Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/06/2008CN101236943A Heat-radiation no-chip board film base plate with built-in chip and its making method
08/06/2008CN101236942A IC base plate and its making method
08/06/2008CN101236941A Semiconductor device and method of manufacturing the same
08/06/2008CN101236940A Line structure for reconfiguration line layer
08/06/2008CN101236939A Semiconductor encapsulation device
08/06/2008CN101236938A Heat radiation method and structure of chip package module
08/06/2008CN101236937A Heat radiator improvement for attached heat pipe
08/06/2008CN101236936A Aluminum heat radiator for semiconductor part
08/06/2008CN101236935A Bearer with built-in part and its making method
08/06/2008CN101236934A Plane grid array encapsulation structure
08/06/2008CN101236927A Contact window self-aligning and its making method
08/06/2008CN101236923A Integrated circuit (IC) chip with vertical plate capacitors and method of making the capacitors
08/06/2008CN101236920A Semiconductor wafer with improved crack protection
08/06/2008CN101236918A Method of manufacturing semiconductor apparatus, and semiconductor apparatus
08/06/2008CN101236917A Contact forming method on adjacent underlay and related semiconductor device
08/06/2008CN101236910A Method for electrically connecting semiconductor member to substrate and semiconductor structure
08/06/2008CN101236909A Chip package structure and its package method
08/06/2008CN101236907A Method and its line layout for cutting signal line on the circuit board
08/06/2008CN101236773A Classification device and burning device for integrated circuit encapsulation chip
08/06/2008CN101235962A LED illuminating panel
08/06/2008CN101234746A Apparatus and method for housing micromechanical systems
08/06/2008CN100409445C Semiconductor device and ferroelectric memory, and method for manufacturing semiconductor device
08/06/2008CN100409443C Semiconductor die package with semiconductor die having side electrical connection
08/06/2008CN100409439C Electrostatic discharge protection circuit and semiconductor circuit with same
08/06/2008CN100409438C Protection circuit, semiconductor component, integrate circuit and memory component
08/06/2008CN100409437C Multistage interconnection structure and method of forming cu interconnection on IC wafer
08/06/2008CN100409436C Application method of press welding block on top of logic integrated circuit
08/06/2008CN100409435C Electric circuit elements, electric circuit assembly, electric circuit built-in modules and manufacture thereof
08/06/2008CN100409434C Semiconductor modules and manufacture method thereof
08/06/2008CN100409433C Capping method and heat pipe manufacturing method using capping
08/06/2008CN100409432C Thermoelectric spot coolers for RF and microwave communication integrated circuits
08/06/2008CN100409431C Semiconductor device and method for manufacturing the same
08/06/2008CN100409430C Semiconductor device and method for assembling the same
08/06/2008CN100409429C Semiconductor packaging element and method for packaging semiconductor
08/06/2008CN100409425C Fabrication process and using method for three dimensional structure memory
08/06/2008CN100409422C Lead ring and semiconductor device, lead joint method and lead joint device
08/06/2008CN100409420C Semiconductor device and method of manufacturing thereof
08/06/2008CN100409274C Radiator for flat display device
08/06/2008CN100409015C Test structures for estimating dishing and erosion effects in copper damascene technology
08/06/2008CN100408963C Composite heat sink with metal base and graphite fins
08/06/2008CN100408647C Photocurable adhesive compositions, reaction products of which have low halide ion content
08/06/2008CN100408470C Microchip with thermal stress relief means
08/05/2008US7409648 Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit
08/05/2008US7409200 Module integration integrated circuits
08/05/2008US7409190 Radio-frequency circuit module and radio communication apparatus
08/05/2008US7408787 Phase change thermal interface materials including polyester resin
08/05/2008US7408785 Structure for mounting electronic component on wiring board
08/05/2008US7408773 Reinforced air shroud
08/05/2008US7408434 Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package
08/05/2008US7408265 Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
08/05/2008US7408264 SMT passive device noflow underfill methodology and structure
08/05/2008US7408263 Anisotropic conductive coatings and electronic devices
08/05/2008US7408262 Semiconductor integrated circuit device
08/05/2008US7408261 BGA package board and method for manufacturing the same
08/05/2008US7408260 Microelectronic assemblies having compliant layers
08/05/2008US7408259 Release sheet and a protective film forming layer of a thermosetting or energy ray-curable component and binder component formed on a detachable surface of the release sheet
08/05/2008US7408258 Interconnection circuit and electronic module utilizing same
08/05/2008US7408257 Packaging chip and packaging method thereof
08/05/2008US7408256 Integrated circuit chip module
08/05/2008US7408255 Assembly for stacked BGA packages
08/05/2008US7408254 Stack land grid array package and method for manufacturing the same
08/05/2008US7408253 Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density
08/05/2008US7408252 Semiconductor device and a manufacturing method of the same
08/05/2008US7408251 Semiconductor packaging device comprising a semiconductor chip including a MOSFET
08/05/2008US7408250 Micromirror array device with compliant adhesive
08/05/2008US7408249 Packaged integrated circuits and methods of producing thereof
08/05/2008US7408248 Lead frame for semiconductor device
08/05/2008US7408246 Controlling warping in integrated circuit devices
08/05/2008US7408245 IC package encapsulating a chip under asymmetric single-side leads
08/05/2008US7408244 Semiconductor package and stack arrangement thereof
08/05/2008US7408243 High temperature package flip-chip bonding to ceramic
08/05/2008US7408242 Carrier with reinforced leads that are to be connected to a chip
08/05/2008US7408239 Capture of residual refractory metal within semiconductor device
08/05/2008US7408228 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
08/05/2008US7408226 Electronic card with protection against aerial discharge
08/05/2008US7408225 Apparatus and method for forming thin film using upstream and downstream exhaust mechanisms
08/05/2008US7408218 Semiconductor device having plural dram memory cells and a logic circuit
08/05/2008US7408205 Digital camera module
08/05/2008US7408204 Flip-chip packaging structure for light emitting diode and method thereof
08/05/2008US7408189 Method of testing FPC bonding yield and FPC having testing pads thereon
08/05/2008US7407883 Electronic package with improved current carrying capability and method of forming the same
08/05/2008US7407880 Semiconductor device and manufacturing process therefore
08/05/2008US7407879 Chemical planarization performance for copper/low-k interconnect structures
08/05/2008US7407877 Self-coplanarity bumping shape for flip-chip
08/05/2008US7407839 Method of manufacturing active matrix substrate with height control member
08/05/2008US7407836 High-voltage module and method for producing same
08/05/2008US7407835 Localized slots for stress relieve in copper
08/05/2008US7407834 Manufacturing method of a semiconductor device
08/05/2008US7407833 Process for fabricating chip package structure
08/05/2008US7407614 Method for forming at least one protective cap
08/05/2008CA2445464C Raised on-chip inductor and method of manufacturing same
08/05/2008CA2290802C Electronic power component with means of cooling
07/2008
07/31/2008WO2008091985A2 Dielectric cap having material with optical band gap to substantially block uv radiation during curing treatment, and related methods
07/31/2008WO2008091923A2 Removal of etching process residual in semiconductor fabrication
07/31/2008WO2008091922A2 Semiconductor package having evaporated symbolization
07/31/2008WO2008091919A2 Thermally enhanced single in-line package (sip)
07/31/2008WO2008091840A2 Stress free package and laminate-based isolator package
07/31/2008WO2008091742A2 Pre-molded clip structure
07/31/2008WO2008091717A1 Wafer level csp packaging concept
07/31/2008WO2008091558A1 Hybrid interconnect structure for performance improvement and reliability enhancement
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