Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/20/2008CN101246879A White light LED packaging structure with silica substrate and its production method
08/20/2008CN101246878A LED chip packaging structure with ceramic as substrate and its production method
08/20/2008CN101246877A Poly-crystal face-to-face stacking and packaging construction
08/20/2008CN101246875A Semiconductor device and method for fabricating the same
08/20/2008CN101246874A Structure for metal cap applications
08/20/2008CN101246873A Integrated circuit structure
08/20/2008CN101246872A Semiconductor package substrate
08/20/2008CN101246871A Multi-layer ceramic substrate and its preparing process
08/20/2008CN101246870A Semiconductor package substrate
08/20/2008CN101246869A Chip upside-down mounting and packaging structure for reducing substrate warping and its production method
08/20/2008CN101246868A Packaging structure and method for sphere pin array substrate with contact pad located in chip center
08/20/2008CN101246867A Electronic device having metal pad structure and method of fabricating the same
08/20/2008CN101246866A Conductive structure for semiconductor integrated circuit and method for forming the same
08/20/2008CN101246865A Packaging conductive structure and its manufacturing method
08/20/2008CN101246864A Packaging conductive structure and its forming method
08/20/2008CN101246863A Conductive structure for semiconductor integrated circuit and method for forming the same
08/20/2008CN101246862A Wafer with radiating structure and its production method
08/20/2008CN101246861A Package board and method for manufacturing thereof
08/20/2008CN101246860A Electronic apparatus and semiconductor package
08/20/2008CN101246859A Test structure for seal ring quality monitor
08/20/2008CN101246850A Insulated gate field effect transistor and method for manufacturing the same
08/20/2008CN101246848A Semiconductor device
08/20/2008CN101246847A Interconnect structure with bi-layer metal cap
08/20/2008CN101246843A Multi-metal intra-connection structure with optical shielding property and its production method
08/20/2008CN101245227A Epoxy conductive silver glue for LED and method for manufacturing same
08/20/2008CN101245173A Epoxy resin electronic packaging material and electronic component packaged with the same
08/20/2008CN100413392C Non-fan chip heat radiator
08/20/2008CN100413390C A liquid cooling system and an electronic apparatus applying the same therein
08/20/2008CN100413386C Method of mounting wafer on printed wiring substrate
08/20/2008CN100413385C Film bearing band for arranging electronic parts and printing screen mask for coating welding retardant
08/20/2008CN100413107C Light emitting device
08/20/2008CN100413099C Light-emitting diode and background light device
08/20/2008CN100413093C High frequncy diode
08/20/2008CN100413079C Method for making image sensor with recessed planarizing layers
08/20/2008CN100413070C Module with a built-in component, electronic device with the same, and manufacturing method of module with a built-in component
08/20/2008CN100413069C Electric fuse structure
08/20/2008CN100413068C Semiconductor device for fingerprint recognition
08/20/2008CN100413067C Chip encapsulation structure and its crystal encapsulation forming method
08/20/2008CN100413066C Jointing welding plate of low-k dielectric material and method for making semiconductor device
08/20/2008CN100413065C Circuit device with at least partial packaging and method for forming the same
08/20/2008CN100413064C Air-tightness chamber heat radiation structure and its producing method
08/20/2008CN100413063C Heat pipe and manufacturing method thereof
08/20/2008CN100413062C Method for producing heat pipes
08/20/2008CN100413061C Thermal tube and producing method thereof
08/20/2008CN100413060C Semiconductor device
08/20/2008CN100413058C Interposer and interposer producing method
08/20/2008CN100413057C High-heat-resistant semiconductor device
08/20/2008CN100413056C 电路装置及其制造方法 Circuit device and manufacturing method thereof
08/20/2008CN100413045C Anisotropically conductive connector, probe material member, wafer inspection apparatus, and wafer inspection method
08/20/2008CN100413043C Manufacture method of semiconductor device
08/20/2008CN100413030C Projection producing process and its structure
08/20/2008CN100413029C Method of manufacturing circuit device
08/20/2008CN100412995C Constrained sintering method for asymmetrical configurational dielectric layer
08/20/2008CN100412899C Method for producing radio frequency to discriminate electronic label
08/20/2008CN100412688C Light source device and projection display device
08/20/2008CN100412607C Microelectromechanical system and method for fabricating the same
08/20/2008CN100412504C Pattern inspection method and apparatus, and pattern alignment method
08/20/2008CN100412128C Curable resin composition
08/19/2008US7414858 Method of manufacturing an electronic device
08/19/2008US7414846 Cooling structure for interface card
08/19/2008US7414843 Method and apparatus for a layered thermal management arrangement
08/19/2008US7414839 Heat dissipation device having a fan holder for attachment of a fan
08/19/2008US7414506 Semiconductor integrated circuit and fabrication method thereof
08/19/2008US7414505 High frequency inductor having low inductance and low inductance variation and method of manufacturing the same
08/19/2008US7414437 Nanomechanical computer
08/19/2008US7414422 System in-package test inspection apparatus and test inspection method
08/19/2008US7414324 Wafer structure with mirror shot
08/19/2008US7414323 Tab tape and method of manufacturing the same
08/19/2008US7414322 High speed interface design
08/19/2008US7414320 Semiconductor device and method of manufacturing same
08/19/2008US7414319 Semiconductor chip assembly with metal containment wall and solder terminal
08/19/2008US7414318 Etched leadframe flipchip package system
08/19/2008US7414317 BGA package with concave shaped bonding pads
08/19/2008US7414316 Methods and apparatus for thermal isolation in vertically-integrated semiconductor devices
08/19/2008US7414315 Damascene structure with high moisture-resistant oxide and method for making the same
08/19/2008US7414314 Semiconductor device and manufacturing method thereof
08/19/2008US7414312 Memory-module board layout for use with memory chips of different data widths
08/19/2008US7414311 Ball grid array housing having a cooling foil
08/19/2008US7414310 Waferscale package system
08/19/2008US7414309 Encapsulated electronic part packaging structure
08/19/2008US7414308 Integrated circuit with offset pins
08/19/2008US7414307 Electronic device and pressure sensor
08/19/2008US7414306 Preamplifier integrated circuit on flex circuit for magnetic media storing devices
08/19/2008US7414305 Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
08/19/2008US7414304 Semiconductor device
08/19/2008US7414303 Lead on chip semiconductor package
08/19/2008US7414302 Flashless lead frame with horizontal singulation
08/19/2008US7414301 Printed circuit board with soldering lands
08/19/2008US7414300 Molded semiconductor package
08/19/2008US7414299 Semiconductor package assembly and method for electrically isolating modules
08/19/2008US7414291 Semiconductor device and method of manufacturing the same
08/19/2008US7414284 Nonvolatile semiconductor memory and manufacturing method thereof
08/19/2008US7414257 Switching device for configurable interconnect and method for preparing the same
08/19/2008US7413991 Damascene process at semiconductor substrate level
08/19/2008US7413987 Method for manufacturing a semiconductor device
08/19/2008US7413979 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
08/19/2008US7413978 Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus
08/19/2008US7413975 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
08/19/2008US7413936 Method of forming copper layers
08/19/2008US7413933 Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
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