| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/03/2008 | CN101256993A 半导体器件 Semiconductor devices |
| 09/03/2008 | CN101256992A Heat radiating device |
| 09/03/2008 | CN101256991A Package structure to improve the reliability for WLP |
| 09/03/2008 | CN101256990A Electronic apparatus and mounting method |
| 09/03/2008 | CN101256989A Semiconductor epitaxial thin film encapsulation of vertical structure |
| 09/03/2008 | CN101256988A Semiconductor device with multi-layered wiring arrangement including reinforcing patterns, and production method for manufacturing such semiconductor device |
| 09/03/2008 | CN101256986A Manufacturing method of LCD device and TFT completing substrate thereof |
| 09/03/2008 | CN101256985A Thin-film transistor array substrate and manufacturing method thereof |
| 09/03/2008 | CN101256980A Organic electroluminescent display apparatus and manufacturing method thereof |
| 09/03/2008 | CN101256978A Method for making electronic fuses and semiconductor structure |
| 09/03/2008 | CN101256977A Semiconductor structure and forming method of semiconductor structure |
| 09/03/2008 | CN101256973A Layered microelectronic contact and method for fabricating same |
| 09/03/2008 | CN101256970A Low temperature sintering using sn2+ containing inorganic materials to hermetically seal a device |
| 09/03/2008 | CN101256969A Seal for light emitting display device and method |
| 09/03/2008 | CN101256968A LED illuminating device and manufacture method thereof |
| 09/03/2008 | CN101256966A Semiconductor component and method of manufacture |
| 09/03/2008 | CN101256965A Structure embedded with semiconductor chip and its manufacturing method |
| 09/03/2008 | CN101256963A LED chip packaging structure with thick guide feet and manufacturing method thereof |
| 09/03/2008 | CN101256962A Electronic part and method for manufacturing the same |
| 09/03/2008 | CN101256961A Thin-film transistor structure, pixel structure and manufacturing method thereof |
| 09/03/2008 | CN101256931A Method for manufacturing epitaxial wafers for integrated devices on common compound semiconductor III-V wafer |
| 09/03/2008 | CN101256852A Thin film short circuit tablet for microwave circuit and manufacturing method thereof |
| 09/03/2008 | CN101255980A Heat pipe radiator and high-power LED road lamp |
| 09/03/2008 | CN101255959A Integration type LED array light source and method for manufacturing the same |
| 09/03/2008 | CN101255321A Highly conductive composition for wafer coating |
| 09/03/2008 | CN100417312C Print circuit board with improved heat rejection structure and electronic device |
| 09/03/2008 | CN100417310C Printed circuit board with radiating element, its manufacturing method and device containing it |
| 09/03/2008 | CN100417309C 电路装置 Circuit means |
| 09/03/2008 | CN100417038C Input device usable as electronic label and its manufacturing method |
| 09/03/2008 | CN100417022C Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, related circuit, instrument and program |
| 09/03/2008 | CN100416953C Semiconductor laser device and method of producing the same |
| 09/03/2008 | CN100416942C IC socket assembly |
| 09/03/2008 | CN100416921C Adhesive film for circuit connection, and circuit connection structure |
| 09/03/2008 | CN100416875C Structure of package using coupling and its forming method |
| 09/03/2008 | CN100416861C Detector arrangement, method for the detection of electrical charge carriers |
| 09/03/2008 | CN100416842C Structure of complementary metal oxide semiconductor image sensor and its manufacturing method |
| 09/03/2008 | CN100416836C Low-voltage punch-through bi-directional transient-voltage suppression devices having surface breakdown protection and methods of making the same |
| 09/03/2008 | CN100416835C Semiconductor memory device and making method thereof |
| 09/03/2008 | CN100416832C Static discharger capable of avoiding deadlock phenomenon |
| 09/03/2008 | CN100416830C Protection device of semiconductor circuit with electrostatic discharge protecting circuit |
| 09/03/2008 | CN100416827C 封装元件 Packaging components |
| 09/03/2008 | CN100416824C Low voltage nmos-based electrostatic discharge clamp circuit |
| 09/03/2008 | CN100416823C Electrostatic discharge protection divice |
| 09/03/2008 | CN100416822C Static discharge protective circuit |
| 09/03/2008 | CN100416821C Semiconductor device having a measuring pattern and a method of measuring the semiconductor device |
| 09/03/2008 | CN100416820C Semiconductor device structure and manufacturing technology thereof |
| 09/03/2008 | CN100416819C Semiconductor device using solid phase epitaxy and method for manufacturing the same |
| 09/03/2008 | CN100416818C Semiconductor device and method of fabricating the same |
| 09/03/2008 | CN100416817C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 09/03/2008 | CN100416816C Method for mfg solid imaging device |
| 09/03/2008 | CN100416815C Lead frame with included passive devices, and its forming method |
| 09/03/2008 | CN100416814C Structure for mounting semiconductor and method of manufacturing mounting substrate used therein |
| 09/03/2008 | CN100416813C Mounting structure and mounting method of a semiconductor device, and liquid crystal display device |
| 09/03/2008 | CN100416812C Semiconductor device, display module, and manufacturing method of semiconductor device |
| 09/03/2008 | CN100416811C Photoelectric chip package structure, manufacturing method and its chip carrier |
| 09/03/2008 | CN100416810C Semiconductor component and its making method |
| 09/03/2008 | CN100416809C Bond pad structure for integrated circuit chip |
| 09/03/2008 | CN100416808C Chip packaging body without kernel dielectric layer and stack chip packaging structure |
| 09/03/2008 | CN100416807C Semiconductor package structure and producing method thereof |
| 09/03/2008 | CN100416806C Packaging structure with projected zone carrying crystals, crystals carried substrate and crystals carried assembly |
| 09/03/2008 | CN100416805C Radiator and cooler |
| 09/03/2008 | CN100416804C Power stack |
| 09/03/2008 | CN100416803C Semiconductor device, method for manufacturing same, and power converter using such semiconductor device |
| 09/03/2008 | CN100416802C Method and structure for a wafer level packaging |
| 09/03/2008 | CN100416796C Double lineage structure by treating with supercritical fluid and forming method thereof |
| 09/03/2008 | CN100416789C Method for arraying chip of first lining to second lining |
| 09/03/2008 | CN100416784C Interconnection method without lead bosses |
| 09/03/2008 | CN100416783C Method for manufacturing downward bug hole type chip encapsulation structure and structure therefor |
| 09/03/2008 | CN100416782C Chip radiator fin-fitting method |
| 09/03/2008 | CN100416781C System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler |
| 09/03/2008 | CN100416768C Wafer coating and singulation method |
| 09/03/2008 | CN100416388C Thin film transistor array panel for liquid crystal display |
| 09/03/2008 | CN100415646C Anomalous expansion materials |
| 09/03/2008 | CN100415634C Electronic device with covering layer in cavity, and manufacture method thereof |
| 09/02/2008 | US7421028 Transformer isolator for digital power supply |
| 09/02/2008 | US7420810 Base heat spreader with fins |
| 09/02/2008 | US7420809 Heat spreader in integrated circuit package |
| 09/02/2008 | US7420807 Cooling device for electronic apparatus |
| 09/02/2008 | US7420790 Integrated circuit with protection against electrostatic damage |
| 09/02/2008 | US7420754 Optical module and method for manufacturing the same |
| 09/02/2008 | US7420728 Methods of fabricating interferometric modulators by selectively removing a material |
| 09/02/2008 | US7420286 Reduced inductance in ball grid array packages |
| 09/02/2008 | US7420285 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 09/02/2008 | US7420284 Semiconductor device and manufacturing method thereof |
| 09/02/2008 | US7420283 Integration type semiconductor device and method for manufacturing the same |
| 09/02/2008 | US7420282 Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
| 09/02/2008 | US7420281 Stacked chip semiconductor device |
| 09/02/2008 | US7420280 Reduced stress under bump metallization structure |
| 09/02/2008 | US7420279 Carbon containing silicon oxide film having high ashing tolerance and adhesion |
| 09/02/2008 | US7420278 Semiconductor device |
| 09/02/2008 | US7420277 System for heat dissipation in semiconductor devices |
| 09/02/2008 | US7420276 Post passivation structure for semiconductor chip or wafer |
| 09/02/2008 | US7420275 Boron-doped SIC copper diffusion barrier films |
| 09/02/2008 | US7420274 Method for forming a redistribution layer in a wafer structure |
| 09/02/2008 | US7420273 Thinned die integrated circuit package |
| 09/02/2008 | US7420272 Two-sided wafer escape package |
| 09/02/2008 | US7420271 Heat conductivity and brightness enhancing structure for light-emitting diode |
| 09/02/2008 | US7420270 Tape wiring substrate and chip-on-film package using the same |
| 09/02/2008 | US7420269 Stacked integrated circuit package-in-package system |
| 09/02/2008 | US7420268 Semiconductor chip package and application device thereof |