Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/17/2014WO2014110482A1 Through mold via relief gutter on molded laser package (mlp) packages
07/17/2014WO2014110401A1 Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
07/17/2014WO2014110013A1 Improved metal to metal bonding for stacked (3d) integrated circuits
07/17/2014WO2014109961A1 Semiconductor device having features to prevent reverse engineering
07/17/2014WO2014107848A1 Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
07/17/2014WO2014079836A3 Synthetic diamond heat spreaders
07/17/2014US20140199810 Methods for Forming Semiconductor Devices Using Sacrificial Layers
07/17/2014US20140199804 Semiconductor device having a bonding pad and shield structure and method of manufacturing the same
07/17/2014US20140198572 String selection structure of three-dimensional semiconductor device
07/17/2014US20140198459 Stacked package device and manufacturing method thereof
07/17/2014US20140197882 Switching device with resistive divider
07/17/2014US20140197553 Method for manufacturing a substrate for a display device
07/17/2014US20140197552 Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
07/17/2014US20140197551 Method for Fabricating a Semiconductor Chip Panel
07/17/2014US20140197550 Semiconductor device
07/17/2014US20140197549 Semiconductor package and method of manufacturing the same
07/17/2014US20140197548 Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof
07/17/2014US20140197547 Package on package structures and methods for forming the same
07/17/2014US20140197546 Pad structures and wiring structures in a vertical type semiconductor device
07/17/2014US20140197545 Non-cylindrical conducting shapes in multilayer laminated substrate cores
07/17/2014US20140197544 Semiconductor device comprising metallization layers of reduced interlayer capacitance by reducing the amount of etch stop materials
07/17/2014US20140197543 Enforcement of Semiconductor Structure Regularity for Localized Transistors and Interconnect
07/17/2014US20140197542 Semiconductor devices and methods of fabricating semiconductor devices
07/17/2014US20140197541 Microelectronic assembly having a heat spreader for a plurality of die
07/17/2014US20140197540 Extended Redistribution Layers Bumped Wafer
07/17/2014US20140197539 Bonded System with Coated Copper Conductor
07/17/2014US20140197538 Copper etching integration scheme
07/17/2014US20140197537 Void-Free Metallic Filled High Aspect Ratio Openings
07/17/2014US20140197536 Package structure and method for manufacturing thereof
07/17/2014US20140197535 Wafer-level packaging mechanisms
07/17/2014US20140197534 Substrate with bond fingers
07/17/2014US20140197533 Semiconductor device and method for manufacturing the semiconductor device
07/17/2014US20140197532 Semiconductor Module and Method for Manufacturing Semiconductor Module
07/17/2014US20140197530 Semiconductor device with chip having low-k-layers
07/17/2014US20140197528 Optical semiconductor apparatus
07/17/2014US20140197527 Chip arrangement and a method for manufacturing a chip arrangement
07/17/2014US20140197526 Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
07/17/2014US20140197525 Power module
07/17/2014US20140197524 Die package structure
07/17/2014US20140197523 Chip arrangement and a method for forming a chip arrangement
07/17/2014US20140197522 Hybrid conductor through-silicon-via for power distribution and signal transmission
07/17/2014US20140197503 Sensor package
07/17/2014US20140197460 Semiconductor device, method for manufacturing the same, power supply device, and high-frequency amplifier
07/17/2014US20140197450 Esd protection circuit
07/17/2014US20140197409 Multi-chip package and interposer with signal line compression
07/17/2014US20140197228 Fixture to constrain laminate and method of assembly
07/17/2014US20140196938 Lead frame
07/17/2014US20140196280 Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method
07/17/2014DE112012004381T5 Halbleiterbauelement und Halbleiterbauelementherstellungsverfahren Semiconductor device and semiconductor device manufacturing method
07/17/2014DE112009000351B4 Mikroelektronischer Baustein, der Siliziumpatches für Zwischenverbindungen hoher Dichte enthält, und Verfahren zum Herstellen desselben Of the same microelectronic module containing silicon patches for intermediates high density and methods for preparing
07/17/2014DE102014200242A1 Gebondetes System mit beschichtetem Kupferleiter The bonded system with coated copper conductors
07/17/2014DE102014100309A1 Chipanordnung und verfahren zum bilden einer chipanordnung Chip assembly and method for forming a chip arrangement
07/17/2014DE102014100282A1 Chip-anordnung, verfahren zur herstellung einer chip-anordnung, integrierte schaltungen und verfahren zur herstellung einer integrierten schaltung Chip arrangement, method for producing a chip arrangement, integrated circuits and methods of fabricating an integrated circuit
07/17/2014DE102014100278A1 Chipanordnung und verfahren zur herstellung einer chipanordnung Chip assembly and method for manufacturing a chip arrangement
07/17/2014DE102014100236A1 Verfahren zum Herstellen eines Halbleiter-Chippanels A method of manufacturing a semiconductor chip Panels
07/17/2014DE102014100030A1 String-Auswahlstruktur einer dreidimensionalen Halbleitervorrichtung String-selection structure of a three-dimensional semiconductor device
07/17/2014DE102013200652A1 Vorrichtung zum Schalten hoher Ströme Apparatus for switching high currents
07/17/2014DE102013200526A1 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module
07/17/2014DE102013200308A1 Bonddraht und Verfahren zur Herstellung einer Bondverbindung Bonding wire and method for producing a bond
07/17/2014DE102013103400B4 Sram-zelle, die finfets umfasst SRAM cell, which comprises FinFETs
07/17/2014DE102013100388A1 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making
07/17/2014DE102012107899B4 Waferanordnung mit Trägerwafer und Herstellungsverfahren dafür Wafer assembly with carrier wafer and manufacturing method thereof
07/17/2014DE102011004541B4 Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls Improved power semiconductor module assembly module and heat sink and use of the module
07/17/2014DE102010000199B4 Einkapselungsverfahren Encapsulation
07/17/2014DE102009033321B4 Leistungshalbleitervorrichtung Power semiconductor device
07/17/2014DE102007008389B4 Schaltungsanordnung zur Übertemperaturerkennung Circuit arrangement for overtemperature detection
07/17/2014DE102005006281B4 Hochfrequenzleistungsbauteil mit Goldbeschichtungen und Verfahren zur Herstellung desselben Of the same high-frequency power component with gold coatings and methods for preparing
07/16/2014EP2755401A1 Semiconductor device and microphone
07/16/2014EP2755267A1 Thin film battery on an integrated circuit or circuit board and method thereof
07/16/2014EP2755234A1 Composition for electronic device
07/16/2014EP2755233A1 Underfill composition
07/16/2014EP2755232A1 Sealant composition for electronic device
07/16/2014EP2754175A1 Solder mask with anchor structures
07/16/2014EP2754169A1 Soldering relief method and semiconductor device employing same
07/16/2014EP2753903A1 Method and apparatus for estimating the temperature of a semiconductor chip
07/16/2014CN203721720U 一种双二极管串联连接的器件 A dual diode devices connected in series
07/16/2014CN203721719U 一种to220封装mosfet多管并联模块 One kind to220 package mosfet multi-tube parallel modules
07/16/2014CN203721718U 百万组编码发射芯片的封装结构 Millions package coded transmitter chip set
07/16/2014CN203721717U 场管开启电压测试装置 Field control turn-on voltage testing device
07/16/2014CN203721716U 测试结构 Test structure
07/16/2014CN203721715U 一种半导体器件 A semiconductor device
07/16/2014CN203721714U 一种扇出结构、阵列基板及显示装置 One kind of fan-out structure, the array substrate and a display device
07/16/2014CN203721713U 引线框架及qfn封装体 Leadframe and qfn package
07/16/2014CN203721712U 用于半导体封装的导线框架条 The lead frame for a semiconductor package section
07/16/2014CN203721711U 一种高可靠性的铜柱凸块封装结构 Copper pillar bump a highly reliable package
07/16/2014CN203721710U 一种智能卡模块 An intelligent card module
07/16/2014CN203721709U 键合结构 Bonding structure
07/16/2014CN203721708U 一种射频芯片连接片总成 A radio frequency chip connection piece assembly
07/16/2014CN203721707U 芯片封装结构 Chip package structure
07/16/2014CN203721706U 一种肋线式散热器 One kind of rib-wire radiator
07/16/2014CN203721705U 包含封装基板的集成电路 The integrated circuit package comprising a substrate
07/16/2014CN203721704U 一种8dip半导体pmf与cap的封装结构 One kind 8dip package structure of the semiconductor pmf with cap
07/16/2014CN203721703U 大功率螺旋整流管底座组件 Spiral rectifier power base assembly
07/16/2014CN203721702U 一种无氧环境压封机 One kind of oxygen-free environment pressure sealing machine
07/16/2014CN203721684U 双列引脚集成电路芯片封装结构 Double row pin integrated circuit chip package
07/16/2014CN203719813U 一种采用无引线封装结构的soi绝压敏感器件 One kind of leadless package structure soi absolute pressure sensitive devices
07/16/2014CN103930991A 半导体器件及半导体器件制造方法 The semiconductor device manufacturing method and semiconductor device
07/16/2014CN103930989A 射频层叠封装电路 RF-package circuit
07/16/2014CN103930988A 低cte插入体 Low cte insert body
07/16/2014CN103930987A 无引线框气密性电路封装 No leadframe tightness circuit package
1 ... 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 ... 2262