| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/30/2008 | CN101231995A Circuit component |
| 07/30/2008 | CN101231994A Circuit component |
| 07/30/2008 | CN101231993A Circuit component |
| 07/30/2008 | CN101231992A Thin film type semiconductor packaging construction for increasing corner pin joint intensity |
| 07/30/2008 | CN101231991A Semiconductor packaging supported films and packaging construction with misplacement type pin buckle |
| 07/30/2008 | CN101231990A Tape coiling type packaging construction capable of inserting and electronic device using the construction |
| 07/30/2008 | CN101231989A Semiconductor packaging supported films and packaging construction for increasing heat sinking benefit |
| 07/30/2008 | CN101231988A Circuit coiling tape of thin film crystal cover packaging and thin film crystal cover packaging construction thereof |
| 07/30/2008 | CN101231987A Thin membrane crystal cover packaging construction for preventing thin membrane dent forming glue filling bubble |
| 07/30/2008 | CN101231986A Semiconductor packaging supported films and packaging construction for increasing pin intensity |
| 07/30/2008 | CN101231985A Semiconductor package substrate for improving deform |
| 07/30/2008 | CN101231984A Semiconductor packaging supported films and packaging construction for preventing rupture of pin buckle position |
| 07/30/2008 | CN101231983A Thin film crystal-covering package substrate |
| 07/30/2008 | CN101231982A Package structure of semiconductor device |
| 07/30/2008 | CN101231981A Structure improvement of lead frame for semiconductor crystal grain packaging |
| 07/30/2008 | CN101231980A Electronic device without wiring |
| 07/30/2008 | CN101231979A Inner pin joint packaging |
| 07/30/2008 | CN101231978A Tape coiling type semiconductor packaging construction of electrostatic discharge protection when chip jointing |
| 07/30/2008 | CN101231977A Semiconductor structure and forming method thereof |
| 07/30/2008 | CN101231976A Semiconductor package substrate structure and encapsulation method thereof |
| 07/30/2008 | CN101231975A Chip packaging body and method of manufacturing the same |
| 07/30/2008 | CN101231974A Apparatus for depositing a multilayer coating on discrete sheets |
| 07/30/2008 | CN101231972A Flexible display device and fabricating method thereof |
| 07/30/2008 | CN101231971A CMOS image sensors with a bonding pad and methods of forming the same |
| 07/30/2008 | CN101231968A Inlaying inner connecting line structure and double inlaying process |
| 07/30/2008 | CN101231963A Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same |
| 07/30/2008 | CN101231959A Sensing type packaging part and manufacturing method thereof |
| 07/30/2008 | CN101231958A Chip carrier including an interlocking structure |
| 07/30/2008 | CN101231949A Method and semiconductor structure improving adhesion strength between two different layers |
| 07/30/2008 | CN101231709A Structure of memory card and the method of the same |
| 07/30/2008 | CN101231667A Method of filling redundancy for semiconductor manufacturing process and semiconductor device |
| 07/30/2008 | CN101231546A Combination of cooling device |
| 07/30/2008 | CN101231196A Temperature detection method of semiconductor device and power conversion apparatus |
| 07/30/2008 | CN101230976A Semiconductor lighting lamp |
| 07/30/2008 | CN101230245A Gluewater for packaging light-emitting diode and uses thereof |
| 07/30/2008 | CN101230197A Organosilicon composition for manufacturing packaging gluewater of light-emitting diode |
| 07/30/2008 | CN100407573C 电子器件及测试和制造方法 And testing electronic devices and methods of manufacture |
| 07/30/2008 | CN100407475C 改进的有机发光器件密封的电子器件和其密封方法 Improved organic light emitting device of an electronic device and a sealing method for sealing |
| 07/30/2008 | CN100407469C 压电器件的制造方法 The method of manufacturing a piezoelectric device |
| 07/30/2008 | CN100407456C 表面安装型发光二极管及其制造方法 Surface-mounted type light emitting diode and its manufacturing method |
| 07/30/2008 | CN100407432C 配线基板以及使用该配线基板的放射线检测器 The wiring substrate and radiation detector using the wiring substrate, |
| 07/30/2008 | CN100407425C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/30/2008 | CN100407423C 半导体器件以及半导体封装 A semiconductor device and a semiconductor package |
| 07/30/2008 | CN100407422C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/30/2008 | CN100407421C 层叠型半导体存储装置 The layered semiconductor memory device |
| 07/30/2008 | CN100407420C 半导体装置及其制造方法、电路基板以及电子设备 Semiconductor device and manufacturing method of a circuit board and an electronic device |
| 07/30/2008 | CN100407419C 高深宽比开口及其制作方法 High aspect ratio openings and their production methods |
| 07/30/2008 | CN100407418C 半导体器件 Semiconductor devices |
| 07/30/2008 | CN100407417C 小轨迹半导体装置包装 Small track semiconductor device packaging |
| 07/30/2008 | CN100407416C 热管散热装置 Heat pipe cooling device |
| 07/30/2008 | CN100407415C 热传导性复合片及其制造方法 Thermal conductivity of the composite sheet and its manufacturing method |
| 07/30/2008 | CN100407414C 散热器底板和鳍片的铆合工艺 Riveting plate and fin heat sink technology |
| 07/30/2008 | CN100407413C 电路基板、焊球网格阵列的安装结构和电光装置 A circuit board, the ball grid array mounting structure and the electro-optical device |
| 07/30/2008 | CN100407412C 用于包覆塑封的热沉或标记部分的微型模锁定结构 For covering the heat sink or a plastic part mini-mold labeled lock structure |
| 07/30/2008 | CN100407401C 半导体器件的制造方法及由此制造的半导体器件 The method of manufacturing a semiconductor device and a semiconductor device manufactured thereby |
| 07/30/2008 | CN100407400C 布线结构 Wiring structure |
| 07/30/2008 | CN100407389C 半导体装置及使用此半导体装置的放射线检测器 The semiconductor device and the radiation detector using the semiconductor device |
| 07/30/2008 | CN100407388C 半导体装置及使用此半导体装置的放射线检测器 The semiconductor device and the radiation detector using the semiconductor device |
| 07/30/2008 | CN100407375C 硅化处理过程中有选择地清除层的清洗液及方法 Silicidation process to selectively remove the cleaning solution and method of layer |
| 07/30/2008 | CN100407098C 用于便携式电脑的冷却系统 A cooling system for a portable computer |
| 07/30/2008 | CN100407018C 薄膜晶体管阵列面板 The thin film transistor array panel |
| 07/30/2008 | CN100406742C Pump, cooling apparatus, electrical appliance and personal computer |
| 07/30/2008 | CN100406523C Curable composition, varnish, and layered product |
| 07/30/2008 | CN100406247C Flexible metal stacked body |
| 07/29/2008 | US7405991 Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices |
| 07/29/2008 | US7405939 Fastening device and heat sink assembly using the same |
| 07/29/2008 | US7405938 Heat sink clip |
| 07/29/2008 | US7405937 Heat sink module for dual heat sources |
| 07/29/2008 | US7405933 Cooling device, substrate, and electronic equipment |
| 07/29/2008 | US7405930 Electronic apparatus |
| 07/29/2008 | US7405924 System and method for protecting microelectromechanical systems array using structurally reinforced back-plate |
| 07/29/2008 | US7405921 Layer capacitor element and production process as well as electronic device |
| 07/29/2008 | US7405913 Semiconductor device having transistor with high electro-static discharge capability and high noise capability |
| 07/29/2008 | US7405656 Device and method for encapsulation and mounting of RFID devices |
| 07/29/2008 | US7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device |
| 07/29/2008 | US7405486 Circuit device |
| 07/29/2008 | US7405485 Semiconductor device |
| 07/29/2008 | US7405484 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 07/29/2008 | US7405483 Electronic assembly and circuit board |
| 07/29/2008 | US7405482 High-k dielectric film, method of forming the same and related semiconductor device |
| 07/29/2008 | US7405481 Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip |
| 07/29/2008 | US7405480 Elimination of thermal deformation in electronic structures |
| 07/29/2008 | US7405479 Wired circuit board |
| 07/29/2008 | US7405478 Substrate package structure and packaging method thereof |
| 07/29/2008 | US7405477 Ball grid array package-to-board interconnect co-design apparatus |
| 07/29/2008 | US7405476 Asymmetric alignment of substrate interconnect to semiconductor die |
| 07/29/2008 | US7405475 Method and system of tape automated bonding |
| 07/29/2008 | US7405474 Low cost thermally enhanced semiconductor package |
| 07/29/2008 | US7405473 Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing |
| 07/29/2008 | US7405472 Semiconductor device |
| 07/29/2008 | US7405471 Carrier-based electronic module |
| 07/29/2008 | US7405470 Adaptable electronic storage apparatus |
| 07/29/2008 | US7405469 Semiconductor device and method of manufacturing the same |
| 07/29/2008 | US7405468 Plastic package and method of fabricating the same |
| 07/29/2008 | US7405467 Power module package structure |
| 07/29/2008 | US7405466 Method of fabricating microelectromechanical system structures |
| 07/29/2008 | US7405463 Gate dielectric antifuse circuit to protect a high-voltage transistor |
| 07/29/2008 | US7405459 Semiconductor device comprising porous film |
| 07/29/2008 | US7405450 Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon |
| 07/29/2008 | US7405448 Semiconductor device having a resistance for equalizing the current distribution |