Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/13/2008CN101241284A Substrate for electro-optical device, electro-optical device, and electronic apparatus
08/13/2008CN101240892A High heat dispersion LED road lamp
08/13/2008CN100411261C 半导体装置 Semiconductor device
08/13/2008CN100411257C Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
08/13/2008CN100411204C Light-emitting diode thermal management system
08/13/2008CN100411193C Manufacturing method of thin film transistor array panel
08/13/2008CN100411172C 半导体器件 Semiconductor devices
08/13/2008CN100411170C Stack architecture of multiple chips
08/13/2008CN100411169C Apparatus and methods for cooling semiconductor integrated circuit chip packages
08/13/2008CN100411168C Electrostatic discharge ring structure
08/13/2008CN100411167C Static discharge protection circuit and method for dissipating static charge
08/13/2008CN100411166C ESD protection circuit and its control method
08/13/2008CN100411165C Integrate circuit and method producing the same
08/13/2008CN100411164C Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
08/13/2008CN100411163C Semiconductor device of chip on film
08/13/2008CN100411162C Semiconductor device
08/13/2008CN100411161C Semiconductor device and method of manufacturing same
08/13/2008CN100411160C Heat radiation structure of semiconductor device, and manufacturing method thereof
08/13/2008CN100411159C Semiconductor parts and method for manufacturing integrate circuit chip
08/13/2008CN100411158C Process for preparing silumin electronic package materials
08/13/2008CN100411157C Process for preparing silumin electronic package materials
08/13/2008CN100411156C Resin-sealed semiconductor device and method of manufacturing the same
08/13/2008CN100411155C Laminated electronic part and its manufacturing method
08/13/2008CN100411154C 电路装置及其制造方法 Circuit device and manufacturing method thereof
08/13/2008CN100411139C Special semiconductor circuit and resource configuration method for semiconductor circuit driver
08/13/2008CN100411135C Method for producing a spiral inductance on a substrate, and a device fabricated according to such a method
08/13/2008CN100411127C Semiconductor device and manufacturing method of the same
08/13/2008CN100411126C System and a method for fluid filling wafer level packages
08/13/2008CN100411123C Semiconductor buried base plate structure and its manufacturing method
08/13/2008CN100411122C Optical device manufacturing method
08/13/2008CN100411121C Radiating pack structure and production thereof
08/13/2008CN100411120C Method of manufacturing a semiconductor device by using a matrix frame
08/13/2008CN100411086C Manufacturing method of thin film element, thin film transistor circuit board, active matrix display device
08/13/2008CN100410676C Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same
08/13/2008CN100410420C Low dielectric constant interlayer dielectric film and method of forming the same
08/12/2008US7411793 Optical disk device
08/12/2008US7411792 Thermal switch, methods of use and manufacturing methods for same
08/12/2008US7411791 Extendable heat dissipation apparatus
08/12/2008US7411790 Heat sink with built-in heat pipes for semiconductor packages
08/12/2008US7411767 Multi-domain ESD protection circuit structure
08/12/2008US7411327 Heat-emitting element cooling apparatus
08/12/2008US7411306 Packaging structure and method of an image sensor module
08/12/2008US7411305 Interconnect structure encased with high and low k interlevel dielectrics
08/12/2008US7411304 Semiconductor interconnect having conductive spring contacts
08/12/2008US7411303 Semiconductor assembly having substrate with electroplated contact pads
08/12/2008US7411302 Semiconductor device and a method of manufacturing the same and designing the same
08/12/2008US7411301 Semiconductor integrated circuit device
08/12/2008US7411300 Agglomeration control using early transition metal alloys
08/12/2008US7411299 Passivation film of semiconductor device
08/12/2008US7411298 Source/drain electrodes, thin-film transistor substrates, manufacture methods thereof, and display devices
08/12/2008US7411297 Microfeature devices and methods for manufacturing microfeature devices
08/12/2008US7411296 Method, system, and apparatus for gravity assisted chip attachment
08/12/2008US7411295 Circuit board, device mounting structure, device mounting method, and electronic apparatus
08/12/2008US7411294 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer
08/12/2008US7411293 Flash memory card
08/12/2008US7411292 Flash memory card
08/12/2008US7411291 Component with sensitive component structures and method for the production thereof
08/12/2008US7411290 Integrated circuit chip and method for cooling an integrated circuit chip
08/12/2008US7411289 Integrated circuit package with partially exposed contact pads and process for fabricating the same
08/12/2008US7411288 Semiconductor device
08/12/2008US7411287 Staggered wirebonding configuration
08/12/2008US7411286 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
08/12/2008US7411285 Low profile stacked semiconductor chip package
08/12/2008US7411284 Accessible electronic storage apparatus
08/12/2008US7411283 Interconnect design for reducing radiated emissions
08/12/2008US7411282 LSI package provided with interface module, and transmission line header employed in the package
08/12/2008US7411281 Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
08/12/2008US7411280 Chip support of a leadframe for an integrated circuit package
08/12/2008US7411278 Package device with electromagnetic interference shield
08/12/2008US7411277 Semiconductor integrated circuit having shield wiring
08/12/2008US7411275 Semiconductor device comprising an inorganic insulating film and method of manufacturing the same
08/12/2008US7411267 Semiconductor integrated circuit device
08/12/2008US7411259 Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof
08/12/2008US7411257 Semiconductor device having guard ring and manufacturing method thereof
08/12/2008US7411256 Semiconductor integrated circuit device capacitive node interconnect
08/12/2008US7411252 Substrate backgate for trigate FET
08/12/2008US7411251 Self protecting NLDMOS, DMOS and extended voltage NMOS devices
08/12/2008US7411240 Integrated circuits including spacers that extend beneath a conductive line
08/12/2008US7411228 Integrated circuit chip and manufacturing process thereof
08/12/2008US7411211 Contact structure and semiconductor device
08/12/2008US7411210 Semiconductor probe with resistive tip having metal shield thereon
08/12/2008US7411179 Photodetector module with impedance matching
08/12/2008US7410919 Mask and substrate alignment for solder bump process
08/12/2008US7410915 Method of forming carbon polymer film using plasma CVD
08/12/2008US7410898 Methods of fabricating interconnects for semiconductor components
08/12/2008US7410896 Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof
08/12/2008US7410872 Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure
08/12/2008US7410835 Method for fabricating semiconductor package with short-prevented lead frame
08/12/2008US7410834 Method of manufacturing a semiconductor device
08/12/2008US7410833 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
08/12/2008US7410827 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
08/12/2008US7410673 Smooth board and process for preparing a smooth board
08/12/2008US7410666 Metal nitride carbide deposition by ALD
08/12/2008CA2280865C Aerosol method and apparatus, particulate products, and electronic devices made therefrom
08/07/2008WO2008094792A1 Novel air gap integration scheme
08/07/2008WO2008094714A1 Varied solder mask opening diameters within a ball grid array substrate
08/07/2008WO2008094654A1 Method of forming vias in a semiconductor device
08/07/2008WO2008094646A1 Chip cooling channels formed in wafer bonding gap
08/07/2008WO2008094352A1 Three dimensional multilayer barrier and method of making
08/07/2008WO2008093809A1 Method of producing cast and cast
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