| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/31/2008 | DE102007059310A1 Selbsthaftende Elektroden und Verfahren zu deren Herstellung Self-adhesive electrodes and processes for their preparation |
| 07/31/2008 | DE102007012504A1 Electronic device has substrate, electronic element on substrate and cover over electronic element, where cover is designed on inner side of electronic element, such that cover has supporting structure rising up into the gap |
| 07/31/2008 | DE102007005234A1 Power electronic module for manufacturing converter, has electrical lines electrically connected with semiconductor elements, where semiconductor chip and attached electrical lines are held in electrical isolating ceramic casing |
| 07/31/2008 | DE102007004284A1 Method for manufacturing semiconductor chips, involves providing semiconductor wafers with multiple lines and columns arranged in semiconductor chip positions, where semiconductor wafers have integrated circuits |
| 07/31/2008 | DE102007002744A1 Semiconductor component i.e. power semiconductor element e.g. FET, has semiconductor body made of semiconductor material, and layer made of another material, which includes high conductivity than former material, provided in body |
| 07/31/2008 | DE102007002725A1 Gehäuse für in mobilen Anwendungen eingesetzte mikromechanische und mikrooptische Bauelemente Housing for mobile applications used in micro-mechanical and micro-optical components |
| 07/31/2008 | DE102007002150A1 Konzept zur Reduktion von Leckströmen von integrierten Schaltungen mit wenigstens einem Transistor Concept for reducing leakage currents of integrated circuits with at least one transistor |
| 07/31/2008 | DE102006032925B4 Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Electronic assembly and method for encapsulating electronic devices and integrated circuits |
| 07/31/2008 | DE102004025911B4 Kontaktbehaftete Chipkarte, Verfahren zur Herstellung einer solchen Contact smart card, a method for producing such |
| 07/31/2008 | DE102004007219B4 Kühlmodul und Verfahren zum Herstellen dieses Kühlmoduls Cooling module and method for manufacturing this cooling module |
| 07/31/2008 | DE10150432B4 Arraysubstrat für eine Flüssigkristallanzeige und Verfahren zu dessen Herstellung Array substrate for a liquid crystal display and method for its production |
| 07/31/2008 | DE10103337B4 Leistungs-Halbleiterelement mit Diodeneinrichtungen zur Temperaturerfassung und zum Absorbieren von statischer Elektrizität sowie Leistungs-Halbleitervorrichtung mit einem derartigen Leistungs-Halbleiterelement Power semiconductor element with diode means for temperature detection and for absorbing static electricity, or the power semiconductor device with such a power semiconductor element |
| 07/31/2008 | DE10025835B4 Mikropunktmarkierungsverfahren Microdot marking methods |
| 07/30/2008 | EP1951015A1 Printed wiring board and method for manufacturing printed wiring board |
| 07/30/2008 | EP1950808A2 Examination apparatus for biological sample and chemical sample |
| 07/30/2008 | EP1950806A1 Interposer with built-in passive part |
| 07/30/2008 | EP1950805A1 Electronic element, package having same, and electronic device |
| 07/30/2008 | EP1950316A1 Metal material and manufacturing method |
| 07/30/2008 | EP1949777A1 Thermal transfer coating |
| 07/30/2008 | EP1949442A1 Fabrication of transistors |
| 07/30/2008 | EP1949440A2 Multiple die integrated circuit package |
| 07/30/2008 | EP1949439A2 Liquid cooling for backlit displays |
| 07/30/2008 | EP1949438A1 Cooling assembly |
| 07/30/2008 | EP1949437A1 Implantable microelectronic device and method of manufacture |
| 07/30/2008 | EP1949436A2 Leadframe-based ic-package with supply-reference comb |
| 07/30/2008 | EP1949431A1 Amine-free deposition of metal-nitride films |
| 07/30/2008 | EP1949427A2 High density three dimensional semiconductor die package |
| 07/30/2008 | EP1949426A2 Fine pitch interconnect and method of making |
| 07/30/2008 | EP1949417A2 Method of fabricating an exposed die package |
| 07/30/2008 | EP1948427A2 Wire embedded bridge |
| 07/30/2008 | EP1948386A1 Method for producing a contact arrangement between a microelectronic component and a supporting substrate as well as component unit produced by said method |
| 07/30/2008 | EP1726197B1 An element for carrying electronic components |
| 07/30/2008 | EP1500043B1 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 07/30/2008 | EP1472499A4 Small scale chip cooler assembly |
| 07/30/2008 | EP1295334B1 Hermetic high frequency module and method for producing the same |
| 07/30/2008 | EP1273058B1 Method for producing a thin-film battery having an ultra-thin electrolyte |
| 07/30/2008 | EP1042808B1 Reduced capacitance transistor with electro-static discharge protection structure and method for forming the same |
| 07/30/2008 | CN201094173Y Heat radiating device |
| 07/30/2008 | CN201093439Y LED heat sinking base plate |
| 07/30/2008 | CN201093436Y Lamp fitting |
| 07/30/2008 | CN201093435Y Ultra-high power LED lamp |
| 07/30/2008 | CN201093434Y Pipe cold type ultra-high power LED lamp |
| 07/30/2008 | CN201093433Y LED light fitting structure |
| 07/30/2008 | CN201093432Y Heat radiator of LED lamp and LED lamp |
| 07/30/2008 | CN201093430Y Heat radiation board structure capable of enhancing LED heat sinking effect |
| 07/30/2008 | CN201093428Y Light fitting heat sinking structure |
| 07/30/2008 | CN201093380Y LED device without soldering |
| 07/30/2008 | CN201093373Y High luminance light source package structure |
| 07/30/2008 | CN201093366Y Three primary colors multiple chips power luminous tube with excellent hot gateway |
| 07/30/2008 | CN201093358Y LED display screen unit |
| 07/30/2008 | CN201093272Y High-power LED barrel lamp |
| 07/30/2008 | CN101233619A A package and manufacturing method for a microelectronic component |
| 07/30/2008 | CN101233616A Semiconductor element and electric device |
| 07/30/2008 | CN101233614A Capacitor-equipped semiconductor device |
| 07/30/2008 | CN101233613A Semiconductor device having improved mechanical and thermal reliability |
| 07/30/2008 | CN101233612A Metal-ceramic composite substrate and method for manufacturing same |
| 07/30/2008 | CN101233474A IC with on-die power-gating circuit |
| 07/30/2008 | CN101232795A Fan board and heat radiating device using the same |
| 07/30/2008 | CN101232794A Soaking plate and heat radiating device |
| 07/30/2008 | CN101232793A Thermal conduction heat radiating device for electronic components |
| 07/30/2008 | CN101232792A Heat radiating device, heat radiating base and manufacturing method thereof |
| 07/30/2008 | CN101232791A Fastener module and heat radiating device with the same |
| 07/30/2008 | CN101232783A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232779A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232778A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232777A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232776A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232775A Printed circuit board and method for producing the printed circuit board |
| 07/30/2008 | CN101232757A Driving system of light emitting element, and driving method thereof |
| 07/30/2008 | CN101232069A Packaging carrier of high luminance LED |
| 07/30/2008 | CN101232061A Luminous source packaging |
| 07/30/2008 | CN101232040A Light emitting device, driving method of light emitting device and electronic device |
| 07/30/2008 | CN101232038A Structure of high-density phase transition memory and process of preparation thereof |
| 07/30/2008 | CN101232037A Method for interconnecting multilayer phase transition memory array and lower layer peripheral circuit |
| 07/30/2008 | CN101232033A Image sensor module and the method of the same |
| 07/30/2008 | CN101232032A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/30/2008 | CN101232030A Method and apparatus for a semiconductor structure forming at least one via |
| 07/30/2008 | CN101232027A Light emitting device and its formation method |
| 07/30/2008 | CN101232023A Nonvolatile memory |
| 07/30/2008 | CN101232022A Semiconductor device comprising a barrier insulating layer and related method |
| 07/30/2008 | CN101232020A Semiconductor integrated circuit |
| 07/30/2008 | CN101232014A Organic illuminated display element and manufacturing method thereof |
| 07/30/2008 | CN101232013A Organic illuminated display element and manufacturing method thereof |
| 07/30/2008 | CN101232012A Stack type semiconductor packaging structure |
| 07/30/2008 | CN101232011A Stack type chip packaging structure and manufacturing method thereof |
| 07/30/2008 | CN101232010A Thick film mixed circuit device |
| 07/30/2008 | CN101232009A Mounting structures for integrated circuit modules |
| 07/30/2008 | CN101232008A Multi-chips package and method of forming the same |
| 07/30/2008 | CN101232007A Light emitting diode package, backlight unit and liquid crystal display having the same |
| 07/30/2008 | CN101232006A Multiple grains module device |
| 07/30/2008 | CN101232005A Alternating-current/direct-current converter of MCM (Multi crystal grain module) |
| 07/30/2008 | CN101232004A Chip stack package structure |
| 07/30/2008 | CN101232003A Chip safety wire and method for making the same |
| 07/30/2008 | CN101232002A Package with a marking structure and method of the same |
| 07/30/2008 | CN101232001A Semiconductor device and method of disconnecting fuse element |
| 07/30/2008 | CN101232000A Wireless overall interconnect line based on aluminum nitride heat conduction layer |
| 07/30/2008 | CN101231999A Method of manufacturing semiconductor integrated circuit |
| 07/30/2008 | CN101231998A Circuit component |
| 07/30/2008 | CN101231997A Circuit component |
| 07/30/2008 | CN101231996A Circuit component |