with plated connection |
| 07/23/2008 | CN101228624A Dry etchback of interconnect contacts |
| 07/23/2008 | CN101228622A Flip-chip package with air cavity |
| 07/23/2008 | CN101227813A Radiator, heat sink fan, and radiator manufacturing method |
| 07/23/2008 | CN101227811A Vacuum super thermal conduction heat radiator |
| 07/23/2008 | CN101227810A Liquid cooling type heat radiating device with circulation loop |
| 07/23/2008 | CN101227809A Liquid cooling heat radiating device |
| 07/23/2008 | CN101227802A Pattern electrode jointing structure using ultraviolet as well as method for jointing pattern electrode |
| 07/23/2008 | CN101227799A Electronic device and method of manufacturing same |
| 07/23/2008 | CN101227798A Electronic device and method of manufacturing the same |
| 07/23/2008 | CN101227797A Manufacturing method of electronic device |
| 07/23/2008 | CN101227060A Semiconductor laser device having incomplete bonding region and electronic equipment |
| 07/23/2008 | CN101226979A Semiconductor light-emitting device |
| 07/23/2008 | CN101226976A LED device and locating structure thereof |
| 07/23/2008 | CN101226975A High-power light emitting diode chip packaging structure and method for manufacturing the same |
| 07/23/2008 | CN101226960A Access device having vertical channel and related semiconductor device and a method of fabricating the access device |
| 07/23/2008 | CN101226954A Organic light emitting display |
| 07/23/2008 | CN101226952A Method and structure of a multi-level cell resistance random access memory with metal oxides |
| 07/23/2008 | CN101226951A Resistance random access memory |
| 07/23/2008 | CN101226947A Thin membrane encapsulation structure of fingerprint identifying device |
| 07/23/2008 | CN101226945A Thin-film transistor array substrate |
| 07/23/2008 | CN101226944A Thin film transistor substrate capable of preventing opening from reducing |
| 07/23/2008 | CN101226943A Initiative element array substrate |
| 07/23/2008 | CN101226937A Semiconductor device and storage medium |
| 07/23/2008 | CN101226935A Semiconductor integrated circuit device |
| 07/23/2008 | CN101226934A Method for making test key structure in DRAM structure and corresponding structure |
| 07/23/2008 | CN101226932A Pixel structure and manufacturing method thereof |
| 07/23/2008 | CN101226930A Semiconductor structure with layer or structure identification mark and manufacturing method and application thereof |
| 07/23/2008 | CN101226929A Semiconductor package structure and manufacturing method thereof |
| 07/23/2008 | CN101226928A Stack type chip packaging structure and manufacturing method thereof |
| 07/23/2008 | CN101226927A Chip module with power amplifier and manufacturing method thereof |
| 07/23/2008 | CN101226926A Assembled structure of large area array infrared detector on cold platform and assembled method thereof |
| 07/23/2008 | CN101226925A Wiring structure of long line series infrared detector dewar assembly and connecting method thereof |
| 07/23/2008 | CN101226923A Semiconductor structure with field shield and method of forming the structure |
| 07/23/2008 | CN101226922A SICOH dielectric and its manufacturing method |
| 07/23/2008 | CN101226921A Substrate capable of detecting connection point thickness and detecting method thereof |
| 07/23/2008 | CN101226920A Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection |
| 07/23/2008 | CN101226919A Semiconductor package substrate increasing static dissipation capability |
| 07/23/2008 | CN101226918A Chip package substrate and packaging structure thereof |
| 07/23/2008 | CN101226917A Semiconductor package substrate of virtual placing graphic pattern with heat sinking function |
| 07/23/2008 | CN101226916A Semiconductor packaging ribbon winding with anti-shaving chain hole side |
| 07/23/2008 | CN101226915A Package substrate and manufacturing method thereof |
| 07/23/2008 | CN101226914A Chip carrier substrate capacitor and method for fabrication thereof |
| 07/23/2008 | CN101226913A Packaging structure capable of connecting output / input module |
| 07/23/2008 | CN101226912A Thin membrane flip chip encapsulation |
| 07/23/2008 | CN101226911A Chip packaging structure |
| 07/23/2008 | CN101226910A High-frequency integrated circuit package structure with unification projection jointing altitude and method for manufacturing the same |
| 07/23/2008 | CN101226909A Thin membrane encapsulation structure of fingerprint identifying device |
| 07/23/2008 | CN101226908A Projection structure with ring-shaped support and manufacturing method thereof |
| 07/23/2008 | CN101226907A Heat sinking gain type chip sizing level encapsulation body and method for forming the same |
| 07/23/2008 | CN101226906A Chip carrier with dams |
| 07/23/2008 | CN101226905A Semiconductor encapsulation constitution with radiation fin and carrier thereof |
| 07/23/2008 | CN101226904A Silicon slice with asymmetry edge contour and manufacturing method thereof |
| 07/23/2008 | CN101226903A 半导体装置 Semiconductor device |