| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/09/2008 | US7423344 Bi-layer etch stop process for defect reduction and via stress migration improvement |
| 09/09/2008 | US7423343 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 09/09/2008 | US7423342 Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine |
| 09/09/2008 | US7423341 Plastic overmolded packages with mechanically decoupled lid attach attachment |
| 09/09/2008 | US7423340 Semiconductor package free of substrate and fabrication method thereof |
| 09/09/2008 | US7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 09/09/2008 | US7423338 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 09/09/2008 | US7423337 Integrated circuit device package having a support coating for improved reliability during temperature cycling |
| 09/09/2008 | US7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
| 09/09/2008 | US7423335 Sensor module package structure and method of the same |
| 09/09/2008 | US7423334 Image sensor module with a protection layer and a method for manufacturing the same |
| 09/09/2008 | US7423333 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device |
| 09/09/2008 | US7423332 Vertical laminated electrical switch circuit |
| 09/09/2008 | US7423331 Molded stiffener for thin substrates |
| 09/09/2008 | US7423330 Semiconductor device with strain |
| 09/09/2008 | US7423314 Semiconductor memory device and method for the same |
| 09/09/2008 | US7423304 Optimization of critical dimensions and pitch of patterned features in and above a substrate |
| 09/09/2008 | US7423301 Semiconductor device including fuse elements and bonding pad |
| 09/09/2008 | US7423300 Single-mask phase change memory element |
| 09/09/2008 | US7423288 Technique for evaluating a fabrication of a die and wafer |
| 09/09/2008 | US7423287 System and method for measuring residual stress |
| 09/09/2008 | US7423286 Laser transfer article and method of making |
| 09/09/2008 | US7423083 Encapsulated semiconductor, diodes; crosslinked resin |
| 09/09/2008 | US7422976 Top layers of metal for high performance IC's |
| 09/09/2008 | US7422975 Composite inter-level dielectric structure for an integrated circuit |
| 09/09/2008 | US7422974 Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device |
| 09/09/2008 | US7422972 On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits |
| 09/09/2008 | US7422941 High performance system-on-chip using post passivation process |
| 09/09/2008 | US7422939 Semiconductor device having one-time programmable ROM and method of fabricating the same |
| 09/09/2008 | US7422932 Nonvolatile semiconductor memory device |
| 09/09/2008 | US7422930 Integrated circuit with re-route layer and stacked die assembly |
| 09/09/2008 | US7422929 Wafer-level packaging of optoelectronic devices |
| 09/09/2008 | US7422446 Connector |
| 09/09/2008 | US7422053 Vapor augmented heatsink with multi-wick structure |
| 09/09/2008 | US7421781 Method of forming a module component having a plurality of penetration holes |
| 09/09/2008 | US7421780 Methods for fabricating thermal management systems for micro-components |
| 09/09/2008 | US7421777 Method of manufacturing multilayer wiring substrate using temporary metal support layer |
| 09/09/2008 | CA2349059C Semiconductor device |
| 09/09/2008 | CA2273474C Electronic circuit device and method of fabricating the same |
| 09/04/2008 | WO2008106187A1 Semiconductor package |
| 09/04/2008 | WO2008105980A1 Attaching passive components between layers of a pcb |
| 09/04/2008 | WO2008105979A1 Attaching passive components to a semiconductor die |
| 09/04/2008 | WO2008105535A1 Semiconductor device and method for manufacturing the same |
| 09/04/2008 | WO2008105496A1 Interposer with capacitor mounted thereon and method for manufacturing the interposer |
| 09/04/2008 | WO2008105437A1 Semiconductor device, leadframe and semiconductor device manufacturing method |
| 09/04/2008 | WO2008105360A1 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
| 09/04/2008 | WO2008105344A1 Interlayer insulation film, interconnect structure, and methods for production thereof |
| 09/04/2008 | WO2008105315A1 Method for manufacturing magnetic memory chip device |
| 09/04/2008 | WO2008105258A1 Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package |
| 09/04/2008 | WO2008105069A1 Printed board unit and semiconductor package |
| 09/04/2008 | WO2008105067A1 Heat radiation component |
| 09/04/2008 | WO2008104324A1 Method for incorporating chips in circuit board cavities |
| 09/04/2008 | WO2008063658A3 Semiconductor nanocrystals and compositions and devices including same |
| 09/04/2008 | WO2008048384A3 Potted integrated circuit device with aluminum case |
| 09/04/2008 | WO2007073601A8 Pixel structure for a solid state light emitting device |
| 09/04/2008 | US20080214914 Detectors, controllers and display unit; forming recessed channel on substrate as working electrode |
| 09/04/2008 | US20080213996 Designs and methods for conductive bumps |
| 09/04/2008 | US20080213993 Method and Apparatus of Stress Relief in Semiconductor Structures |
| 09/04/2008 | US20080213946 Substrate based unmolded package |
| 09/04/2008 | US20080213942 Method for fabricating semiconductor device and carrier applied therein |
| 09/04/2008 | US20080213941 Bump-on-Lead Flip Chip Interconnection |
| 09/04/2008 | US20080212625 Semiconductor device |
| 09/04/2008 | US20080212013 Liquid crystal display device and method of fabricating the same |
| 09/04/2008 | US20080211115 Semiconductor structure and an apparatus and a method for producing a semiconductor structure |
| 09/04/2008 | US20080211114 Semiconductor component |
| 09/04/2008 | US20080211113 Wafer level packaging |
| 09/04/2008 | US20080211112 Carbon Nanotube Bond Pad Structure and Method Therefor |
| 09/04/2008 | US20080211111 Integrated circuit package system with underfill |
| 09/04/2008 | US20080211110 Semiconductor apparatus and mobile apparatus |
| 09/04/2008 | US20080211109 Semiconductor device and method of visual inspection and apparatus for visual inspection |
| 09/04/2008 | US20080211108 Semiconductor device and a method of manufacturing the same |
| 09/04/2008 | US20080211107 Via hole structure and manufacturing method thereof |
| 09/04/2008 | US20080211105 Method of assembling chips |
| 09/04/2008 | US20080211104 High Temperature, Stable SiC Device Interconnects and Packages Having Low Thermal Resistance |
| 09/04/2008 | US20080211103 Semiconductor device and a method of manufacturing the same |
| 09/04/2008 | US20080211101 Interlayer wiring of semiconductor device using carbon nanotube and method of manufacturing the same |
| 09/04/2008 | US20080211100 Method and structure for reducing contact resistance between silicide contact and overlying metallization |
| 09/04/2008 | US20080211099 Semiconductor device |
| 09/04/2008 | US20080211098 Semiconductor device and method for fabricating the same |
| 09/04/2008 | US20080211097 Semiconductor device and method for manufacturing same |
| 09/04/2008 | US20080211096 Switching Element and Reconfigurable Logic Integrated Circuit |
| 09/04/2008 | US20080211095 Semiconductor device and manufacturing method of the semiconductor device |
| 09/04/2008 | US20080211094 Semiconductor device and method of manufacturing the same |
| 09/04/2008 | US20080211093 Semiconductor device having conductive bumps and fabrication method thereof |
| 09/04/2008 | US20080211092 Electronic assembly having a multilayer adhesive structure |
| 09/04/2008 | US20080211091 Power Semiconductor Module and Method for Producing the Same |
| 09/04/2008 | US20080211090 Packed Semiconductor Sensor Chip For Use In Liquids |
| 09/04/2008 | US20080211089 Interposer for die stacking in semiconductor packages and the method of making the same |
| 09/04/2008 | US20080211088 Semiconductor device |
| 09/04/2008 | US20080211087 Chip module and method for producing a chip module |
| 09/04/2008 | US20080211086 Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate |
| 09/04/2008 | US20080211085 Semiconductor package having insulating substrate |
| 09/04/2008 | US20080211084 Integrated circuit package system with interposer |
| 09/04/2008 | US20080211083 Electronic package and manufacturing method thereof |
| 09/04/2008 | US20080211082 Semiconductor device and a method of manufacturing the same |
| 09/04/2008 | US20080211081 Planar multi semiconductor chip package and method of manufacturing the same |
| 09/04/2008 | US20080211080 Package structure to improve the reliability for WLP |
| 09/04/2008 | US20080211079 Heat dissipation methods and structures for semiconductor device |
| 09/04/2008 | US20080211078 Semiconductor packages and method of manufacturing the same |
| 09/04/2008 | US20080211077 Low profile chip scale stacking system and method |