Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/19/2008US7413932 Power amplifier having high heat dissipation
08/19/2008US7413930 Lead frame and method of manufacturing the lead frame
08/19/2008US7413929 Integrated chip package structure using organic substrate and method of manufacturing the same
08/19/2008US7413928 Die-wafer package and method of fabricating same
08/19/2008US7413926 Methods of making microelectronic packages
08/19/2008US7413815 Thin laminate as embedded capacitance material in printed circuit boards
08/19/2008US7413765 Film forming method for manufacturing planar periodic structure having predetermined periodicity
08/14/2008WO2008097941A1 Apparatus and method for semiconductor wafer bumping via injection molded solder
08/14/2008WO2008097911A1 Semiconductor package with embedded spiral inductor
08/14/2008WO2008097724A2 Passivation layer for a circuit device and method of manufacture
08/14/2008WO2008097642A1 Mosfet device having improved avalanche capability
08/14/2008WO2008097090A1 Sealed ball grid array package
08/14/2008WO2008096839A1 Structure for cooling semiconductor element
08/14/2008WO2008096752A1 Etching method and recording medium
08/14/2008WO2008096633A1 Mounting board and electronic device
08/14/2008WO2008096611A1 Pressure-sensitive adhesive tape
08/14/2008WO2008096599A1 Film forming method, substrate processing apparatus, and semiconductor device
08/14/2008WO2008096587A1 Semiconductor device
08/14/2008WO2008096197A1 Electronics package and manufacturing method thereof
08/14/2008WO2008095811A1 Method of interconnecting electronic wafers
08/14/2008WO2008095755A1 Connection, method and device for the uniform coupling-in of laser beams during laser welding and laser soldering, in particular on highly reflective materials
08/14/2008WO2008095405A1 Microelectronic element and method of manufacturing the same
08/14/2008WO2008095338A1 A mutual connection structure between multi-layer boards and manufacturing method thereof
08/14/2008WO2008095337A1 A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof
08/14/2008WO2008066894A3 Substrate for a flexible microelectronic assembly
08/14/2008WO2008042930A3 Pin array no lead package and assembly method thereof
08/14/2008WO2007079399A3 Packaged semiconductor device with dual exposed surfaces and method of manufacturing
08/14/2008US20080195990 Structure and method of high performance two layer ball grid array substrate
08/14/2008US20080195835 Configurable embedded processor
08/14/2008US20080194102 Semiconductor device and manufacturing method thereof
08/14/2008US20080194064 Programming of laser fuse
08/14/2008US20080194063 Oxidation of copper or chromium-nickel-iron alloy metal article; reduction in hydrogen; producing macroscopically smooth surface portions and a plurality of multiply curved nanopores; coating; semiconductors
08/14/2008US20080194062 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
08/14/2008US20080194055 Solid-state imaging device and method for manufacturing the same
08/14/2008US20080192450 Electronics Module and Method for Manufacturing the Same
08/14/2008US20080192433 Interface module-mounted lsi package
08/14/2008US20080192423 Bare Chip Mounted Structure and Mounting Method
08/14/2008US20080192161 Active matrix substrate and display device
08/14/2008US20080191805 Electronic Circuit and Method for Manufacturing an Electronic Circuit
08/14/2008US20080191728 Isolation circuit
08/14/2008US20080191367 Semiconductor package wire bonding
08/14/2008US20080191366 Bumping process and bump structure
08/14/2008US20080191365 Optical semiconductor device
08/14/2008US20080191364 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
08/14/2008US20080191363 Architecture for face-to-face bonding between substrate and multiple daughter chips
08/14/2008US20080191362 Semiconductor package having impedance matching device
08/14/2008US20080191361 Electronic Device Comprising an Integrated Circuit
08/14/2008US20080191360 Adhesive Strip Conductor on an Insulating Layer
08/14/2008US20080191359 Panel, semiconductor device and method for the production thereof
08/14/2008US20080191358 Solder deposition on wafer backside for thin-die thermal interface material
08/14/2008US20080191357 Semiconductor device comprising electromigration prevention film and manufacturing method thereof
08/14/2008US20080191356 Power Semiconductor
08/14/2008US20080191355 Semiconductor device having buffer layer pattern and method of forming same
08/14/2008US20080191354 Circuitized substrate with p-aramid dielectric layers and method of making same
08/14/2008US20080191353 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
08/14/2008US20080191352 Stacked contact with low aspect ratio
08/14/2008US20080191351 Molybdenum-doped indium oxide structures and methods
08/14/2008US20080191350 Magnesium-doped zinc oxide structures and methods
08/14/2008US20080191349 Semiconductor device with magnetic powder mixed therein and manufacturing method thereof
08/14/2008US20080191348 System for distributing electrical power for a chip
08/14/2008US20080191347 Conductive ball-or pin-mounted semiconductor packaging substrate, method for manufacturing the same and conductive bonding material
08/14/2008US20080191346 Bump structure and manufacturing method thereof
08/14/2008US20080191345 Integrated circuit package system with bump over via
08/14/2008US20080191344 Integrated circuit packaging
08/14/2008US20080191343 Integrated circuit package having large conductive area and method for fabricating the same
08/14/2008US20080191342 Multi-chip module
08/14/2008US20080191341 Electronic apparatus and semiconductor package
08/14/2008US20080191340 Power Semiconductor Module And Method For Its Manufacture
08/14/2008US20080191339 Module with silicon-based layer
08/14/2008US20080191338 Semiconductor memory device, memory device support and memory module
08/14/2008US20080191337 Semiconductor die package and embedded printed circuit board
08/14/2008US20080191336 Subminiature electronic device having hermetic cavity and method of manufacturing the same
08/14/2008US20080191335 Cmos image sensor chip scale package with die receiving opening and method of the same
08/14/2008US20080191334 Glass dam structures for imaging devices chip scale package
08/14/2008US20080191333 Image sensor package with die receiving opening and method of the same
08/14/2008US20080191332 Semiconductor device
08/14/2008US20080191331 System in package semiconductor device suitable for efficient power management and method of managing power of the same
08/14/2008US20080191330 Stacked semiconductor package
08/14/2008US20080191329 Semiconductor package
08/14/2008US20080191328 Surface Mount Electronic Component and Process for Manufacturing Same
08/14/2008US20080191327 Light emitting device
08/14/2008US20080191326 Coreless packaging substrate and method for manufacturing the same
08/14/2008US20080191325 Semiconductor device and packaging structure therefor
08/14/2008US20080191324 Chip package structure and method of fabricating the same
08/14/2008US20080191323 Semiconductor package and its manufacturing method
08/14/2008US20080191322 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch
08/14/2008US20080191319 Semiconductor chip suppressing a void during a die attaching process and semiconductor package including the same
08/14/2008US20080191318 Semiconductor device and method of sawing semiconductor device
08/14/2008US20080191309 Methods and structure for charge dissipation in integrated circuits
08/14/2008US20080191236 Cooling Device for a Light-Emitting Semiconductor Device and a Method of Manufacturing Such a Cooling Device
08/14/2008US20080191235 Light emitting diode structure with high heat dissipation
08/14/2008US20080191218 Low-Dielectric Constant Cryptocrystal Layers And Nanostructures
08/14/2008US20080191212 Thin film transistor array panel and manufacturing methd thereof
08/14/2008US20080191205 Test structure for seal ring quality monitor
08/14/2008US20080190658 Multilayer printed wiring board
08/14/2008US20080190654 Printed Wiring Board
08/14/2008US20080190119 Package for housing a semiconductor chip and method for operating a semiconductor chip at less-than-ambient temperatures
08/14/2008US20080189941 Method of Manufacture of Electronic or Functional Devices
08/14/2008DE10392314B4 Verfahren zur Herstellung einer integrierten Schaltung mit einem Ausbilden einer Hartmaskenerweiterung für eine Speicherwortleitung A method of fabricating an integrated circuit with a forming a hard mask extension for a memory word line
08/14/2008DE10257100B4 Leistungsschalter Circuit breaker
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