Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/16/2014CN103930986A 功率转换装置 Power conversion means
07/16/2014CN103930981A 半导体模块 Semiconductor Modules
07/16/2014CN103930966A 改进的复合吸气剂 Improved composite getter
07/16/2014CN103929926A 具备散热器的马达驱动装置 A motor driving device comprising a heat sink
07/16/2014CN103929924A 均温板结构 Average temperature board structure
07/16/2014CN103929895A 具有内埋元件的电路板、其制作方法及封装结构 Buried element having a circuit board, its production method and package structure
07/16/2014CN103929880A 电路基板结构及其制作方法 Circuit board structure and production methods
07/16/2014CN103928505A 功率金属氧化物半导体晶体管元件 Power metal oxide semiconductor transistor element
07/16/2014CN103928475A Tft阵列基板、显示面板及其制作方法 Tft array substrate, the display panel and manufacturing method thereof
07/16/2014CN103928470A 一种氧化物半导体tft阵列基板及其制造方法 An oxide semiconductor tft array substrate and a method of manufacturing
07/16/2014CN103928462A 主动基板以及显示面板 Active substrates and a display panel
07/16/2014CN103928456A 一种阵列基板、显示面板及显示器 One kind of array substrate, a display panel and a display
07/16/2014CN103928448A 芯片装置和用于制造芯片装置的方法 Chip device and a method for producing chip device
07/16/2014CN103928447A 一种大功率全气密半导体模块封装结构 One kind of high-power semiconductor module package structure airtight
07/16/2014CN103928446A 低共模耦合效应的片上电感及其设计方法 Low common mode inductance coupling effect on the chip and its design method
07/16/2014CN103928445A 芯片装置和用于形成芯片装置的方法 Apparatus and methods for forming chips chip device
07/16/2014CN103928444A 一种tft阵列基板、显示面板及显示装置 One kind tft array substrate, the display panel and display device
07/16/2014CN103928443A 堆叠式封装模块与其制造方法、电子装置 Stacked package module and its manufacturing method, electronic device
07/16/2014CN103928442A 一种场效应管重叠电容的测试结构及方法 A field-effect tube overlap capacitance test structure and method
07/16/2014CN103928441A 一种基于胶膜的fcbga单芯片封装件及其制作工艺 Fcbga single chip package and a film based on the production process
07/16/2014CN103928440A 一种铜互连扩散阻挡层及其制备方法 A copper diffusion barrier layer interconnect its preparation method
07/16/2014CN103928439A 一种抗过载非硅mems厚金属悬空微电感 An anti-overload non-silicon mems thick metal dangling microinductance
07/16/2014CN103928438A 片上变压器、其版图结构、发射电路及收发电路 The on-chip transformer, its layout structure, a transmission circuit and transceiver circuit
07/16/2014CN103928437A 具有双层或多层插入层的砷化镓芯片背面金属的结构 Structure having a double layer or multi-layer inserted in the back surface of the GaAs chip metal
07/16/2014CN103928436A 具有覆铜导体的接合系统 Copper conductors with a bonding system
07/16/2014CN103928435A 一种高压集成电路 A high voltage integrated circuit
07/16/2014CN103928434A 一种基于Flux的FCBGA单芯片封装件及其制作工艺 A Flux of FCBGA single chip package based on its production process
07/16/2014CN103928433A 半导体装置及其制法 Semiconductor device Jiqizhifa
07/16/2014CN103928432A 一种表贴半导体元件气密封装结构 One kind of surface mount hermetically encapsulated semiconductor device structure
07/16/2014CN103928431A 一种倒装封装装置 A flip packaging unit
07/16/2014CN103928430A 一种基于冲压框架带有通孔的扁平多芯片封装件 A flat multi-chip package with a hole punched framework based
07/16/2014CN103928429A 一种带有分体散热片的引线框架 A lead frame with a separate heat sink
07/16/2014CN103928428A 一种用于小功率电器的引线框架 A low-power appliances for leadframe
07/16/2014CN103928427A 一种散热片背部带麻点的引线框架 A fin back with wire frame pitting
07/16/2014CN103928426A 一种引线框架 A lead frame for
07/16/2014CN103928425A 一种带压痕的引线框架 A lead frame with the indentation
07/16/2014CN103928424A 一种加厚的引线框架 A thicker lead frame
07/16/2014CN103928423A 一种带口型槽的引线框架 A lead frame with a mouth-groove
07/16/2014CN103928422A 一种适用于高温环境的引线框架 A lead frame suitable for high-temperature environment
07/16/2014CN103928421A 一种带锯齿形防水槽的引线框架 A lead frame with a zigzag groove waterproof
07/16/2014CN103928420A 引线框 Leadframe
07/16/2014CN103928419A 引线框 Leadframe
07/16/2014CN103928418A 键合引线和用于产生键合连接的方法 A bonding wire and a method for producing a bonded connection
07/16/2014CN103928417A 一种低成本的圆片级csp封装方法及其封装结构 A low-cost method for wafer level encapsulation and packaging structure csp
07/16/2014CN103928416A 具有无源器件的半导体封装件及其堆叠方法 The semiconductor package having a passive device and stacking method
07/16/2014CN103928415A 一种引脚区域的结构 Structure of a pin region
07/16/2014CN103928414A 一种电子元器件液冷散热系统 An electronic component liquid cooling system
07/16/2014CN103928413A 一种散热装置 A heat sink device
07/16/2014CN103928412A 半导体装置及制造该半导体装置的方法 Semiconductor device and method of manufacturing the semiconductor device
07/16/2014CN103928411A 芯片装置及其制造方法、集成电路及其制造方法 Chip device and its manufacturing method, an integrated circuit and its manufacturing method
07/16/2014CN103928410A 封装结构及其制作方法 Package structure and production methods
07/16/2014CN103928409A 一种集成电路倒扣焊气密性封装结构 An integrated circuit Flip welded hermetic package structure
07/16/2014CN103928408A 功率半导体模块和用于制造功率半导体模块的方法 The method of manufacturing the power semiconductor module and a power semiconductor module
07/16/2014CN103928407A 一次焊接倒封装工装结构 A welding tooling down the package structure
07/16/2014CN103928395A 三维叠层半导体装置及其制造方法 A three-dimensional stack of semiconductor device and manufacturing method
07/16/2014CN103928393A 连接件及其制造方法 Connecting member and its manufacturing method
07/16/2014CN103928353A 无外引脚封装构造及其制造方法与导线框架 No external pin package and method for manufacturing the wire frame
07/16/2014CN103928302A 一种半导体引线框架制造工艺 A semiconductor leadframe manufacturing process
07/16/2014CN103926773A 一种阵列基板、液晶显示面板及显示装置 Panel array substrate and a display device, a liquid crystal display
07/16/2014CN103926764A 一种tft阵列基板及显示面板、显示装置 One kind tft array substrate and a display panel, a display device
07/16/2014CN103926762A 阵列基板及其制造方法 The method of manufacturing the array substrate and
07/16/2014CN103926761A 一种用于阵列基板的测试结构及其制造方法 A test structure and a method of manufacturing an array substrate for
07/16/2014CN103922316A 泡沫状碳纳米管材料、制备方法、散热结构及测定方法 Foamy carbon nanotube material, preparation method, thermal structure and determination
07/16/2014CN103035604B 一种倒装芯片封装结构及其制作工艺 A flip-chip package structure and production process
07/16/2014CN102832189B 一种多芯片封装结构及其封装方法 A multi-chip package and packaging method
07/16/2014CN102762770B 包含铜层及钼层的多层薄膜用蚀刻液 Comprising a copper layer and a molybdenum layer of the multilayer film with an etching solution
07/16/2014CN102655129B 具有莫尔条纹效应的电力电子集成模块微小通道液冷基板 Integrated Power Electronic Modules tiny channels liquid-cooled substrate has moire effect
07/16/2014CN102637725B 采用Bipolar低压工艺实现的器件及其制造方法 Using the device and method of manufacturing the low pressure Bipolar process to achieve the
07/16/2014CN102593104B 半导体封装件及其制造方法 The semiconductor package and method for manufacturing
07/16/2014CN102543852B 金属互连结构及其制作方法 Metal interconnect structure and fabrication method thereof
07/16/2014CN102543768B 形成保护膜于芯片封装上的装置及其形成方法 The method of forming the protective film is formed on the device and on the chip package
07/16/2014CN102516499B 密封半导体用环氧树脂组合物及半导体装置 The epoxy resin composition for sealing a semiconductor and a semiconductor device
07/16/2014CN102280478B 可堆栈式功率mosfet、功率mosfet堆栈及其制备工艺 Stackable power mosfet, power mosfet stack and its preparation process
07/16/2014CN102195614B 静电放电保护电路的延迟电路及其保护的方法和集成电路 A delay circuit and protection methods and integrated ESD protection circuit
07/16/2014CN102099848B 有源矩阵基板、显示面板、显示装置及有源矩阵基板的制造方法 The active matrix substrate, a display panel, apparatus, and method for manufacturing the active matrix substrate, a display
07/16/2014CN102090156B 电子组件以及其制造方法 And a method of manufacturing an electronic component
07/16/2014CN102034847B 自发光平面显示器及用于组装该自发光平面显示器之对位系统 Self-luminous flat panel displays, and for the assembly of the self-luminous flat panel display alignment system
07/16/2014CN101990389B 散热模组 Cooling modules
07/16/2014CN101983426B 可移动导电体 Movable conductor
07/16/2014CN101978483B 原位空腔集成电路块 In situ cavity circuit block
07/16/2014CN101960585B 包括导线元件和带槽的微电子芯片并包括保持该导线元件的至少一个凸块的组件 And the wire element comprises a slotted and microelectronic chip comprising at least one component of the wire holding lug member
07/16/2014CN101959389B 散热装置及其制造方法 The heat sink and method for manufacturing
07/16/2014CN101866907B 用于具有可变复阻抗的连接体的接收电路 A circuit for receiving a variable complex impedance of the connecting body
07/16/2014CN101832528B 用于发光装置的散热模块及发光二极管装置 Cooling modules and light emitting diode device for light-emitting device
07/16/2014CN101801886B 具有其表面已金属化的陶瓷体的结构部件 Structural member has a surface having a metallized ceramic body
07/16/2014CN101030592B 磁存储器件 Magnetic memory device
07/15/2014US8782447 System and method for determining power consumption
07/15/2014US8780577 COF packaging unit and COF packaging tape
07/15/2014US8780573 Printed circuit board
07/15/2014US8780560 Loop heat pipe, and electronic apparatus including loop heat pipe
07/15/2014US8780558 Porous thermoplastic foams as heat transfer materials
07/15/2014US8780557 Power electronics inverter with capacitor cooling
07/15/2014US8780255 Solid-state imaging device, manufacturing method thereof, and electronic apparatus
07/15/2014US8779607 Devices with covering layer and filler
07/15/2014US8779606 Package-on-package electronic devices including sealing layers and related methods of forming the same
07/15/2014US8779605 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
07/15/2014US8779604 Semiconductor structure and manufacturing method thereof
07/15/2014US8779603 Stacked semiconductor device with heat dissipation
07/15/2014US8779602 Wiring board, semiconductor apparatus and method of manufacturing them
07/15/2014US8779601 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
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