Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2008
09/02/2008US7420267 Image sensor assembly and method for fabricating the same
09/02/2008US7420266 Circuit device and manufacturing method thereof
09/02/2008US7420265 Integrated circuit package system with integrated circuit support
09/02/2008US7420264 High reflector tunable stress coating, such as for a MEMS mirror
09/02/2008US7420263 DBG system and method with adhesive layer severing
09/02/2008US7420262 Electronic component and semiconductor wafer, and method for producing the same
09/02/2008US7420252 LDMOS device with improved ESD performance
09/02/2008US7420251 Electrostatic discharge protection circuit and driving circuit for an LCD using the same
09/02/2008US7420250 Electrostatic discharge protection device having light doped regions
09/02/2008US7420229 Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing
09/02/2008US7420224 Active rectifier module for three-phase generators of vehicles
09/02/2008US7420215 Transparent conductive film, semiconductor device and active matrix display unit
09/02/2008US7420211 Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof
09/02/2008US7420168 Scanning electron microscope and CD measurement calibration standard specimen
09/02/2008US7420131 Wiring substrate
09/02/2008US7420129 Semiconductor package including a semiconductor device, and method of manufacturing the same
09/02/2008US7420127 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
09/02/2008US7419919 Method of manufacturing semiconductor device
09/02/2008US7419916 Manufacturing method of semiconductor device
09/02/2008US7419902 Method of manufacture of semiconductor integrated circuit
09/02/2008US7419900 Post passivation interconnection schemes on top of the IC chips
09/02/2008US7419856 Methods of fabricating integrated circuit devices having fuse structures including buffer layers
09/02/2008US7419854 Methods for packaging image sensitive electronic devices
09/02/2008US7419841 Microelectronic imagers and methods of packaging microelectronic imagers
09/02/2008US7419840 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment
09/02/2008US7419613 Method and device for plasma-etching organic material film
09/02/2008US7419299 Methods of sensing temperature of an electronic device workpiece
08/2008
08/28/2008WO2008103752A1 High-speed memory package
08/28/2008WO2008103676A1 Led light with active cooling
08/28/2008WO2008103603A1 Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
08/28/2008WO2008103518A1 Packaged ic device comprising an embedded flex circuit, and methods of making same
08/28/2008WO2008103232A1 Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components
08/28/2008WO2008102332A1 Optically monitoring an alox (tm) fabrication process
08/28/2008WO2008102282A2 Semiconductor device with backside tamper protection
08/28/2008WO2008102266A2 Method and apparatus for rapid fabrication of functional printed circuit board
08/28/2008WO2008101433A1 Surface mount device and manufacturing method thereof
08/28/2008WO2008101384A1 Heat transfer device and manufacturing method thereof
08/28/2008WO2008085687A3 Method of packaging semiconductor devices
08/28/2008WO2008076955A3 Microball mounting method and mounting device
08/28/2008WO2007130870A3 Conductive stiffener for a flexible substrate
08/28/2008WO2007102886A3 Electronic assembly having graded wire bonding
08/28/2008WO2007056689A3 Nitrogen based implants for defect reduction in strained silicon
08/28/2008US20080206983 Method of manufacturing photoelectric conversion device
08/28/2008US20080206979 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
08/28/2008US20080206978 Electronic fuses in semiconductor integrated circuits
08/28/2008US20080206929 Printing device, production unit, and production method of electronic parts
08/28/2008US20080206926 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
08/28/2008US20080206925 Methods and apparatus to improve frit-sealed glass package
08/28/2008US20080206908 Semiconductor device test structures and methods
08/28/2008US20080206588 Layer Sequence and Method of Manufacturing a Layer Sequence
08/28/2008US20080205111 Semiconductor memory device and defect remedying method thereof
08/28/2008US20080204115 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
08/28/2008US20080204091 Semiconductor chip package and method for fabricating semiconductor chip
08/28/2008US20080204065 Fault tolerant selection of die on wafer
08/28/2008US20080203590 Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
08/28/2008US20080203589 Variable fill and cheese for mitigation of beol topography
08/28/2008US20080203587 Semiconductor device including conductive lines with fine line width and method of fabricating the same
08/28/2008US20080203586 Integrated Circuit and Methods of Manufacturing a Contact Arrangement and an Interconnection Arrangement
08/28/2008US20080203585 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
08/28/2008US20080203583 Semiconductor package and fabrication method thereof
08/28/2008US20080203582 Semiconductor device
08/28/2008US20080203581 Integrated circuit
08/28/2008US20080203580 Semiconductor chip and shielding structure thereof
08/28/2008US20080203579 Sacrificial metal spacer dual damascene
08/28/2008US20080203578 Circuit device, a method for manufacturing a circuit device, and a semiconductor module
08/28/2008US20080203577 Semiconductor integrated circuit device and fabrication method for the same
08/28/2008US20080203576 Semiconductor device and method for manufacturing the same
08/28/2008US20080203575 Integrated Circuit with Re-Route Layer and Stacked Die Assembly
08/28/2008US20080203574 Polysilsesquioxanes; wear resistance; etching resistance; dielectrics; reduced parasitic capacitance
08/28/2008US20080203573 Semiconductor device
08/28/2008US20080203572 Semiconductor device and method of fabricating the same
08/28/2008US20080203571 Backside metallization for integrated circuit devices
08/28/2008US20080203570 Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method
08/28/2008US20080203569 Semiconductor device and manufacturing method thereof
08/28/2008US20080203568 Semiconductor device
08/28/2008US20080203567 Semiconductor package and semiconductor device using the same
08/28/2008US20080203566 Stress buffer layer for packaging process
08/28/2008US20080203565 Semiconductor device and method of manufacturing the same
08/28/2008US20080203564 Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same
08/28/2008US20080203563 Semiconductor package and manufacturing method thereof
08/28/2008US20080203562 Method for designing semiconductor device and semiconductor device
08/28/2008US20080203561 High frequency device module and manufacturing method thereof
08/28/2008US20080203560 Semiconductor device
08/28/2008US20080203559 Power device package and semiconductor package mold for fabricating the same
08/28/2008US20080203558 Method of semiconductor device protection, package of semiconductor device
08/28/2008US20080203557 Semiconductor module and method of manufacturing the same
08/28/2008US20080203556 Through-Wafer Interconnection
08/28/2008US20080203555 Universal substrate and semiconductor device utilizing the substrate
08/28/2008US20080203554 Semiconductor integrated circuit device
08/28/2008US20080203553 Stackable bare-die package
08/28/2008US20080203552 Stacked Package and Method of Fabricating the Same
08/28/2008US20080203551 Multi-chip module and single-chip module for chips and proximity connectors
08/28/2008US20080203550 Component, Power Component, Apparatus, Method Of Manufacturing A Component, And Method Of Manufacturing A Power Semiconductor Component
08/28/2008US20080203549 Stackable integrated circuit package system with multiple interconnect interface
08/28/2008US20080203548 High current semiconductor power device soic package
08/28/2008US20080203547 Insert molded leadframe assembly
08/28/2008US20080203546 Quad flat no-lead chip carrier with stand-off
08/28/2008US20080203545 Semiconductor device and method of fabrication thereof
08/28/2008US20080203544 Semiconductor wafer structure with balanced reflectance and absorption characteristics for rapid thermal anneal uniformity
08/28/2008US20080203543 Semiconductor integrated circuit substrate containing isolation structures
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