Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/07/2008DE102007039624A1 Halbleitervorrichtung mit Schaltelement und zwei Dioden A semiconductor device comprising switching element and two diodes
08/07/2008DE102007032387A1 Semiconductor device for power semiconductor engineering area has intermetal dielectric between conducting path layers by insulated filling layer such that silicon oxygen nitride layer is formed on dielectric
08/07/2008DE102007017113A1 Halbleiterbauelement mit einer optisch aktiven Schicht, Anordnung mit einer Vielzahl von optisch aktiven Schichten und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device with an optically active layer assembly comprising a plurality of optically active layers, and method of manufacturing a semiconductor device
08/07/2008DE102007005692A1 Electro optical illuminant for use as organic light emitting diode, has organic light emitting material between two electrodes, where two electrodes are transparent anode and geometric structure cathode
08/07/2008DE102007005233A1 Power module for use in e.g. frequency converter, has heat conducting, electrically isolating and outward sealing material formed around chip with substrate such that flat structure is coupleable with cooling medium
08/07/2008DE102007003824A1 Template for applying material layer on uneven surface, has openings including cross-sectional surfaces, where each cross-sectional surface is proportional to length, width and thickness of area of material layer with constant thickness
08/07/2008DE102007003587A1 Leistungshalbleitermodul mit Druckkörper Power semiconductor module with a pressure body
08/07/2008DE102007003568A1 Kühlvorrichtung für eine zu kühlende elektronische Einrichtung Cooling device for electronic device to be cooled
08/07/2008DE102005050534B4 Leistungshalbleitermodul The power semiconductor module
08/07/2008DE102005026233B4 Elektrisches Leistungsmodul Electrical power module
08/07/2008DE102005025160B4 Verfahren zum Löschen von in einer Schaltung auftretenden Latch-Ups sowie Anordnungen zum Durchführen des Verfahrens A method of erasing occurring in a circuit latch-up, as well as arrangements for carrying out the method
08/06/2008EP1954114A1 Use of an adhesive composition for die-attaching high power semiconductors
08/06/2008EP1953822A1 Printed circuit board and manufacturing method thereof
08/06/2008EP1953821A2 Semiconductor package substrate
08/06/2008EP1953820A1 High performance semiconductor module
08/06/2008EP1953819A1 Semiconductor package, electronic parts, and electronic device
08/06/2008EP1953818A1 Electronic component mounting board and method for manufacturing such board
08/06/2008EP1953814A1 Wafer level package structure and method for manufacturing same
08/06/2008EP1953809A2 Method for depositing metal films by CVD on diffusion barrier layers
08/06/2008EP1953250A1 Metallic material, electronic component, electronic device and electronic optical component manufactured by using the metallic material and working method of the metallic material
08/06/2008EP1953181A1 Resin composition, varnish, resin film and semiconductor device
08/06/2008EP1952682A2 Method and apparatus for establishing optimal thermal contact between opposing surfaces
08/06/2008EP1952440A2 Metal cuboid semiconductor device and method
08/06/2008EP1952439A2 Semiconductor device comprising a housing containing a triggering unit
08/06/2008EP1952435A1 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line
08/06/2008EP1952432A1 Method for bonding electronic components
08/06/2008EP1952315A2 Manufacturing method and device for making an in-mold circuit comprising a chip
08/06/2008EP1951929A1 Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film
08/06/2008EP1745507B1 Twin fin arrayed cooling devices
08/06/2008EP1558679B1 Heat conductive silicone composition
08/06/2008EP1286579B1 Multilayer printed wiring board
08/06/2008CN201097474Y A heat radiation device for improving heat radiation efficiency
08/06/2008CN201097401Y Low capacitance over-voltage protection part
08/06/2008CN201097400Y 薄膜晶体管阵列基板 The thin film transistor array substrate
08/06/2008CN201097296Y Heat radiation fin buckle structure for novel portable computer
08/06/2008CN201097295Y Heat radiation fin buckle structure for portable computer
08/06/2008CN201096332Y LED lighting lamp directly switching 220v alternating-current electric network
08/06/2008CN201096322Y Bonded type power -type LED bracket
08/06/2008CN201096315Y Infrared light source device
08/06/2008CN201096294Y Power -type indoor LED lamp
08/06/2008CN201096285Y Single end LED energy conserving lamp and its driver circuit
08/06/2008CN101238763A Method of forming conductive pattern and wiring board
08/06/2008CN101238762A Surface mounting component having magnetic layer thereon and method of forming same
08/06/2008CN101238585A Ldmos晶体管 Ldmos transistor
08/06/2008CN101238577A Method of reducing warpage in an over-molded IC package
08/06/2008CN101238576A Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
08/06/2008CN101238575A Heat radiator and its making method
08/06/2008CN101238574A Semiconductor device with supporting structure for isolation and passivation layers
08/06/2008CN101238572A Methods of forming through-wafer interconnects and structures resulting therefrom
08/06/2008CN101238570A Semiconductor device and its making method
08/06/2008CN101238563A Method for making electronic devices
08/06/2008CN101238556A Method and apparatus for producing porous silica
08/06/2008CN101238555A Interlayer insulating film and wiring structure, and process for producing the same
08/06/2008CN101238542A Vacuum device
08/06/2008CN101238202A Thermally conductive grease
08/06/2008CN101237759A Electronic apparatus and fin unit
08/06/2008CN101237758A Thermal fin and method for positioning the same
08/06/2008CN101237757A Heat radiator
08/06/2008CN101237756A Electronic device and its heat radiation module
08/06/2008CN101237755A Disorderly current heat radiation top cover of heating part and heat radiation assembly with this top cover
08/06/2008CN101237754A Disorderly current heat radiator and heat radiation assembly with this radiator
08/06/2008CN101237746A Electronic board incorporating a heater wire
08/06/2008CN101237531A Pixel circuit of cmos image sensor and structure of the same and operation
08/06/2008CN101237219A Oscillator
08/06/2008CN101237004A Multi-channel optical coupling device, fabrication method thereof, electronic equipment, and lead frame member
08/06/2008CN101236996A Resin-sealed semiconductor light receiving element, manufacturing method thereof and electronic device using the same
08/06/2008CN101236992A Thin film transistor and method of manufacturing the same
08/06/2008CN101236985A Memory cell device with coplanar electrode surface and method
08/06/2008CN101236984A Integrated circuit with magnetic memory
08/06/2008CN101236983A Solid-state imaging device
08/06/2008CN101236982A Image pick-up device
08/06/2008CN101236976A Active part array base plate, photoelectric device and its making method
08/06/2008CN101236975A Thin film transistor array base plate and its making method
08/06/2008CN101236974A Array substrate and display apparatus having the same
08/06/2008CN101236972A Thin film transistor substrate
08/06/2008CN101236971A Thin film transistor substrate and display device therefor
08/06/2008CN101236969A Static RAM component
08/06/2008CN101236967A A built-in controllable silicon for reverse phase part
08/06/2008CN101236966A CCD output node with single-hold structure
08/06/2008CN101236965A Semiconductor integrated circuit device
08/06/2008CN101236964A Semiconductor device including switching element and two diodes
08/06/2008CN101236963A Semiconductor device and packaging structure therefor
08/06/2008CN101236962A Multi-chip stacking structure and its making method
08/06/2008CN101236960A Multifold LED device for mine lamp
08/06/2008CN101236959A Encapsulation structure for multi-chip interleaving stack
08/06/2008CN101236958A Semiconductor package
08/06/2008CN101236957A Conductive layer structure for chip encapsulation module and its making method
08/06/2008CN101236956A Method for sensing a signal in an integrated circuit complementary fuse arrangement
08/06/2008CN101236955A 半导体器件 Semiconductor devices
08/06/2008CN101236954A Wiring structures of semiconductor devices and methods of forming the same
08/06/2008CN101236953A Thin film transistor array base plate and its making method
08/06/2008CN101236952A Micro-chip connector for connecting multiple chips and its making method
08/06/2008CN101236951A Semiconductor structure and its making method
08/06/2008CN101236950A Low-temperature common burning porcelain base plate and its making method and its semiconductor encapsulation device
08/06/2008CN101236949A Printed circuit board and manufacturing method thereof
08/06/2008CN101236948A Common base plate and semiconductor device using this common base plate
08/06/2008CN101236947A Semiconductor device with novel package structure
08/06/2008CN101236946A 布线板和半导体器件 Wiring boards and semiconductor devices
08/06/2008CN101236945A Electronic part with electromagnetic interference shielding action and its encapsulation method
08/06/2008CN101236944A Added layer encapsulation structure for photoelectric chip and its method
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