Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2008
08/28/2008US20080203542 Ion-assisted oxidation methods and the resulting structures
08/28/2008US20080203541 Semiconductor device and manufacturing method of the same
08/28/2008US20080203540 Structure and method for device-specific fill for improved anneal uniformity
08/28/2008US20080203539 Semiconductor Components With Conductive Interconnects
08/28/2008US20080203538 Semiconductor wafer with division guide pattern
08/28/2008US20080203534 Complementary zener triggered bipolar esd protection
08/28/2008US20080203525 Capacitance trimming circuit of semiconductor device having vertically stacked capacitor layers and operation method thereof
08/28/2008US20080203524 Localized temperature control during rapid thermal anneal
08/28/2008US20080203523 Localized temperature control during rapid thermal anneal
08/28/2008US20080203513 Semiconductor Integrated Device Having Solid-State Image Sensor Packaged Within and Production Method for Same
08/28/2008US20080203510 Optical module
08/28/2008US20080203491 Radiation hardened finfet
08/28/2008US20080203450 Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus
08/28/2008US20080203439 Semiconductor integrated circuit having plural transistors
08/28/2008US20080203424 Diode and applications thereof
08/28/2008US20080203420 Collective Substrate, Semiconductor Element Mount, Semiconductor Device, Imaging Device, Light Emitting Diode Component and Light Emitting Diode
08/28/2008US20080203392 Display substrate, method of manufacturing the same and display device having the same
08/28/2008US20080203388 Apparatus and method for detection of edge damages
08/28/2008US20080202801 Circuit Board Structure and Method for Manufacturing a Circuit Board Structure
08/28/2008US20080202792 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
08/28/2008US20080202421 Mask and substrate alignment for solder bump process
08/28/2008US20080201944 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
08/28/2008DE202008008583U1 Verdrahtung innerhalb integrierter Schaltkreise Wiring within integrated circuits
08/28/2008DE112006002635T5 Schaltungsmodul und Schaltungsvorrichtung, die ein Schaltungsmodul umfasst A circuit module and circuit device comprising a circuit module
08/28/2008DE112004002839T5 Vorrichtung für den Wärmetransport und Verfahren zu dessen Herstellung Apparatus for the heat transport and process for its preparation
08/28/2008DE10227009B4 Detektionseinrichtung für Übertemperaturereignisse eines elektronischen Bauelements und Verfahren zum Detektieren eines Übertemperaturereignisses Detection means for over-temperature events of an electronic device and method for detecting an over-temperature event
08/28/2008DE102008011265A1 Lötschicht und Substrat zum Bonden von Vorrichtungen, das diese verwendet, und Verfahren zum Herstellen eines solchen Substrats Solder layer and the substrate for bonding devices that uses these, and methods for making such a substrate
08/28/2008DE102008010098A1 Halbleiterpackage mit einer ein Die aufnehmenden durchgehenden Ausnehmung und einer Verbindungsbohrung und ein Verfahren zu deren Herstellung A semiconductor package having a die receiving a continuous recess, and a connecting bore and a method for their preparation
08/28/2008DE102008008514A1 Multichipmodul Multi-chip module
08/28/2008DE102008008085A1 Semiconductor component, has intermediate layer dielectric arranged on mask structure, and conductive structure provided in opening, which is electrically connected with another conductive structure
08/28/2008DE102008008068A1 Semiconductor package for e.g. integrated circuit card in e.g. mobile phone, has external contact terminal provided within through-hole, which electrically connects conductive pattern to semiconductor chip
08/28/2008DE102008005866A1 Stapelpackung, Verfahren zur Herstellung derselben und Speicherkarte Stack pack, method for producing the same and the memory card
08/28/2008DE102008000217A1 Halbleiterbauelement-Teststrukturen und -verfahren Semiconductor device test structures and procedures
08/28/2008DE102007060931A1 Encapsulation module producing and/or micromechanical arrangement encapsulating method, involves forming insulated material mound on base of semiconductor material by structuring and/or etching process
08/28/2008DE102007060313A1 Wafer Level Package (WLP) mit guter CTE-Eigenschaft und Verfahren zu deren Herstellung Wafer Level Package (WLP) with good CTE property, and processes for their preparation
08/28/2008DE102007039905A1 Heat conducting material layer production method for use in solar technology, involves elongation of multiple nodular fibers in longitudinal direction having heat conductivity more than in another direction
08/28/2008DE102007039904A1 Heat-conductive material layer manufacturing method, involves inserting fibers in field area and transporting towards carrier layer, where fibers have large heat-conductivity toward fiber longitudinal direction than other direction
08/28/2008DE102007009521A1 Bauteil, Leistungsbauteil, Vorrichtung, Verfahren zum Herstellen eines Bauteils und Verfahren zum Herstellen eines Leistungshalbleiterbauteils Component power device, apparatus, method for manufacturing a component and method for manufacturing a power semiconductor device
08/28/2008DE102007008934A1 Vorrichtung und Speichervorrichtung, Verfahren zur Herstellung von Strukturen in einem Werkstück und Verfahren zur Herstellung einer Speichervorrichtung Apparatus and storage device, process for the preparation of structures in a workpiece and methods of making a memory device
08/28/2008DE102007007224A1 Leistungshalbleitermodul The power semiconductor module
08/28/2008DE102007007113A1 Vielschicht-Bauelement Multilayer component
08/28/2008DE102006017115B4 Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung A semiconductor device comprising a plastic housing and method for its preparation
08/28/2008DE102005015036B4 Verfahren zur Montage eines Chips auf einer Unterlage A method of mounting a chip on a base
08/28/2008DE102004049249B4 Elektronikmodul, Waferprodukt und Herstellungsverfahren Electronics module, wafer product and manufacturing process
08/28/2008DE102004038970B4 HF-Zwischenverbindung für Mehrfach-Verdrahtungsebenen mit impedanzdefinierten Leiterbahnstrukturen RF interconnect for multiple wiring layers with defined impedance interconnect structures
08/28/2008DE102004027185B4 Niederinduktives Halbleiterbauelement mit Halbbrückenkonfiguration Niederinduktives semiconductor component with a half-bridge configuration
08/27/2008EP1962345A2 Photoelectric conversion apparatus with dual-damascene interconnections and image pickup system using the same
08/27/2008EP1962344A1 Electronic device packages and methods of formation
08/27/2008EP1962343A2 Semiconductor device
08/27/2008EP1962342A1 Substrate with built-in chip and method for manufacturing substrate with built-in chip
08/27/2008EP1961696A1 Electronic part sealing board, electronic part sealing board in multiple part form, electronic device using electronic part sealing board, and electronic device fabricating method
08/27/2008EP1961282A2 Arrangement comprising at least one electronic component
08/27/2008EP1961043A2 Universal pad arrangement for surface mounted semiconductor devices
08/27/2008EP1961036A1 Wafer level hermetic bond using metal alloy with raised feature
08/27/2008EP1960728A1 Finned heat sink, particularly for a thermoelectric module
08/27/2008EP1781741B1 Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter
08/27/2008EP1744453B1 Surface acoustic wave device
08/27/2008CN201107810Y Luminous diode conducting wire rack structure
08/27/2008CN201107809Y Luminous diode encapsulation structure
08/27/2008CN201107808Y Light sensing device with light gathering structure
08/27/2008CN201107807Y Micro special motor controlled IC module
08/27/2008CN201106835Y LED illumination device
08/27/2008CN201106833Y Direct heat radiation illuminating device
08/27/2008CN201106832Y Multi-estate heat radiation illuminating device
08/27/2008CN201106831Y LED lamp radiator
08/27/2008CN201106830Y High heat radiation performance LED lighting unit as well as lamp containing the same capable of deploying light
08/27/2008CN201106815Y Anticorrosion LED light source for ship
08/27/2008CN201106793Y LED solid lighting lamp
08/27/2008CN101253821A Hardware protected sensor for preventing sensitive electronic data component from being operated by external
08/27/2008CN101253627A Circuit device and method for manufacturing same
08/27/2008CN101253626A Circuit device and method for manufacturing same
08/27/2008CN101253625A Chip capacitive coupling
08/27/2008CN101253624A Electrically shielded through-wafer interconnect
08/27/2008CN101253623A Method for the production of a semiconductor component comprising a planar contact, and semiconductor component
08/27/2008CN101253615A Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
08/27/2008CN101253447A Thin-film transistor substrate and display device
08/27/2008CN101253246A Insulating liquid die-bonding agent and semiconductor device
08/27/2008CN101252822A EHD intensification minitype heat radiating device
08/27/2008CN101252821A Heat sinking method, system and device
08/27/2008CN101252814A Wiring substrate
08/27/2008CN101252342A Single chip radio-frequency power amplifier
08/27/2008CN101252292A Integrated circuit device and electronic instrument
08/27/2008CN101252291A Integrated circuit device and electronic instrument
08/27/2008CN101252164A Surface mounting type light emitting diode and method for manufacturing the same
08/27/2008CN101252161A LED using alloy to fix chip
08/27/2008CN101252157A Encapsulation structure of LED light source
08/27/2008CN101252145A Carbon nanometer tube nano electronic device and manufacturing method thereof
08/27/2008CN101252144A 存储器件和存储器 And a memory storage device
08/27/2008CN101252142A Solid-state imaging apparatus, manufacturing method therefor and electronic equipment using the same
08/27/2008CN101252141A Wafer level image sensor package with die receiving cavity and method of making the same
08/27/2008CN101252138A Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus
08/27/2008CN101252137A Photoelectric conversion devise and method of manufacturing the same
08/27/2008CN101252136A Thin-film transistor substrate and LCD device with the same
08/27/2008CN101252133A Semiconductor device and method for manufacturing the same
08/27/2008CN101252131A Current mirroring circuit
08/27/2008CN101252130A Semiconductor integrated circuit device and layout method thereof
08/27/2008CN101252128A Semiconductor device and trimming method therefor
08/27/2008CN101252126A 半导体元件 Semiconductor components
08/27/2008CN101252125A Multi-chips package with reduced structure and method for forming the same
08/27/2008CN101252122A Hermetically sealed optoelectronic mems wafer level package
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