Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2008
09/10/2008CN201112412Y Package structure used for high power light-emitting diode heat dispersion
09/10/2008CN201112407Y High power light-emitting diode structure
09/10/2008CN201112406Y Integrated light-emitting diode packaging structure
09/10/2008CN201112403Y Diode with multiple emission surface
09/10/2008CN201112388Y Power amplifying tube linearity increasing device
09/10/2008CN201112387Y Array substrate
09/10/2008CN201112386Y Perforation type luminescent diode chip packing structure using ceramic as substrate
09/10/2008CN201112385Y High power element die set combination structure
09/10/2008CN201112384Y Circuit modular structure
09/10/2008CN201112383Y Triode lead wire frame
09/10/2008CN201112382Y Rectifier bridge
09/10/2008CN201112381Y Inner lead wire structure for semiconductor device
09/10/2008CN201112380Y Multiple sheets clipping radiating fin
09/10/2008CN201112379Y Modified internal memory radiator construction
09/10/2008CN201112378Y Secondary power supply radiator
09/10/2008CN201112377Y Radiator for computer chip
09/10/2008CN201112376Y Metal cover structure for minisize die block
09/10/2008CN201112375Y Semiconductor device seal packaging metal foundation
09/10/2008CN201112374Y Circuit modifying and manufacturing structure
09/10/2008CN201111605Y High-power LED road lamp fitting with external heat radiator
09/10/2008CN201111600Y High-power LED road lamp fitting main casing
09/10/2008CN101263750A Laminated substrate for mounting electronic parts
09/10/2008CN101263599A Termination structure
09/10/2008CN101263598A Integrated circuit packaging
09/10/2008CN101263597A Semiconductor package having plate interconnections
09/10/2008CN101263596A Reversible-multiple footprint package and method of manufacturing
09/10/2008CN101262754A Heat radiator
09/10/2008CN101262739A Substrate for carrying element, method for manufacturing the same, and semiconductor module
09/10/2008CN101262035A LED structure and its assembly method
09/10/2008CN101262030A LED encapsulation unit
09/10/2008CN101262007A El display device and electronic device
09/10/2008CN101262005A Phase change storage unit using Schottky base diode as selection tube and its making method
09/10/2008CN101262004A Phase change storage unit and method for dual shallow groove separated bipolar transistor selection
09/10/2008CN101262002A Image sensor package with grain receiving opening and method of the same
09/10/2008CN101261995A Nonvolatile memory devices and methods of forming the same
09/10/2008CN101261989A Integrated circuits
09/10/2008CN101261988A Semiconductor device and its making method
09/10/2008CN101261987A Electronic-component-mounting board
09/10/2008CN101261986A Electronic part encapsulation module, external cover and its making method
09/10/2008CN101261984A Structure of semiconductor device package and the method of the same
09/10/2008CN101261983A Semiconductor device with image pick-up element
09/10/2008CN101261982A LED encapsulation structure and its making method
09/10/2008CN101261980A Structure for monitoring metal silicon compound forming quality in semiconductor integration circuit
09/10/2008CN101261979A Inegrated circuit structure
09/10/2008CN101261978A Substrate for mounting semiconductor element and method of manufacturing the same
09/10/2008CN101261977A Electronic device packages and methods of formation
09/10/2008CN101261976A Encapsulation architecture and its making method
09/10/2008CN101261975A 半导体器件 Semiconductor devices
09/10/2008CN101261974A Electric interlink and method for forming electric interlink
09/10/2008CN101261973A 半导体装置 Semiconductor device
09/10/2008CN101261972A Land grid array module with contact locating features
09/10/2008CN101261971A 半导体装置及其制造方法 Semiconductor device and manufacturing method
09/10/2008CN101261970A Semiconductor device and method of manufacturing the same
09/10/2008CN101261969A Display apparatus
09/10/2008CN101261968A CPU heat radiation module
09/10/2008CN101261967A Enhanced encapsulation carrier board and its making method
09/10/2008CN101261966A Semiconductor device and method of manufacturing same
09/10/2008CN101261965A Encapsulation structure with micro hole and its making method
09/10/2008CN101261964A Functional device package
09/10/2008CN101261963A Miniature electronic part and its encapsulation part and making method
09/10/2008CN101261962A Active part array base board and its making method
09/10/2008CN101261955A Embedded type DRAM devican its contact plug forming method
09/10/2008CN101261947A Method of manufacturing circuit board and circuit board
09/10/2008CN101261946A Metallic electrode forming method and semiconductor device having metallic electrode
09/10/2008CN101261945A Semiconductor structure manufacture method
09/10/2008CN101261944A Sensing semiconductor encryption part and its making method
09/10/2008CN101261943A Video sensing module and its encapsulation method
09/10/2008CN101261942A Sensing semiconductor and its making method
09/10/2008CN101261928A Guard ring of semiconductor device and manufacturing method thereof
09/10/2008CN101261056A Semiconductor refrigeration heat converter
09/10/2008CN101260998A High power light-emitting diode illuminating source heat radiating device
09/10/2008CN100418229C Photodiode array, method for manufacturing same, and radiation detector
09/10/2008CN100418223C System chip capable of integrating micro-antenna
09/10/2008CN100418222C Semiconductor device and method for manufacturing the same
09/10/2008CN100418221C Electro-optical device and electronic device
09/10/2008CN100418220C 半导体器件 Semiconductor devices
09/10/2008CN100418219C Multiple metal internal ligature arrangement with stress remove increasement and producing method thereof
09/10/2008CN100418218C Semiconductor die package with reduced inductance and reduced die attach flow out
09/10/2008CN100418217C Semiconductor device and method of manufacturing same
09/10/2008CN100418216C Semiconductor packaging and semiconductor module
09/10/2008CN100418215C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/10/2008CN100418214C Surface mount multichip devices
09/10/2008CN100418213C Boiling-chamber type radiating apparatus
09/10/2008CN100418212C Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
09/10/2008CN100418211C Semiconductor device and method of fabricating the same
09/10/2008CN100418202C Method for manufacturing circuit device
09/10/2008CN100418197C Semiconductor device with virtual patterns
09/10/2008CN100417949C Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring
09/09/2008US7423881 Arrangement and method for cooling a power semiconductor
09/09/2008US7423877 Heat dissipation device
09/09/2008US7423874 Magneto-hydrodynamic heat sink
09/09/2008US7423873 Heat dissipation device having fan holder for attachment of a fan
09/09/2008US7423860 Multi-functional energy conditioner
09/09/2008US7423699 Fully integrated tuner architecture
09/09/2008US7423418 Module part
09/09/2008US7423349 Semiconductor device
09/09/2008US7423348 Chip structure and chip package structure
09/09/2008US7423347 In-situ deposition for cu hillock suppression
09/09/2008US7423346 Post passivation interconnection process and structures
09/09/2008US7423345 Semiconductor constructions comprising a layer of metal over a substrate
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