Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2008
09/11/2008US20080217776 Process for manufacturing integrated circuits formed on a semiconductor substrate and comprising tungsten layers
09/11/2008US20080217775 With embedded dynamic random access memory (eDRAM) applications; forming a contact hole; depositing a tungsten layer on the dielectric layer to fill the contact hole, forming a tungsten seam; dry etching the tungsten layer forming a recessed tungsten plug; depositing a conductive layer to fill the recess
09/11/2008US20080217774 Semiconductor device
09/11/2008US20080217772 Semiconductor device manufacturing method and semiconductor device
09/11/2008US20080217771 Metallic electrode forming method and semiconductor device having metallic electrode
09/11/2008US20080217770 Mounting configuration of electronic component
09/11/2008US20080217769 Semiconductor module, method of manufacturing semiconductor module, and mobile device
09/11/2008US20080217768 System and method for increased stand-off height in stud bumping process
09/11/2008US20080217767 Stacked-Chip Semiconductor Device
09/11/2008US20080217766 Acoustic transducer module
09/11/2008US20080217764 Piezoelectric cooling of a semiconductor package
09/11/2008US20080217763 Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces
09/11/2008US20080217762 Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon
09/11/2008US20080217761 Structure of semiconductor device package and method of the same
09/11/2008US20080217760 Semiconductor device and method of manufacturing same
09/11/2008US20080217759 Chip package substrate and structure thereof
09/11/2008US20080217758 Package substrate strip, metal surface treatment method thereof and chip package structure
09/11/2008US20080217757 Power Semiconductor module
09/11/2008US20080217756 Power semiconductor arrangement and method for producing it
09/11/2008US20080217755 Systems and Methods for Providing Voltage Compensation in an Integrated Circuit Chip Using a Divided Power Plane
09/11/2008US20080217754 Semiconductor device and manufacturing method thereof
09/11/2008US20080217753 Semiconductor device and method of manufacturing the same
09/11/2008US20080217752 Functional Device Package
09/11/2008US20080217751 Substrate for mounting semiconductor element and method of manufacturing the same
09/11/2008US20080217750 Semiconductor device
09/11/2008US20080217748 Low cost and low coefficient of thermal expansion packaging structures and processes
09/11/2008US20080217747 Introduction of metal impurity to change workfunction of conductive electrodes
09/11/2008US20080217744 Semiconductor device and method of manufacturing the same
09/11/2008US20080217743 Method of manufacturing semiconductor device and semiconductor device
09/11/2008US20080217733 Electrical fuse structure for higher post-programming resistance
09/11/2008US20080217727 Radio frequency isolation for SOI transistors
09/11/2008US20080217709 Mems package having at least one port and manufacturing method thereof
09/11/2008US20080217703 Highly selective liners for semiconductor fabrication
09/11/2008US20080217691 Higher performance cmos on (110) wafers
09/11/2008US20080217662 Space-efficient package for laterally conducting device
09/11/2008US20080217624 Capacitor and light emitting display using the same
09/11/2008US20080217615 Method for arranging chips of a first substrate on a second substrate
09/11/2008US20080217614 Systems and Methods for Controlling of Electro-Migration
09/11/2008US20080217613 Positional offset measurement pattern unit featuring via-plug and interconnections, and method using such positional offset measurement pattern unit
09/11/2008US20080217612 Structure and method of mapping signal intensity to surface voltage for integrated circuit inspection
09/11/2008US20080217050 Multi-layered interconnect structure using liquid crystalline polymer dielectric
09/11/2008US20080216990 Heat dissipation device with a heat pipe
09/11/2008DE19911204B4 Anordnung zum Kühlen elektronischer Bauelemente Arrangement for cooling electronic components
09/11/2008DE102008012703A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
09/11/2008DE102008000218A1 Halbleiteranordnungsteststrukturen und Verfahren A semiconductor device test structures and procedures
09/10/2008EP1968361A2 IC fixing structure
09/10/2008EP1968188A1 Class D amplifier assembly
09/10/2008EP1968114A1 Semiconductor device
09/10/2008EP1968113A1 Multilayer printed wiring board
09/10/2008EP1968112A2 Semiconductor integrated circuit device
09/10/2008EP1968109A2 Semiconductor device and method of manufacturing the same
09/10/2008EP1966835A1 Pixel structure for a solid state light emitting device
09/10/2008EP1966825A1 Process for the collective fabrication of 3d electronic modules
09/10/2008EP1966824A1 Metal-ceramic substrate
09/10/2008EP1966823A1 Three-dimensional package module, method of fabricating the same, and method of fabricating passive device applied to the three-dimensional package module
09/10/2008EP1966306A1 Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
09/10/2008EP1738128B1 A fluid cooling system
09/10/2008EP1342075B1 Device contaning nanosensors for detecting an analyte and its method of manufacture
09/10/2008EP1095407B1 Integrated silicon-on-insulator integrated circuit with decoupling capacity and method for making such a circuit
09/10/2008EP0985226B1 Method for manufacturing electric modules
09/10/2008CN201115256Y Heat radiation device
09/10/2008CN201115255Y Wind guide cover
09/10/2008CN201115254Y 导风罩 Wind shield
09/10/2008CN201115253Y Water cooling heat radiation module for electronic device
09/10/2008CN201115247Y Improved pressing tight structure for heat radiation device including heat conductive tube
09/10/2008CN201115244Y Highly conductive heat insulation radiator
09/10/2008CN201115239Y A heat radiator device
09/10/2008CN201115237Y Liquid cooling heat radiation device
09/10/2008CN201115235Y Rotary heat radiation module structure
09/10/2008CN201115234Y Liquid cooling heat absorption device
09/10/2008CN201115230Y Heat radiation device for removable fan
09/10/2008CN201115227Y Equable temperature device for heat radiation module
09/10/2008CN201115224Y Heat radiation connector module
09/10/2008CN201115223Y Heat radiation device and its electronic device
09/10/2008CN201115221Y Wind guide cover
09/10/2008CN201115220Y Fin radial heat radiator structure
09/10/2008CN201115218Y Absorption heat radiator for liquid cooling system
09/10/2008CN201115217Y Heat radiation module
09/10/2008CN201115214Y Heat radiation device easy to fix a fan
09/10/2008CN201115210Y Heat radiation fin
09/10/2008CN201115206Y Heat radiation device for high-power electronic part
09/10/2008CN201115203Y Improved circuit component structure
09/10/2008CN201115201Y Novel power cabinet based on thermal tube heat radiation system
09/10/2008CN201115193Y An assembly structure for flat board equable temperature heat conductive part
09/10/2008CN201115192Y Horizontal heat radiator
09/10/2008CN201115191Y Fin heat radiator
09/10/2008CN201115190Y Buckle heat radiation fin
09/10/2008CN201115189Y Improved heat radiator
09/10/2008CN201115188Y Heat radiator with wind guide cover
09/10/2008CN201115186Y Heat radiation fin structure
09/10/2008CN201115185Y Heat radiator module
09/10/2008CN201115183Y A novel heat radiator for heating tube
09/10/2008CN201115145Y Heat radiation buckle
09/10/2008CN201114991Y Diamond circuit board module
09/10/2008CN201113777Y Parallel air duct rectifying device for electric actuating system
09/10/2008CN201112417Y Light-emitting diode radiating structure
09/10/2008CN201112416Y Luminescent diode packaging structure
09/10/2008CN201112415Y Pin type high power LED device
09/10/2008CN201112414Y High power LED package structure
09/10/2008CN201112413Y High power LED package structure
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