Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/21/2008US20080197468 Package structure and manufacturing method thereof
08/21/2008US20080197467 Conductive structure for a semiconductor integrated circuit and method for forming the same
08/21/2008US20080197466 Semiconductor device and manufacturing method thereof
08/21/2008US20080197465 Semiconductor device and method of manufacturing the same
08/21/2008US20080197464 Integrated Circuit Device Package with an Additional Contact Pad, a Lead Frame and an Electronic Device
08/21/2008US20080197463 Electronic Component And Method For Manufacturing An Electronic Component
08/21/2008US20080197462 Semiconductor package
08/21/2008US20080197461 Apparatus for wire bonding and integrated circuit chip package
08/21/2008US20080197460 Packaged ic device comprising an embedded flex circuit, and methods of making same
08/21/2008US20080197459 Encapsulated chip scale package having flip-chip on lead frame structure and method
08/21/2008US20080197458 Small Outline Package in Which Mosfet and Schottky Diode Being Co-Packaged
08/21/2008US20080197456 Substrate polishing method, semiconductor device and fabrication method therefor
08/21/2008US20080197455 Semiconductor device and manufacturing method therefor
08/21/2008US20080197450 Amorphous carbon metal-to-metal antifuse with adhesion promoting layers
08/21/2008US20080197449 Wiring structure of semiconductor integrated circuit device, and method and device for designing the same
08/21/2008US20080197445 Isolation and termination structures for semiconductor die
08/21/2008US20080197444 Integrated circuit and method including an isolation arrangement
08/21/2008US20080197441 Semiconductor component with vertical structures having a high aspect ratio and method
08/21/2008US20080197434 Magnetic memory device
08/21/2008US20080197416 Semiconductor protection circuit, method for fabricating the same and method for operating semiconductor protection circuit
08/21/2008US20080197415 Electrostatic discharge protection circuit having multiple discharge paths
08/21/2008US20080197407 Power Semiconductor Devices with Barrier Layer to Reduce Substrate Up-Diffusion and Methods of Manufacture
08/21/2008US20080197353 Semiconductor device for which electrical test is performed while probe is in contact with conductive pad
08/21/2008US20080197352 Bump structure on substrate
08/21/2008US20080197351 Testkey design pattern for gate oxide
08/21/2008US20080197338 Bottom electrode for memory device and method of forming the same
08/21/2008US20080196932 Multilayer substrate including components therein
08/21/2008US20080196930 Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure
08/21/2008US20080196870 Liquid submersion cooling system
08/21/2008DE19824225B4 Verfahren zur Herstellung einer gedruckten Schaltungsplatte A process for producing a printed circuit board
08/21/2008DE19806978B4 Kühlvorrichtung zur Kühlung durch Konvektion Cooling means for cooling by convection
08/21/2008DE102008008920A1 Verpacken integrierter Schaltkreise Packaging of integrated circuits
08/21/2008DE102008008906A1 Halbleiterpackage mit mehreren Dies und ein Verfahren zu dessen Herstellung Semiconductor package including a plurality of dies and a method for its preparation
08/21/2008DE102008008513A1 Integrierter Schaltkreis mit leitfähigen Hügeln Integrated circuit with conductive hills
08/21/2008DE102008008141A1 Leistungshalbleitermodul und Verfahren zu seiner Herstellung The power semiconductor module and method for its preparation
08/21/2008DE102007059539A1 Ein System zum Verteilen von elektrischer Energie für einen Chip A system for distributing electrical energy for a chip
08/21/2008DE102007059159A1 Bildsensor-Baugruppe und Verfahren diese zu bilden To form the image sensor module and process these
08/21/2008DE102007053193A1 Wärmeableitungsmodul und Wärmesenke davon Heat dissipation module and heat sink thereof
08/21/2008DE102007009383A1 Halbleiteranordnung und Verfahren zu deren Herstellung A semiconductor device and process for their preparation
08/21/2008DE102007008487A1 Verfahren und Halbzeug zur Herstellung eines Inlays Procedures and semifinished product for producing an inlay
08/21/2008DE102007007503A1 Bauelementanordnung Component arrangement
08/21/2008DE102007007356A1 Hochfrequenzschaltung High frequency circuit
08/21/2008DE102007006853A1 ESD-Schutzvorrichtung und elektrische Schaltung mit derselben ESD protection device and electrical circuit having the same
08/21/2008DE102007006706A1 Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu Circuitry with coupling device and manufacturing method therefor
08/21/2008DE102007006212A1 Leistungshalbleitermodul mit Kontaktfedern Power semiconductor module with contact springs
08/21/2008DE102007005630A1 Halbleiterchip-Modul A semiconductor chip module
08/21/2008DE102005061358B4 In ein Halbleitermaterial integrierter Schaltkreis mit Temperaturregelung und Verfahren zur Regelung der Temperatur eines einen integrierten Schaltkreis aufweisenden Halbleitermaterials In a semiconductor material integrated circuit with temperature control and process for regulating the temperature of an integrated circuit comprising the semiconductor material
08/21/2008DE102005051848B4 Schaltungsanordnung zur temperaturdriftkompensierten Strommessung Circuit arrangement for temperature drift compensated current measurement
08/21/2008DE102005005622B4 Sicherheits-Chipstapel und ein Verfahren zum Herstellen eines Sicherheits-Chipstapels Security chip stack and a method for manufacturing a security chip stack
08/21/2008DE102004025773B4 Elektronisches Bauelement mit thermisch voneinander isolierten Bereichen Electronic component with thermally insulated from one another areas
08/21/2008DE102004023037B4 Kühlkörper mit integrierter Heatpipe Heat sink with integrated heat pipe
08/21/2008DE102004018477B4 Halbleitermodul Semiconductor module
08/21/2008DE10125029B4 Verwendung einer Halbleitervorrichtung mit Nebenschaltung im Kerf-Bereich und Verfahren Use of a semiconductor device having sub-circuit in the kerf area and procedures
08/21/2008DE10113967B4 Leistungsmodule Power Modules
08/20/2008EP1959720A1 An electromagnetic shielding device for an infrared receiver
08/20/2008EP1959506A2 Method of manufacturing a semiconductor light-emitting device
08/20/2008EP1959493A1 Process for producing electronic part, process for producing heat conducting member, and method of mounting heat conducting member for electronic part
08/20/2008EP1958256A1 Chip on lead frame for small package speed sensor
08/20/2008EP1958255A2 Bumpless flip-chip assembly with a compliant interposer contractor
08/20/2008EP1958254A1 Micro-heat exchanger and the use thereof as a fluid cooler for electronic components
08/20/2008EP1958253A2 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
08/20/2008EP1958252A2 Low-resistance void-free contacts for eeprom devices
08/20/2008EP1958251A2 Method of forming a self aligned copper capping layer
08/20/2008EP1581578B1 Composition and method to achieve reduced thermal expansion in polyarylene networks
08/20/2008EP1576652A4 Chip package sealing method
08/20/2008EP1502309A4 Integrated circuit with internal impedance matching circuit
08/20/2008EP1405337B1 Structural reinforcement of highly porous low k dielectric films by ild posts
08/20/2008EP1229772B1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it
08/20/2008EP1142119B1 On-chip decoupling capacitor system with parallel fuse
08/20/2008CN201104323Y LED apparatus
08/20/2008CN201103879Y Aluminum-based luminous plate
08/20/2008CN201103877Y Heat radiator
08/20/2008CN201103857Y Integrated LED light source component
08/20/2008CN201103807Y High power LED water-proof striation with cooling structure
08/20/2008CN201103806Y LED lamp
08/20/2008CN101248525A B-stageable film, electronic device, and associated process
08/20/2008CN101248524A Heat sink packaging assembly for electronic components
08/20/2008CN101248521A Technique for efficiently patterning an underbump metallization layer using a dry etch process
08/20/2008CN101248154A Thermal interface material and method
08/20/2008CN101247715A Thermal diffusion sheet and manufacturing method of the same
08/20/2008CN101247714A Radiating module
08/20/2008CN101247713A Heat sink assembly
08/20/2008CN101247712A Micro-liquid drop refrigerating mechanism
08/20/2008CN101247711A Recirculating loop manufacturing method of high-efficiency heat conduction substrate and high-efficiency heat conduction substrate recirculating loop component
08/20/2008CN101246950A Memory element with reduced-current phase change element
08/20/2008CN101246938A Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
08/20/2008CN101246935A Light emitting diode and heat radiating device thereof
08/20/2008CN101246911A Metal microgrid transparent electrode and method for producing the same
08/20/2008CN101246897A Wafer level image sensor package with die receiving cavity and method of the same
08/20/2008CN101246895A Glass dam structures for imaging devices chip scale package
08/20/2008CN101246894A Photoelectric conversion device and electronic device, and method for manufacturing photoelectric conversion device
08/20/2008CN101246893A Integrated circuit package body with large conductive area and its production method
08/20/2008CN101246892A Active matrix substrate and display device
08/20/2008CN101246890A Semiconductor device and method of manufacturing the same
08/20/2008CN101246888A Integrated circuit, dual port sram cell and semiconductor structure
08/20/2008CN101246885A Controllable silicon used for electrostatic discharge protection
08/20/2008CN101246883A Integrated circuit packaging
08/20/2008CN101246882A Semiconductor device package with multi-chips and method of the same
08/20/2008CN101246881A Electronic packaging structure
08/20/2008CN101246880A LED array packaging structure with silica carrier plate and its production method
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