Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/26/2008US7417078 Heat generating electronics which, when operated, generate heat, attain a temperature higher than room temperature; heat exchangers and printed circuits
08/26/2008US7416996 Method of making circuitized substrate
08/26/2008US7416985 Semiconductor device having a multilayer interconnection structure and fabrication method thereof
08/26/2008US7416972 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
08/26/2008US7416970 Method for manufacturing semiconductor device
08/26/2008US7416964 Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer
08/26/2008US7416963 Manufacturing method of semiconductor device
08/26/2008US7416961 Method for structuring a flat substrate consisting of a glass-type material
08/26/2008US7416942 Method for manufacturing semiconductor device
08/26/2008US7416932 Power composite integrated semiconductor device and manufacturing method thereof
08/26/2008US7416922 Heat sink with preattached thermal interface material and method of making same
08/26/2008US7416919 Method for wafer level stack die placement
08/26/2008US7416918 Direct build-up layer on an encapsulated die package having a moisture barrier structure
08/26/2008US7416789 Refractory metal substrate with improved thermal conductivity
08/26/2008US7416630 Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
08/26/2008US7416611 Process and apparatus for treating a workpiece with gases
08/26/2008US7416019 Thermal interface and switch using carbon nanotube arrays
08/26/2008US7416017 Method and apparatus for cooling with a phase change material and heat pipes
08/26/2008CA2432701C Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection
08/21/2008WO2008101102A1 Plated pillar package formation
08/21/2008WO2008101093A1 Post-seed deposition process
08/21/2008WO2008100940A1 Electronic passive device
08/21/2008WO2008100247A1 A quad flat no lead (qfn) integrated circuit (ic) package having a modified paddle and method for designing the package
08/21/2008WO2008099940A1 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device
08/21/2008WO2008099934A1 Semiconductor package
08/21/2008WO2008099933A1 Semiconductor package
08/21/2008WO2008099607A1 Seam-welding roller unit, seam-welding apparatus
08/21/2008WO2008099594A1 Multilayer ceramic substrate and process for producing the same
08/21/2008WO2008099554A1 Structure for mounting semiconductor package
08/21/2008WO2008099522A1 Modifier for low dielectric constant film, and method for production thereof
08/21/2008WO2008099348A2 Semiconductor device identifier generation
08/21/2008WO2008099326A1 A carrier for bonding a semiconductor chip onto and a method of contacting a semiconductor chip to a carrier
08/21/2008WO2008099321A1 Dual or multiple row package
08/21/2008WO2008099085A1 Electronic board and cold plate for said board
08/21/2008WO2008075315A3 Brazed flip-chip mounting of integrated circuits
08/21/2008WO2008075245A3 Pulsating fluid cooling with frequency control
08/21/2008WO2008071905B1 Chip mounting
08/21/2008WO2008057770A9 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
08/21/2008WO2008052045A3 Ceramic header method and system
08/21/2008WO2008044717A8 Cooling apparatus and electronic device comprising same
08/21/2008WO2008028460A3 Regulated power supply for a circuit
08/21/2008WO2008027694A3 Stackable packages for three-dimensional packaging of semiconductor dice
08/21/2008WO2007137099A3 Double layer carbon nanotube-based structures and methods for removing heat from solid-state devices
08/21/2008WO2007120232A3 Self-aligning optical sensor package
08/21/2008WO2007101104A3 A system for cooling a heat-generating electronic device with increased air flow
08/21/2008WO2007076546A3 Multiple chip module and package stacking method for storage devices
08/21/2008US20080201682 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
08/21/2008US20080199997 Methods of Forming Inter-poly Dielectric (IPD) Layers in Power Semiconductor Devices
08/21/2008US20080199979 Semiconductor device and method for fabricating the same
08/21/2008US20080198568 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
08/21/2008US20080198553 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
08/21/2008US20080197872 Semiconductor chip, multi-chip semiconductor device, inspection method of the same, and electric appliance integrating the same
08/21/2008US20080197870 Apparatus and Method For Determining Reliability Of An Integrated Circuit
08/21/2008US20080197862 Proportional Variable Resistor Structures to Electrically Measure Mask Misalignment
08/21/2008US20080197860 Configurable voltage regulator
08/21/2008US20080197514 Die coat perimeter to enhance semiconductor reliability
08/21/2008US20080197513 Beol interconnect structures with improved resistance to stress
08/21/2008US20080197512 Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made thereby
08/21/2008US20080197511 Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
08/21/2008US20080197510 Semiconductor device and wire bonding method
08/21/2008US20080197509 Semiconductor package having stacked semiconductor chips
08/21/2008US20080197508 Plated pillar package formation
08/21/2008US20080197507 Electronic package structure and method
08/21/2008US20080197506 Semiconductor device manufacturing method, semiconductor device, and semiconductor wafer structure
08/21/2008US20080197505 Semiconductor device and method for manufacturing the same
08/21/2008US20080197504 Single-sided, flat, no lead, integrated circuit package
08/21/2008US20080197503 Chip package
08/21/2008US20080197502 Semiconductor device having metal wirings of laminated structure
08/21/2008US20080197501 Interconnection substrate and semiconductor device, manufacturing method of interconnection substrate
08/21/2008US20080197500 Interconnect structure with bi-layer metal cap
08/21/2008US20080197499 Structure for metal cap applications
08/21/2008US20080197497 Barrier for use in 3-d integration of circuits
08/21/2008US20080197496 Semiconductor device having at least two layers of wirings stacked therein and method of manufacturing the same
08/21/2008US20080197495 Structure for reducing lateral fringe capacitance in semiconductor devices
08/21/2008US20080197494 Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same
08/21/2008US20080197493 Integrated circuit including conductive bumps
08/21/2008US20080197492 Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member
08/21/2008US20080197491 Semiconductor device and method for producing the same
08/21/2008US20080197490 Conductive structure for a semiconductor integrated circuit and method for forming the same
08/21/2008US20080197489 Packaging conductive structure and method for manufacturing the same
08/21/2008US20080197488 Bowed wafer hybridization compensation
08/21/2008US20080197487 Semiconductor Device Including a Coupled Dielectric Layer and Metal Layer, Method of Fabrication Thereof, and Material for Coupling a Dielectric Layer and a Metal Layer in a Semiconductor Device
08/21/2008US20080197486 Semiconductor device and method for manufacturing the same
08/21/2008US20080197485 Module comprising a semiconductor chip comprising a movable element
08/21/2008US20080197484 Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package
08/21/2008US20080197483 Lidless semiconductor cooling
08/21/2008US20080197482 Semiconductor module, portable device and method for manufacturing semiconductor module
08/21/2008US20080197481 Semiconductor sensor having flat mounting plate
08/21/2008US20080197480 Semiconductor device package with multi-chips and method of the same
08/21/2008US20080197479 Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same
08/21/2008US20080197478 Semiconductor device package with die receiving through-hole and connecting through-hole and method of the same
08/21/2008US20080197477 Flip-Chip Grid Ball Array Strip and Package
08/21/2008US20080197476 Semiconductor device
08/21/2008US20080197475 Packaging conductive structure and method for forming the same
08/21/2008US20080197474 Semiconductor device package with multi-chips and method of the same
08/21/2008US20080197473 Chip holder with wafer level redistribution layer
08/21/2008US20080197472 Semiconductor device and semiconductor module using the same
08/21/2008US20080197471 Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
08/21/2008US20080197470 Stacked electronic component and manufacturing method thereof
08/21/2008US20080197469 Multi-chips package with reduced structure and method for forming the same
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