| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/31/2008 | WO2008091474A2 Stackable leadless electronic package |
| 07/31/2008 | WO2008091454A1 Direct applied monolithic printed circuit technology |
| 07/31/2008 | WO2008091221A2 Micropackaging method and devices |
| 07/31/2008 | WO2008091023A1 Semiconductor device comprising electromigration prevention film and manufacturing method thereof |
| 07/31/2008 | WO2008090995A1 Inductor |
| 07/31/2008 | WO2008090950A1 Film for sealing and semiconductor device using the same |
| 07/31/2008 | WO2008090855A1 Heat generation body cooling structure and drive device |
| 07/31/2008 | WO2008090726A1 Heat transfer apparatus |
| 07/31/2008 | WO2008090684A1 Flexible substrate and semiconductor device |
| 07/31/2008 | WO2008090023A1 Electronic component |
| 07/31/2008 | WO2008089711A1 Device for cooling components |
| 07/31/2008 | WO2008089599A1 Heat pipe having flat end face and method thereof |
| 07/31/2008 | WO2008067258A3 Semiconductor chip embedded in an insulator and having two-way heat extraction |
| 07/31/2008 | WO2008066903A3 Latch-up free vertical tvs diode array structure using trench isolation |
| 07/31/2008 | WO2008063148A3 Carbon nanotube reinforced metal composites |
| 07/31/2008 | WO2008054660A3 Wafer-level fabrication of lidded chips with electrodeposited dielectric coating |
| 07/31/2008 | WO2008042248A3 Method and apparatus for cooling non-native instrument in automatic test equipment |
| 07/31/2008 | WO2008021272A3 Semiconductor device and method for manufacturing a semiconductor device |
| 07/31/2008 | WO2007143505A3 Method and apparatus for automatically processing multiple applications in a predetermined order to affect multi-application sequencing |
| 07/31/2008 | WO2007120769A3 Low inductance bond-wireless co-package for high power density devices, especially for igbts and diodes |
| 07/31/2008 | WO2007109133B1 Improved chip-scale package |
| 07/31/2008 | WO2006052382A3 Leadframe for a semiconductor device |
| 07/31/2008 | WO2006015187A3 System and method for assembly of semiconductor dies to flexible circuits |
| 07/31/2008 | WO2005121681B1 Counter flow micro heat exchanger for optimal performance |
| 07/31/2008 | WO2004077896A3 Multi-die semiconductor package |
| 07/31/2008 | US20080182364 Integrated Circuit Device Package Having Both Wire Bond and Flip-Chip Interconnections and Method of Making the Same |
| 07/31/2008 | US20080180924 Microwave surface mount hermetically sealed package and method of forming the same |
| 07/31/2008 | US20080180668 Marker structure for optical alignment of a substrate, a substrate including such a marker structure, an alignment method for aligning to such a marker structure, and a lithographic projection apparatus |
| 07/31/2008 | US20080180121 Probe card assembly and kit |
| 07/31/2008 | US20080180010 Electric box and cooling storage |
| 07/31/2008 | US20080179761 Semiconductor package having evaporated symbolization |
| 07/31/2008 | US20080179760 Method for producing a device and device |
| 07/31/2008 | US20080179759 Method for manufacturing semiconductor device, semiconductor device, electro-optical device, and electronic apparatus |
| 07/31/2008 | US20080179758 Stacked integrated circuit assembly |
| 07/31/2008 | US20080179757 Stacked semiconductor device and method of manufacturing the same |
| 07/31/2008 | US20080179756 Semiconductor structures including conductive vias and methods of making semiconductor structures |
| 07/31/2008 | US20080179755 Structure and method for creating reliable deep via connections in a silicon carrier |
| 07/31/2008 | US20080179754 Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device |
| 07/31/2008 | US20080179753 Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same |
| 07/31/2008 | US20080179752 Method of making semiconductor device and semiconductor device |
| 07/31/2008 | US20080179751 Manufacturing method of semiconductor devices and semiconductor device manufactured thereby |
| 07/31/2008 | US20080179750 Interconnections of an integrated electronic circuit |
| 07/31/2008 | US20080179749 Undoped polysilicon metal silicide wiring |
| 07/31/2008 | US20080179748 Interconnects having sealing structures to enable selective metal capping layers |
| 07/31/2008 | US20080179747 Method of manufacturing semiconductor apparatus, and semiconductor apparatus |
| 07/31/2008 | US20080179746 Wiring structures of semiconductor devices and methods of forming the same |
| 07/31/2008 | US20080179745 Localized alloying for improved bond reliability |
| 07/31/2008 | US20080179744 Circuit structure and process thereof |
| 07/31/2008 | US20080179742 Method and solution to grow charge-transfer complex salts |
| 07/31/2008 | US20080179741 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride |
| 07/31/2008 | US20080179740 Package substrate, method of fabricating the same and chip package |
| 07/31/2008 | US20080179739 Flip chip package with anti-floating structure |
| 07/31/2008 | US20080179738 Wiring board and semiconductor device |
| 07/31/2008 | US20080179737 Semiconductor device |
| 07/31/2008 | US20080179736 Chip cooling channels formed in wafer bonding gap |
| 07/31/2008 | US20080179735 System in package device |
| 07/31/2008 | US20080179734 Stacked package, method of manufacturing the same, and memory card having the stacked package |
| 07/31/2008 | US20080179733 Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package |
| 07/31/2008 | US20080179732 Working Method of Metal Material and Semiconductor Apparatus Fabricated by the Method |
| 07/31/2008 | US20080179731 Anti-Impact memory module |
| 07/31/2008 | US20080179730 Wafer Level CSP Packaging Concept |
| 07/31/2008 | US20080179729 Encapsulant cavity integrated circuit package system |
| 07/31/2008 | US20080179728 Laminated memory |
| 07/31/2008 | US20080179727 Semiconductor packages having immunity against void due to adhesive material and methods of fabricating the same |
| 07/31/2008 | US20080179726 Multi-chip semiconductor package and method for fabricating the same |
| 07/31/2008 | US20080179725 Package structure with circuits directly connected to semiconductor chip |
| 07/31/2008 | US20080179724 Microelectronics Package and Method |
| 07/31/2008 | US20080179723 Semiconductor device including a plural chips with protruding edges laminated on a die pad section that has a through section |
| 07/31/2008 | US20080179722 Electronic package structure |
| 07/31/2008 | US20080179721 Stacking of transfer carriers with aperture arrays as interconnection joints |
| 07/31/2008 | US20080179720 Lead frame for chip packages with wire-bonding at single-side pads |
| 07/31/2008 | US20080179719 Semiconductor device |
| 07/31/2008 | US20080179718 Semiconductor package with electromagnetic shielding capabilites |
| 07/31/2008 | US20080179717 Semiconductor package with electromagnetic shield |
| 07/31/2008 | US20080179716 Multilevel interconnects structure with shielding function and fabricating method thereof |
| 07/31/2008 | US20080179715 Shallow trench isolation using atomic layer deposition during fabrication of a semiconductor device |
| 07/31/2008 | US20080179714 Integrated multiple gate dielectric composition and thickness semiconductor chip and method of manufacturing the same |
| 07/31/2008 | US20080179713 Etching Technique For Creation of Thermally-Isolated Microstructures |
| 07/31/2008 | US20080179711 Substrate and semiconductor device using the same |
| 07/31/2008 | US20080179710 Semiconductor wafer with improved crack protection |
| 07/31/2008 | US20080179709 Integrated circuit fuse |
| 07/31/2008 | US20080179707 Semiconductor device having a fuse element |
| 07/31/2008 | US20080179706 Electronically programmable fuse having anode and link surrounded by low dielectric constant material |
| 07/31/2008 | US20080179669 Integrated circuit having a semiconductor arrangement |
| 07/31/2008 | US20080179592 Display device |
| 07/31/2008 | US20080179187 Heterocyclic nitrogen containing polymers coated analyte monitoring device and methods of use |
| 07/31/2008 | US20080178999 Forming plated through hole; surface roughness facilitates deposition of conductive metal; shrinkage inhibition |
| 07/31/2008 | US20080178723 Semiconductor device manufacturing method and manufacturing apparatus |
| 07/31/2008 | US20080178463 Modular board device, high frequency module, and method of manufacturing the same |
| 07/31/2008 | DE4321592B4 Halbleitervorrichtungen sowie ein Chipauflage-Trägerteil und ein Tape-Carrier-Gehäuse hierfür Semiconductor devices and chip-bearing support member and a tape carrier package for this |
| 07/31/2008 | DE19818824B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production |
| 07/31/2008 | DE19646369B4 Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung Ceramic multi-layer circuit, and process for their preparation |
| 07/31/2008 | DE112006000957T5 Wärmesenke für ein Leistungsmodul A heat sink for a power module |
| 07/31/2008 | DE10354443B4 Halbleiterbauelementanordnung mit einer Defekterkennungsschaltung A semiconductor device assembly with a defect detection circuit |
| 07/31/2008 | DE10354112B4 Verfahren und Anordnung zur Reparatur von Speicherchips mittels Mikro-Lithographie-Verfahren Method and apparatus for repairing memory chips using micro-lithography process |
| 07/31/2008 | DE10314503B4 Verbesserte integrierte Halbleiterstruktur für Zuverlässigkeitsprüfungen von Dielektrika Improved integrated semiconductor structure for reliability testing of dielectrics |
| 07/31/2008 | DE10232146B4 Kühlsystem für integrierten Schaltkreischip A cooling system for integrated circuit chip |
| 07/31/2008 | DE102008004443A1 Modular package for solid state light emitting device, has thermoset package body formed on leadframe and surrounding die mounting region, and on top and bottom surfaces of reduced thickness region |
| 07/31/2008 | DE102008004183A1 Integrated circuit device has several carbon nanotubes that are formed in opening of insulation layer so that nanotubes are electrically connected to copper pattern through catalyst metal layer and barrier layer |
| 07/31/2008 | DE102008003156A1 Mehrchip-Packung und Verfahren zu ihrer Ausbildung Multi-chip package and method for their education |