Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/15/2014US8779599 Packages including active dies and dummy dies and methods for forming the same
07/15/2014US8779598 Method and apparatuses for integrated circuit substrate manufacture
07/15/2014US8779597 Semiconductor device with base support structure
07/15/2014US8779596 Structures and methods to enhance copper metallization
07/15/2014US8779595 Semiconductor device having high-frequency interconnect
07/15/2014US8779594 Semiconductor device having multi-layered interconnect structure
07/15/2014US8779593 Semiconductor integrated circuit device
07/15/2014US8779592 Via-free interconnect structure with self-aligned metal line interconnections
07/15/2014US8779591 Bump pad structure
07/15/2014US8779590 Semiconductor device and method of producing the same
07/15/2014US8779589 Liner layers for metal interconnects
07/15/2014US8779588 Bump structures for multi-chip packaging
07/15/2014US8779587 PB-free solder bumps with improved mechanical properties
07/15/2014US8779585 Implementing enhanced thermal conductivity in stacked modules
07/15/2014US8779584 Semiconductor apparatus
07/15/2014US8779583 Semiconductor device and manufacturing method
07/15/2014US8779582 Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areas
07/15/2014US8779581 Heat dissipating semiconductor device packages
07/15/2014US8779580 Electronic component package and manufacturing method thereof
07/15/2014US8779579 Thermal dissipation in chip
07/15/2014US8779577 Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells
07/15/2014US8779576 Wafer level package and methods of fabricating the same
07/15/2014US8779575 Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs
07/15/2014US8779574 Semiconductor die including a current routing line having non-metallic slots
07/15/2014US8779573 Semiconductor package having a silicon reinforcing member embedded in resin
07/15/2014US8779571 Integrated circuit having a three dimensional stack package structure
07/15/2014US8779570 Stackable integrated circuit package system
07/15/2014US8779569 Semiconductor device and method for manufacturing the same
07/15/2014US8779568 Integrated circuit package system with encapsulation lock
07/15/2014US8779567 Semiconductor device
07/15/2014US8779566 Flexible routing for high current module application
07/15/2014US8779565 Integrated circuit mounting system with paddle interlock and method of manufacture thereof
07/15/2014US8779564 Semiconductor device with capacitive coupling structure
07/15/2014US8779563 Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
07/15/2014US8779562 Integrated circuit packaging system with interposer shield and method of manufacture thereof
07/15/2014US8779561 LED backlight unit without printed circuit board and method of manufacturing the same
07/15/2014US8779560 Semiconductor device and manufacturing method thereof
07/15/2014US8779559 Structure and method for strain-relieved TSV
07/15/2014US8779558 Chip package structure and manufacturing method thereof
07/15/2014US8779557 Chip package and package wafer with a recognition mark, and method for forming the same
07/15/2014US8779556 Structure designs and methods for integrated circuit alignment
07/15/2014US8779548 Integrated circuit including a porous material for retaining a liquid and manufacturing method thereof
07/15/2014US8779535 Packaged integrated device die between an external and internal housing
07/15/2014US8779519 Semiconductor device having two-way conduction characteristics, and electrostatic discharge protection circuit incorporating the same
07/15/2014US8779518 Apparatus for ESD protection
07/15/2014US8779517 FinFET-based ESD devices and methods for forming the same
07/15/2014US8779516 Semiconductor device
07/15/2014US8779492 Semiconductor device and method of forming the same
07/15/2014US8779489 Power FET with a resonant transistor gate
07/15/2014US8779485 Hydrogen barrier for ferroelectric capacitors
07/15/2014US8779446 Light emitting device package and light emitting system
07/15/2014US8779441 Semiconductor light emitting element with first and second electrode openings arranged at a constant distance
07/15/2014US8779303 Hybrid package
07/15/2014US8779300 Packaging substrate with conductive structure
07/15/2014US8779299 Electronic component-embeded board and method for manufacturing the same
07/15/2014US8779059 Optical semiconductor sealing resin composition and optical semiconductor device using same
07/15/2014US8778794 Interconnection wires of semiconductor devices
07/15/2014US8778793 Semiconductor device and method of manufacturing the same
07/15/2014US8778791 Semiconductor structure and method for making the same
07/15/2014US8778781 Method of growing a thin film, a method of forming a structure and a device
07/15/2014US8778779 Semiconductor device and a method for producing semiconductor device
07/15/2014US8778769 Semiconductor package having passive device and method for making the same
07/15/2014US8778748 Method for manufacturing semiconductor device
07/15/2014US8778743 Latch-up robust PNP-triggered SCR-based devices
07/15/2014US8778741 Low cost hermetically sealed package
07/15/2014US8778739 Lead frame and method of manufacturing the same, and semiconductor device and method of manufacturing the same
07/15/2014US8778736 Capping coating for 3D integration applications
07/15/2014US8778734 Tree based adaptive die enumeration
07/15/2014US8778732 Microelectronic devices and microelectronic support devices, and associated assemblies and methods
07/15/2014US8776871 Chassis with distributed jet cooling
07/15/2014US8776833 Air duct for electronic device
07/15/2014CA2553664C Electronic circuit package with cavity resonance cut off member
07/10/2014WO2014107647A1 Multi-chip package assembly with improved bond wire separation
07/10/2014WO2014107301A1 Structure for microelectronic packaging with encapsulated bond elements
07/10/2014WO2014107108A1 Through-polymer via (tpv) and method to manufacture such a via
07/10/2014WO2014106985A1 Metal core solder ball and heat dissipation structure for semiconductor device using the same
07/10/2014WO2014106972A1 Photocured composition, blocking layer comprising same and encapsulated device comprising same
07/10/2014WO2014106955A1 Composition, laminate, method for producing laminate, transistor, and method for producing transistor
07/10/2014WO2014106925A1 Ceramic wiring substrate, semiconductor device, and method for manufacturing ceramic wiring substrate
07/10/2014WO2014106879A1 Semiconductor device provided with radiator member
07/10/2014US20140193971 Semiconductor device and method of manufacturing the same
07/10/2014US20140193954 Method of manufacturing semiconductor device
07/10/2014US20140193952 Methods for Metal Bump Die Assembly
07/10/2014US20140193951 Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
07/10/2014US20140192500 Method of Electrophoretic Depositing (EPD) a Film on an Exposed Conductive Surface and an Electric Component Thereof
07/10/2014US20140192499 Semiconductor device and printed circuit board
07/10/2014US20140192498 Direct metalization of electrical circuit structures
07/10/2014US20140191421 Semiconductor device
07/10/2014US20140191420 Embedded package in pcb build up
07/10/2014US20140191419 3d integrated circuit package with window interposer
07/10/2014US20140191418 Metal to metal bonding for stacked (3d) integrated circuits
07/10/2014US20140191417 Multi-Chip Package Assembly with Improved Bond Wire Separation
07/10/2014US20140191416 Semiconductor device
07/10/2014US20140191414 Semiconductor Device and Method for Fabricating the Same
07/10/2014US20140191413 Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body
07/10/2014US20140191412 Interconnection structures and fabrication method thereof
07/10/2014US20140191411 Interconnection structures and fabrication method thereof
07/10/2014US20140191410 Damage monitor structure for through-silicon via (tsv) arrays
07/10/2014US20140191409 Forming vias and trenches for self-aligned contacts in a semiconductor structure
07/10/2014US20140191408 Backside metal ground plane with improved metal adhesion and design structures
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