Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2008
09/04/2008US20080211076 Semiconductor device and manufacturing method thereof
09/04/2008US20080211075 Image sensor chip scale package having inter-adhesion with gap and method of the same
09/04/2008US20080211074 Ic card and method of manufacturing the same
09/04/2008US20080211073 Airtight package
09/04/2008US20080211072 Testing and burn-in using a strip socket
09/04/2008US20080211071 Memory IC Package Assembly Having Stair Step Metal Layer and Apertures
09/04/2008US20080211070 Flip chip contact (FCC) power package
09/04/2008US20080211069 Semiconductor package configuration with improved lead portion arrangement
09/04/2008US20080211068 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
09/04/2008US20080211067 Semiconductor device
09/04/2008US20080211066 Barrier film and method of producing barrier film
09/04/2008US20080211065 Semiconductor devices and methods of manufacture thereof
09/04/2008US20080211063 Semiconductor wafer and manufacturing method of semiconductor device
09/04/2008US20080211059 Electronic fuse having heat spreading structure
09/04/2008US20080211056 Semiconductor device and a method of manufacturing the same and designing the same
09/04/2008US20080211049 Method and device for integrating an illumination source and detector into the same ic package that allows angular illumination with a common planar leadframe
09/04/2008US20080211040 Semiconductor nanowire and deposited catalyst material; such as glucose level monitors for controlling insulin release
09/04/2008US20080211029 Semiconductor device and a method of manufacturing the same
09/04/2008US20080211027 ESD structure without ballasting resistors
09/04/2008US20080211026 Coupling well structure for improving HVMOS performance
09/04/2008US20080211010 Semiconductor device
09/04/2008US20080210995 Image sensor and method for fabricating the same
09/04/2008US20080210970 Fabrication of Conductive Metal Layer on Semiconductor Devices
09/04/2008DE112004000661T5 Integrierte Schaltung mit einem magnetisch ummantelten Leiter An integrated circuit comprising a magnetically coated conductor
09/04/2008DE10342776B4 Verfahren zur Bestimmung von Korrekturwerten für die Justage eines Halbleiterwafers in einem Projektionsapparat zur photolithographischen Strukturierung einer Metallschicht A method for determining correction values ​​for the adjustment of a semiconductor wafer in a projection apparatus for the photolithographic patterning of a metal layer
09/04/2008DE10312238B4 Leistungshalbleitereinrichtung Power semiconductor device
09/04/2008DE10261410B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement
09/04/2008DE102008008515A1 Modul mit siliziumbasierter Schicht Module with silicon-based layer
09/04/2008DE102008008165A1 Semiconductor device e.g. flash memory, has several voids that are formed in insulation layer such that void is provided between adjacent redistribution lines
09/04/2008DE102008006835A1 Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements An electronic device and method for manufacturing an electronic component
09/04/2008DE102007021904A1 Housing body for opto-electronic component, has main surface with surface area and another surface area, and both surface areas are adjoined together by outer edge
09/04/2008DE102007010711A1 Circuit arrangement for measuring device, has electric contact fabricating conductive connection between substrate and microelectronic component, where part of electric contact is provided between substrate and microelectronic component
09/04/2008DE102007007223A1 Power semiconductor module comprises partial modules, which have housing, where partial modules are connected with each other by connecting elements in power semiconductor module
09/04/2008DE102005056916B4 Verfahren zum Gestalten einer Überlagerungs-Markierung A method of designing an overlay mark
09/03/2008EP1965620A1 Method for manufacturing printed wiring board
09/03/2008EP1965617A2 Method for encapsulting multiple lead frames
09/03/2008EP1965424A2 A flow distribution module and a stack of flow distribution modules
09/03/2008EP1965423A2 Metal/ceramic bonding substrate and brazing filler metal for use therein
09/03/2008EP1965421A2 Wiring structure, forming method of the same and printed wiring board
09/03/2008EP1965420A2 Compliant pin strip with integrated dam bar
09/03/2008EP1964450A1 Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof
09/03/2008EP1964188A2 Carbon nanotubes for the selective transfer of heat from electronics
09/03/2008EP1964174A2 Enhanced substrate using metamaterials
09/03/2008EP1964173A1 Microcomponent comprising two wafers interconnected by pins and the associated interconnection process
09/03/2008EP1964172A2 Multi-fluid coolant system
09/03/2008EP1964171A2 On-chip interconnect-stack cooling using sacrificial interconnect segments
09/03/2008EP1964034A2 Electrical device and film embossing manufacturing techniques
09/03/2008EP1964033A2 Method of manufacturing rfid devices
09/03/2008EP1714318A4 Insert molding electronic devices
09/03/2008EP1389345A4 Chip scale package with flip chip interconnect
09/03/2008EP0885483B1 Push-pull power amplifier
09/03/2008CN201110529Y Light-emitting diode lamp with fan heat radiation function
09/03/2008CN201110528Y LED lamp with blasting air type to radiate heat
09/03/2008CN201110527Y High power LED light source device
09/03/2008CN201110526Y LED lighting lamp with light modulation heat conducting pillar
09/03/2008CN201110525Y LED heat radiation structure lamp body
09/03/2008CN201110508Y Luminous diode having electrode with insulation layer
09/03/2008CN201110500Y LED lighting lamp
09/03/2008CN201110471Y LED lamp and improved insulation structure of cooling device thereof
09/03/2008CN101258656A Guardringed SCR ESD protection
09/03/2008CN101258595A Improved microelectronic bond pad
09/03/2008CN101258594A Thermal interface materials, methods of preparation thereof and their applications
09/03/2008CN101258593A Isolated chip-to-chip contrct
09/03/2008CN101258198A Resin composition and hybrid integrated circuit board making use of the same
09/03/2008CN101258178A Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them
09/03/2008CN101257973A Cure catalyst, composition, electronic device and associated method
09/03/2008CN101257784A Cooling device for information equipment
09/03/2008CN101257783A Electrical device and cooling method for an electrical device
09/03/2008CN101257781A Electronic equipment and heat radiator
09/03/2008CN101257779A Heat sink
09/03/2008CN101257778A Radiating assembly and thermal pipe thereof
09/03/2008CN101257777A Method for fixing hot pipe and heat radiation block of heat radiator
09/03/2008CN101257074A Novel LED and LCD back light source using the same
09/03/2008CN101257073A Optical module
09/03/2008CN101257049A Thin-film transistor, active array substrate and manufacturing method thereof
09/03/2008CN101257036A Organic electroluminescence display device
09/03/2008CN101257031A Thin-film transistor array substrate and manufacturing method thereof
09/03/2008CN101257028A Thin film transistor and manufacturing including the same
09/03/2008CN101257024A Nand flash memory device with 3-dimensionally arranged memory cell transistors
09/03/2008CN101257018A Electrostatic protection circuit with discrete polycrystal gate structure
09/03/2008CN101257015A Organic electroluminescent device and fabrication method thereof
09/03/2008CN101257013A Semiconductor device and semiconductor module using the same
09/03/2008CN101257011A Low profile flip chip power module and method of making
09/03/2008CN101257010A LED illuminating device with high heat radiation performance
09/03/2008CN101257009A LED encapsulation body and encapsulation method thereof
09/03/2008CN101257008A 半导体装置 Semiconductor device
09/03/2008CN101257007A Semiconductor device having time sequence structure
09/03/2008CN101257006A Illuminating device
09/03/2008CN101257005A Silicium control rectifier protecting electro-static discharge
09/03/2008CN101257004A Wiring structure, forming method of the same and printed wiring board
09/03/2008CN101257003A Insulating film material, multilayer interconnection structure, method for manufacturing same, and method for manufacturing semiconductor device
09/03/2008CN101257002A 绝缘膜 Insulating film
09/03/2008CN101257001A Semiconductor device and method for fabricating the same
09/03/2008CN101257000A Structure including via and manufacturing method thereof
09/03/2008CN101256999A Interposer and manufacturing method for the same
09/03/2008CN101256998A Semiconductor device using anisotropic conductive adhesive layer and manufacturing method thereof
09/03/2008CN101256997A Encapsulation structure capable of reducing encapsulation stress
09/03/2008CN101256996A Semiconductor device and manufacturing method of the semiconductor device
09/03/2008CN101256995A Semiconductor packaging body and silicon-based packaging substrate
09/03/2008CN101256994A Semiconductor device and manufacturing method thereof
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