Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/14/2008DE102008007237A1 Halbleiter-Bildeinheit mit einer Die-Aufnahmebohrung und Verfahren zu deren Herstellung Solid-state imaging unit having a die receiving bore and processes for their preparation
08/14/2008DE102008005932A1 Halbleiter-ESD-Bauelement und Verfahren zum Herstellen desselben Of the same semiconductor ESD device and method for producing
08/14/2008DE102008005203A1 Integrated circuit arrangement for level-adjusted control of external electronic load, has monitoring and control device controlling switching elements such that bulk area is connected with error-free connected potential connector
08/14/2008DE102008003854A1 Halbleitervorrichtung und Verfahren zum Steuern ihrer Muster Semiconductor device and method for controlling their pattern
08/14/2008DE102007037654A1 Halbleiterbauelement Semiconductor device
08/14/2008DE102007006515A1 Spring contact for use in contact device for contacting semiconductor chip with electronic device, has contact section having sectional axis that coincides with tangent or passant to cladding surface, where surface covers spring extensively
08/14/2008DE102007006175A1 Heat conducting layer for use with optoelectronic arrangement, has two main surfaces and multiple heat conducting elements that are arranged on former main surface and has preferred directions, which cuts former main surface
08/14/2008DE102007004867A1 Erhöhen der Zuverlässigkeit von kupferbasierten Metallisierungsstrukturen in einem Mikrostrukturbauelement durch Anwenden von Aluminiumnitrid Increasing the reliability of copper-based metallization in a microstructure device by applying aluminum nitride
08/14/2008DE102007004844A1 Verfahren zur Herstellung eines Bauteils und Bauteil A method for producing a component and component
08/14/2008DE102006025613B4 Temperatursensor Temperature sensor
08/14/2008DE102006007093B4 Verfahren zur Herstellung einer haftfähigen Schicht auf einem Halbleiterkörper A process for producing an adhesive layer on a semiconductor body
08/14/2008DE102004028572B4 Umverdrahtungseinrichtung für elektronische Bauelemente Rewiring of electronic components
08/13/2008EP1956876A1 Ceramic substrate, electronic device, and process for producing ceramic substrate
08/13/2008EP1956872A2 Environmental protection coating system and method
08/13/2008EP1956654A2 Semiconductor switch for high voltages
08/13/2008EP1956652A1 Sealed ball grid array package
08/13/2008EP1956651A1 Power semiconductor module with contact springs
08/13/2008EP1956650A1 Fluid circulator for fluid cooled electronic device
08/13/2008EP1956649A2 Power conversion apparatus
08/13/2008EP1956648A1 Semiconductor device
08/13/2008EP1956615A2 Electronic device and RF module
08/13/2008EP1956110A1 Metal-based composite material containing both micro-sized carbon fiber and nano-sized carbon fiber
08/13/2008EP1956104A1 Working method of a metallic material and a manufacturing method of an electronic component
08/13/2008EP1955844A1 Composite sheet and use thereof
08/13/2008EP1955373A2 Laser fuse structures for high power applications
08/13/2008EP1955372A2 Nitrogen based implants for defect reduction in strained silicon
08/13/2008EP1642335B1 Integrated coolant circuit arrangement, operating method and production method
08/13/2008EP1619722B1 Method for manufacturing backside-illuminated optical sensor
08/13/2008EP1548039B1 Photopolymerizable composition and use thereof
08/13/2008EP1534788B1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating
08/13/2008EP1366328B1 Improved efficiency thermoelectrics utilizing thermal isolation
08/13/2008EP1336200B1 Integrated circuit wafer with crack-stop features
08/13/2008EP1263042B1 Semiconductor package with recessed lead frame and recessed lead frame
08/13/2008EP1175697B1 Method of producing a contact bump
08/13/2008CN201100974Y Water cooling heat radiation module for electronic device
08/13/2008CN201100973Y Heat radiation module
08/13/2008CN201100918Y LED terminal bracket and its feeding belt
08/13/2008CN201100917Y Efficient LED encapsulation structure
08/13/2008CN201100621Y LCD LED backlight source heat radiator
08/13/2008CN201100620Y Compact high-power LED light source
08/13/2008CN201100597Y A SMD LED lamp
08/13/2008CN101243552A Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
08/13/2008CN101243551A A novel method for wafer processing
08/13/2008CN101243550A Surface mounted semiconductor device and method for manufacturing same
08/13/2008CN101243481A Active matrix substrate, display, television set, method for producing active matrix substrate, and method for manufacturing display
08/13/2008CN101243210A Tin electrodeposits having properties or characteristics that minimize tin whisker growth
08/13/2008CN101242732A Heat radiator combination
08/13/2008CN101242730A Heat radiator
08/13/2008CN101242727A Heat radiation fin structure
08/13/2008CN101242726A Heat relay part for external heat radiator
08/13/2008CN101242725A Micro heat radiation module
08/13/2008CN101242724A Micro heat radiation module
08/13/2008CN101242723A Spring slice fixing structure and heat radiation module
08/13/2008CN101241937A Thin film transistor device, method of manufacturing the same, and display apparatus
08/13/2008CN101241928A Electric module, methods of manufacturing the same, and electronic instrument
08/13/2008CN101241927A A resistance memory based on diode selection and its making method
08/13/2008CN101241924A Imaging device module and portable electronic apparatus utilizing the same
08/13/2008CN101241921A Optical device and method for manufacturing optical device, and camera module and endoscope module
08/13/2008CN101241920A Optical device and method of manufacturing the same
08/13/2008CN101241919A Active part array base plate and LCD panel
08/13/2008CN101241917A Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
08/13/2008CN101241913A CMOS device, semiconductor device and a method of fabricating the device
08/13/2008CN101241911A Grid driving circuit integrated on display panel and its making method
08/13/2008CN101241910A Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip
08/13/2008CN101241909A Semiconductor integrated circuit
08/13/2008CN101241908A A static discharging protection method and circuit
08/13/2008CN101241907A Power part layout
08/13/2008CN101241906A Semiconductor device and manufacturing method thereof, semiconductor package, electronic device and manufacturing method thereof, and electronic apparatus
08/13/2008CN101241905A Semiconductor device
08/13/2008CN101241904A Square flat non-connection pin multi-chip encapsulation structure
08/13/2008CN101241903A Wiring board, semiconductor device having the wiring board, and manufacturing and packaging method thereof
08/13/2008CN101241902A Multi-chip semiconductor encapsulation part and its making method
08/13/2008CN101241901A Buried chip encapsulation structure and its making method
08/13/2008CN101241900A Semiconductor integrated circuit
08/13/2008CN101241899A Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same
08/13/2008CN101241898A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/13/2008CN101241897A IC structure and its forming method
08/13/2008CN101241896A Common centroid symmetric capacitor
08/13/2008CN101241895A Printed circuit board and semiconductor memory module using the same
08/13/2008CN101241894A Metal carriage belt of intelligent card, its making and encapsulation module including this carrying belt
08/13/2008CN101241893A Chip package base plate and its packaging structure
08/13/2008CN101241892A Multi-wafer piling base plate and multi-wafer piling encapsulation structure based on this base plate
08/13/2008CN101241891A Semiconductor device and method of manufacturing the same
08/13/2008CN101241890A Chip package structure and its making method
08/13/2008CN101241889A Under bump metallurgy structure of a package and method of making same
08/13/2008CN101241888A Contact structure and its making method
08/13/2008CN101241887A Power semiconductor module with contact springs
08/13/2008CN101241886A Contact structure and semiconductor device
08/13/2008CN101241885A High performance semiconductor module
08/13/2008CN101241884A Integrated circuit encapsulation structure for improving glue padding
08/13/2008CN101241883A Preparation method of a coating of gallium nitride
08/13/2008CN101241880A Manufacturing method for an integrated semiconductor memory device and corresponding semiconductor memory device
08/13/2008CN101241877A Flash memory device and method of manufacturing the same
08/13/2008CN101241868A Encapsulation technology for internal buried semiconductor component and its encapsulation structure
08/13/2008CN101241866A Protrusion block structure with reinforced object and its making method
08/13/2008CN101241865A Flat top protrusion block structure and its making method
08/13/2008CN101241864A Inductance semiconductor encapsulation part and its making method
08/13/2008CN101241863A Chip package structure and its making method
08/13/2008CN101241857A Method for forming dielectric structure and semiconductor structure
08/13/2008CN101241844A In-situ dry clean chamber for front end of line fabrication
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