Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/27/2008CN101252121A Stack package and method of manufacturing the same
08/27/2008CN101252120A Adjustable color temperature and color development luminous diode
08/27/2008CN101252119A Characteristic measuring structure of MOS device
08/27/2008CN101252118A Semiconductor device and method for producing the same
08/27/2008CN101252117A Wiring structure of semiconductor integrated circuit device, and method and device for designing the same
08/27/2008CN101252116A Interconnection structure and method of manufacturing the same
08/27/2008CN101252115A Semiconductor package and manufacture method thereof as well as electric system and manufacture method thereof
08/27/2008CN101252114A Semiconductor device
08/27/2008CN101252113A Conducting wire rack with corresponding shape chip seat and joint feet
08/27/2008CN101252112A Semiconductor device and wire bonding method
08/27/2008CN101252111A Chip packaging structure and manufacturing method thereof
08/27/2008CN101252110A Encapsulation structure and manufacturing method thereof
08/27/2008CN101252109A Optoelectronic module provided with at least one photoreceptor cell
08/27/2008CN101252108A Semiconductor device package with die receiving through-hole and connecting through-hole and method of the same
08/27/2008CN101252107A Semiconductor package structure and manufacturing method thereof
08/27/2008CN101252106A Wafer structure with buffer layer
08/27/2008CN101252105A Circuit board structure, cover crystal circuit and wire laying structure of drive circuit
08/27/2008CN101252103A Flash memory device and method of forming the device
08/27/2008CN101252102A Method of manufacturing photoelectric conversion device
08/27/2008CN101252099A Temperature circulating test device for heating chip upside-down mounting encapsulation structure
08/27/2008CN101252096A Chip package structure and preparation method thereof
08/27/2008CN101252093A Method of manufacturing an electronic component and an electronic device
08/27/2008CN101252092A Multi-chip packaging structure and making method thereof
08/27/2008CN101252091A Forming method of sliver hole on substrate and substrate structure
08/27/2008CN101252089A Method for hot cooling microelectron chip using micro vapor bubble spray
08/27/2008CN101252086A Semiconductor device and method for manufacturing the same
08/27/2008CN101251976A Display apparatus, driving method thereof, and electronic system
08/27/2008CN101251975A Display apparatus and drive method therefor, and electronic equipment
08/27/2008CN101251903A RFID tag and RFID tag manufacturing method
08/27/2008CN101251246A LED lamp and heat dispersion method thereof
08/27/2008CN101251245A Surface type led lamp with high heat radiation
08/27/2008CN101251244A Led lamp substrate with high heat radiation
08/27/2008CN101250026A Method for producing an electronic component passivated by lead free glass
08/27/2008CN100414801C Protecting apparatus for electrostatic discharge
08/27/2008CN100414733C Method for raising anti-elactrostatic break-down ability of Hall device
08/27/2008CN100414728C White light LED package radiating structure
08/27/2008CN100414706C Electrostatic discharge protection circuit and semiconductor structure for electrostatic discharge
08/27/2008CN100414705C Vertical-oriented super small fuse and circuit element of super small resistor
08/27/2008CN100414704C Plane flip-chip LED integrated chip and producing method
08/27/2008CN100414703C Method of manufacturing a semiconductor device
08/27/2008CN100414702C Semiconductor packing and manufacturing method
08/27/2008CN100414700C Test key structure
08/27/2008CN100414699C Wiring substrate
08/27/2008CN100414698C Power surface mount light emitting die package
08/27/2008CN100414697C DC-DC converter implemented in a land grid array package
08/27/2008CN100414696C Lead frame, its manufacturing method and resin sealed semiconductor device and its manufacturing method
08/27/2008CN100414695C Thermolysis modules possessing guidance air pipe
08/27/2008CN100414694C Parallel plate heat transfer device and its manufacturing method
08/27/2008CN100414693C Heat sink
08/27/2008CN100414691C Heat sink fastener
08/27/2008CN100414690C Great power device and its heat sink pressure-mounting method
08/27/2008CN100414689C Electronic part manufacturing method and electronic part
08/27/2008CN100414688C Semiconductor device and its manufacturing method
08/27/2008CN100414564C RFID device and method of making same
08/27/2008CN100414243C Boiling cooling device
08/27/2008CN100413632C Snagau solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
08/27/2008CA2579869A1 Semiconductor heat-transfer method
08/26/2008US7418685 Layout method for miniaturized memory array area
08/26/2008US7418643 Integrated circuit having electrically isolatable test circuitry
08/26/2008US7417872 Circuit board with trace configuration for high-speed digital differential signaling
08/26/2008US7417861 Vehicular power converter
08/26/2008US7417857 Power-electronic-cooling device
08/26/2008US7417838 Semiconductor integrated circuit
08/26/2008US7417702 Display device
08/26/2008US7417694 Thin film transistor array panel and liquid crystal display including the panel
08/26/2008US7417330 Semiconductor device packaged into chip size and manufacturing method thereof
08/26/2008US7417329 System-in-package structure
08/26/2008US7417328 External power ring with multiple tapings to reduce IR drop in integrated circuit
08/26/2008US7417327 IC chip package with cover
08/26/2008US7417326 Semiconductor device and manufacturing method of the same
08/26/2008US7417325 Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts
08/26/2008US7417324 Semiconductor device and method for manufacturing the same
08/26/2008US7417323 Neo-wafer device and method
08/26/2008US7417322 Multi-chip module with embedded package and method for manufacturing the same
08/26/2008US7417321 Via structure and process for forming the same
08/26/2008US7417320 Substrate structure and manufacturing method of the same
08/26/2008US7417319 Semiconductor device with connecting via and dummy via and method of manufacturing the same
08/26/2008US7417318 Thick film circuit board, method of producing the same and integrated circuit device
08/26/2008US7417317 Post passivation interconnection schemes on top of the IC chips
08/26/2008US7417316 Wired circuit forming board, wired circuit board, and thin metal layer forming method
08/26/2008US7417314 Semiconductor chip assembly with laterally aligned bumped terminal and filler
08/26/2008US7417313 Method for manufacturing an adhesive substrate with a die-cavity sidewall
08/26/2008US7417312 Use of solder paste for heat dissipation
08/26/2008US7417311 Semiconductor device and method of fabricating the same
08/26/2008US7417309 Circuit device and portable device with symmetrical arrangement
08/26/2008US7417308 Stack type package module and method for manufacturing the same
08/26/2008US7417307 System and method for direct-bonding of substrates
08/26/2008US7417306 Apparatuses and methods for forming electronic assemblies
08/26/2008US7417305 Electronic devices at the wafer level having front side and edge protection material and systems including the devices
08/26/2008US7417304 Electronic device and method for fabricating the same
08/26/2008US7417303 System and method for ESD protection
08/26/2008US7417301 Semiconductor component with coreless transformer
08/26/2008US7417299 Direct connection multi-chip semiconductor element structure
08/26/2008US7417294 Microelectronic imaging units and methods of manufacturing microelectronic imaging units
08/26/2008US7417293 Image sensor packaging structure
08/26/2008US7417286 Semiconductor integrated circuit devices having single crystalline thin film transistors and methods of fabricating the same
08/26/2008US7417283 CMOS device with dual polycide gates and method of manufacturing the same
08/26/2008US7417275 Capacitor pair structure for increasing the match thereof
08/26/2008US7417263 Transparent electrode
08/26/2008US7417198 Radiofrequency power semiconductor module with cavity housing, and method for producing it
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