Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/07/2008WO2008093808A1 Heat spreader module, method for manufacturing the heat spreader module, and heat sink
08/07/2008WO2008093586A1 Resin-encapsulated semiconductor device and its manufacturing method
08/07/2008WO2008093579A1 Multilayer body, method for producing substrate, substrate and semiconductor device
08/07/2008WO2008093549A1 Substrate module
08/07/2008WO2008093531A1 Semiconductor device and method for manufacturing the same
08/07/2008WO2008093414A1 Semiconductor device and method for manufacturing the same
08/07/2008WO2008093273A2 Sensing circuit for devices with protective coating
08/07/2008WO2008092635A1 Heat transport assembly
08/07/2008WO2008092414A1 Method for the production of a pluggable connection contact on a semiconductor module and semiconductor module produced by this method
08/07/2008WO2008073707A3 Liquid metal thermal interface material system
08/07/2008WO2008045382A3 A sealed photovoltaic apparatus
08/07/2008WO2007123505A3 Microelectromechanical system assembly and method for manufacturing thereof
08/07/2008US20080188578 Precursors for Porous Low-Dielectric Constant Materials for Use in Electronic Devices
08/07/2008US20080188110 Ic Socket
08/07/2008US20080188085 Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
08/07/2008US20080188075 Semiconductor device and production method therefor
08/07/2008US20080188071 Low fabrication cost, fine pitch and high reliability solder bump
08/07/2008US20080188047 Electrostatic discharge protection device and method of fabricating the same
08/07/2008US20080188045 Methods for operating and fabricating a semiconductor device having a buried guard ring structure
08/07/2008US20080187843 Preventing damage of moisture resistant ring pattern by static electricity
08/07/2008US20080187613 Method of manufacturing wafer-level chip-size package and molding apparatus used in the method
08/07/2008US20080187113 Methods and Systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system
08/07/2008US20080186788 Electrical fuse and associated methods
08/07/2008US20080186763 Twin MONOS array for high speed application
08/07/2008US20080186583 Optical device and method of manufacturing the same
08/07/2008US20080185741 Semiconductor device having dummy pattern
08/07/2008US20080185740 Semiconductor and Method For Producing the Same
08/07/2008US20080185739 Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same
08/07/2008US20080185738 Semiconductor device and method of manufacturing the same
08/07/2008US20080185737 Integrated circuit system with pre-configured bond wire ball
08/07/2008US20080185736 Multiple selectable function integrated circuit module
08/07/2008US20080185735 Dynamic pad size to reduce solder fatigue
08/07/2008US20080185734 Power control structure for managing a plurality of voltage islands
08/07/2008US20080185733 Lsi package provided with interface module, and transmission line header employed in the package
08/07/2008US20080185732 Stacked structure using semiconductor devices and semiconductor device package including the same
08/07/2008US20080185731 Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips
08/07/2008US20080185730 Memory cell device with coplanar electrode surface and method
08/07/2008US20080185729 Semiconductor element unit and complex thereof, semiconductor device and module thereof, assembled structure thereof and film substrate connection structure
08/07/2008US20080185728 Microelectronic Circuit Structure With Layered Low Dielectric Constant Regions And Method Of Forming Same
08/07/2008US20080185727 Semiconductor device capable of selecting wiring connection mode by controlling via formation
08/07/2008US20080185726 Semiconductor package substrate
08/07/2008US20080185725 Semiconductor substrate
08/07/2008US20080185724 Aluminum-based interconnection in bond pad layer
08/07/2008US20080185723 Semiconductor device
08/07/2008US20080185722 Formation process of interconnect structures with air-gaps and sidewall spacers
08/07/2008US20080185721 Semiconductor device and method of manufacturing the same
08/07/2008US20080185720 Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse
08/07/2008US20080185719 Integrated circuit packaging system with interposer
08/07/2008US20080185718 Nanostructure-Based Package Interconnect
08/07/2008US20080185717 Semiconductor device including bump electrodes
08/07/2008US20080185716 Bump structure having a reinforcement member and manufacturing method thereof
08/07/2008US20080185715 Semiconductor device and method
08/07/2008US20080185714 Methods of forming channels on an integrated circuit die and die cooling systems including such channels
08/07/2008US20080185713 Heat dissipating device with preselected designed interface for thermal interface materials
08/07/2008US20080185712 Semiconductor device and method for manufacturing the same
08/07/2008US20080185711 Semiconductor package substrate
08/07/2008US20080185710 Chip package and process thereof
08/07/2008US20080185709 Semiconductor device including semiconductor elements and method of producing semiconductor device
08/07/2008US20080185708 Stackable semiconductor package having metal pin within through hole of package
08/07/2008US20080185707 Semiconductor package structure and method for manufacturing the same
08/07/2008US20080185706 Package and method for making the same
08/07/2008US20080185705 Microelectronic packages and methods therefor
08/07/2008US20080185704 Carrier plate structure havign a chip embedded therein and the manufacturing method of the same
08/07/2008US20080185703 Injection molded soldering process and arrangement for three-dimensional structures
08/07/2008US20080185702 Multi-chip package system with multiple substrates
08/07/2008US20080185701 Hermetically Sealed Package and Methods of Making the Same
08/07/2008US20080185700 Secure attachment to wafer chip from dicing through drying steps; laminated olefin polymer and polyimide; uniform thickness and shear strength; impact, moisture and heat resistance
08/07/2008US20080185699 Microelectromechanical system package and the method for manufacturing the same
08/07/2008US20080185698 Semiconductor package structure and carrier structure
08/07/2008US20080185697 Chip package structure and method of fabricating the same
08/07/2008US20080185696 Semiconductor die package including leadframe with die attach pad with folded edge
08/07/2008US20080185695 Package-on-package device and method for manufacturing the same by using a leadframe
08/07/2008US20080185694 Processes of Manufacturing Portable Electronic Storage Devices Utilizing Lead Frame Connectors
08/07/2008US20080185693 Integrated circuit package system with integral inner lead and paddle
08/07/2008US20080185692 Package-level electromagnetic interference shielding
08/07/2008US20080185689 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
08/07/2008US20080185686 Electronic device with connection bumps
08/07/2008US20080185685 Semiconductor device
08/07/2008US20080185675 Trench Isolation Structure and a Method of Manufacture Therefor
08/07/2008US20080185652 Simultaneous Conditioning of a Plurality of Memory Cells Through Series Resistors
08/07/2008US20080185631 Dielectric layer for semiconductor device and method of manufacturing the same
08/07/2008US20080185616 Semiconductor device-based sensors and methods associated with the same
08/07/2008US20080185610 Resin-sealed semiconductor light receiving element, manufacturing method thereof and electronic device using the same
08/07/2008US20080185586 High performance sub-system design and assembly
08/07/2008US20080185585 Imaging device equipped with a last copper and aluminum based interconnection level
08/07/2008US20080185584 Semiconductor device test structures and methods
08/07/2008US20080185583 Structure and method for monitoring and characterizing pattern density dependence on thermal absorption in a semiconductor manufacturing process
08/07/2008US20080185582 Portable memory devices
08/07/2008US20080185581 Silicon-on-insulator ("SOI") transistor test structure for measuring body-effect
08/07/2008US20080185182 Electrical unit for boat and outboard motor
08/07/2008US20080185178 Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
08/07/2008US20080184556 Connection structure of circuit substrate
08/07/2008DE19911916B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit Schutzlage A process for producing a semiconductor device with protective layer
08/07/2008DE19782232B4 Kühlvorrichtung und Verfahren zum Kühlen eines elektronischen Gerätes Cooling apparatus and method for cooling an electronic device
08/07/2008DE10392524B4 Vorrichtungen mit spannungsvariablem Material zur direkten Anwendung Devices with voltage variable material for direct application
08/07/2008DE10331522B4 Verfahren zur Reduzierung von Geistbildartefakten bei einem digitalen Detektor Method for reducing ghost image artifacts in a digital detector
08/07/2008DE102008016360A1 Contact element producing method for use in projection illumination system, involves applying contact structure in retaining structure, where insulating areas of contact structure are arranged in free intermediate area of structure
08/07/2008DE102008006919A1 Verdrahtungsstruktur eines Halbleiterbauelements und Verfahren zur Herstellung desselben Of the same wiring structure of a semiconductor device and methods for making
08/07/2008DE102008006129A1 Elektromagnetische Bandlückenstruktur und Leiterplatte Electromagnetic bandgap structure and printed circuit board
08/07/2008DE102007061563A1 Elektronische 3D-Packungsstruktur mit verbesserter Erdungsleitung und eingebauter Antenne Electronic 3D package structure with improved ground line, and built-in antenna
1 ... 894 895 896 897 898 899 900 901 902 903 904 905 906 907 908 909 910 911 912 913 914 ... 2262