| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/17/2008 | CN100420009C Semiconductor device and open structure of semiconductor device |
| 09/17/2008 | CN100420008C Semiconductor device having copper wiring and its manufacture method |
| 09/17/2008 | CN100420007C Semiconductor end-electrode structure and its making method |
| 09/17/2008 | CN100420006C Heat radiating component |
| 09/17/2008 | CN100420005C Heat radiator and heat conductor combination method and combined assembly thereof |
| 09/17/2008 | CN100420004C Flip chip packaging body |
| 09/17/2008 | CN100420003C Ceramic substrate and its disjunction method |
| 09/17/2008 | CN100420002C Method of forming film pattern, active matrix substrate, electro-optic device, and electronic apparatus |
| 09/17/2008 | CN100419993C Method for making semiconductor device |
| 09/17/2008 | CN100419982C Semiconductor device |
| 09/17/2008 | CN100419980C Method of production of semiconductor device |
| 09/17/2008 | CN100419978C Semiconductor device and method for manufacturing the same |
| 09/17/2008 | CN100419977C 电子电路装置 Electronic circuit means |
| 09/17/2008 | CN100419963C Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| 09/17/2008 | CN100419924C Composite electronic element and method for producing the same element |
| 09/17/2008 | CN100419355C Cooling device of hybrid-type |
| 09/16/2008 | US7425877 Lange coupler system and method |
| 09/16/2008 | US7425767 Chip structure with redistribution traces |
| 09/16/2008 | US7425766 Film substrate, fabrication method thereof, and image display substrate |
| 09/16/2008 | US7425765 Zinc-aluminum solder alloy |
| 09/16/2008 | US7425764 Top layers of metal for high performance IC's |
| 09/16/2008 | US7425763 Electronic circuit package |
| 09/16/2008 | US7425762 Electronic apparatus |
| 09/16/2008 | US7425761 Method of manufacturing a dielectric film in a capacitor |
| 09/16/2008 | US7425760 Multi-chip module structure with power delivery using flexible cables |
| 09/16/2008 | US7425759 Semiconductor chip assembly with bumped terminal and filler |
| 09/16/2008 | US7425758 Metal core foldover package structures |
| 09/16/2008 | US7425757 Semiconductor power module |
| 09/16/2008 | US7425756 Semiconductor device and electronic device |
| 09/16/2008 | US7425755 Semiconductor package, method for manufacturing the same and lead frame for use in the same |
| 09/16/2008 | US7425750 Snap lid camera module |
| 09/16/2008 | US7425735 Multi-layer phase-changeable memory devices |
| 09/16/2008 | US7425733 Semiconductor apparatus with electrostatic protective device |
| 09/16/2008 | US7425720 Semiconductor device |
| 09/16/2008 | US7425683 Flexible wiring base material and process for producing the same |
| 09/16/2008 | US7425509 Method for forming patterns aligned on either side of a thin film |
| 09/16/2008 | US7425505 Use of silyating agents |
| 09/16/2008 | US7425501 Semiconductor structure implementing sacrificial material and methods for making and implementing the same |
| 09/16/2008 | US7425498 Semiconductor device with dummy electrode |
| 09/16/2008 | US7425492 Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load |
| 09/16/2008 | US7425472 Semiconductor fuses and semiconductor devices containing the same |
| 09/16/2008 | US7425471 Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
| 09/16/2008 | US7425470 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
| 09/16/2008 | US7425469 Method for encapsulating an electronic component using a foil layer |
| 09/16/2008 | US7425467 Web process interconnect in electronic assemblies |
| 09/16/2008 | US7425466 Wire bonding system and method of use |
| 09/16/2008 | US7425462 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing |
| 09/16/2008 | US7425458 Selectable decoupling capacitors for integrated circuits and associated methods |
| 09/16/2008 | US7425396 Photolithography and transfer of circuits for optical images for semiconductors and patterns |
| 09/16/2008 | CA2190550C Tungsten-copper composite powder |
| 09/12/2008 | WO2008109804A1 Vapor-augmented heat spreader device |
| 09/12/2008 | WO2008109524A2 System and method for increased stand-off height in stud bumping process |
| 09/12/2008 | WO2008109457A1 Methods for fabricating packaged semiconductor components |
| 09/12/2008 | WO2008109290A1 Process for reactive ion etching a layer of diamond-link carbon |
| 09/12/2008 | WO2008108970A2 Chips having rear contacts connected by through vias to front contacts |
| 09/12/2008 | WO2008108777A1 Low profile thermosiphon |
| 09/12/2008 | WO2008108485A1 Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |
| 09/12/2008 | WO2008108413A1 Microstructure apparatus and method for production of microstructure apparatus |
| 09/12/2008 | WO2008108335A1 Semiconductor device |
| 09/12/2008 | WO2008108334A1 Semiconductor device and method for manufacturing the semiconductor device |
| 09/12/2008 | WO2008108326A1 Thermosetting composition for optical semiconductor, die-bonding material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device |
| 09/12/2008 | WO2008108206A1 Transparent electrode for display device and method for manufacturing the same |
| 09/12/2008 | WO2008107216A1 Semiconductor component with terminal contact surface |
| 09/12/2008 | WO2008088999A3 Method and system for writing and reading a charge-trap media with a probe tip |
| 09/12/2008 | WO2008087578A3 A system-in-package with through substrate via holes |
| 09/12/2008 | WO2008087373A3 Structures with improved properties |
| 09/12/2008 | WO2008085391A3 Stacked packages |
| 09/12/2008 | WO2008082150A3 Test socket for semiconductor |
| 09/12/2008 | WO2008081312A3 Garment comprising a connecting cable to electronic devices |
| 09/12/2008 | WO2008068163A3 Base film for preventing the electro-static discharge of an electronic module and module producing method using the base film |
| 09/12/2008 | WO2008036556A3 Semiconductor leadframe for uniform mold compound flow |
| 09/12/2008 | WO2007120769B1 Low inductance bond-wireless co-package for high power density devices, especially for igbts and diodes |
| 09/12/2008 | WO2006039699A3 Ceramic antenna module and methods of manufacture thereof |
| 09/11/2008 | US20080220998 Polymer attached to a surface of the filler particles, dispersed within a binder; polymer collapses at temperatures below a Theta temperature from 30 degrees C. to 60 degrees C. and swells at temperatures above a Theta temperature from 30 degrees C. to 60 degrees |
| 09/11/2008 | US20080220738 Wireless communication system |
| 09/11/2008 | US20080220615 Method for producing self-aligned mask, articles produced by same and composition for same |
| 09/11/2008 | US20080220568 Manufacturing method of semiconductor device |
| 09/11/2008 | US20080220564 Semiconductor module |
| 09/11/2008 | US20080220213 Zeolite - carbon doped oxide composite low k dielectric |
| 09/11/2008 | US20080218989 Thin film deposition as an active conductor and method therfor |
| 09/11/2008 | US20080218974 Method and Structure for Connecting, Stacking, and Cooling Chips on a Flexible Carrier |
| 09/11/2008 | US20080218187 Probe testing structure |
| 09/11/2008 | US20080217794 Overlay Measurement Target |
| 09/11/2008 | US20080217793 Method and device including reworkable alpha particle barrier and corrosion barrier |
| 09/11/2008 | US20080217792 Semiconductor device and method of manufacturing the same |
| 09/11/2008 | US20080217791 Semiconductor device |
| 09/11/2008 | US20080217790 Semiconductor device and manufacturing method thereof |
| 09/11/2008 | US20080217789 Semiconductor device and method of forming metal line of semiconductor device |
| 09/11/2008 | US20080217788 Method of fabricating self-aligned contact |
| 09/11/2008 | US20080217787 Micro-electromechanical device and manufacturing method thereof |
| 09/11/2008 | US20080217786 Semiconductor device and method of manufacturing semiconductor device |
| 09/11/2008 | US20080217785 Semiconductor Device with Grounding Structure |
| 09/11/2008 | US20080217784 Substrate with feedthrough and method for producing the same |
| 09/11/2008 | US20080217783 Semiconductor device |
| 09/11/2008 | US20080217782 Method for preparing 2-dimensional semiconductor devices for integration in a third dimension |
| 09/11/2008 | US20080217781 ELIMINATING METAL-RICH SILICIDES USING AN AMORPHOUS Ni ALLOY SILICIDE STRUCTURE |
| 09/11/2008 | US20080217780 ELIMINATING METAL-RICH SILICIDES USING AN AMORPHOUS Ni ALLOY SILICIDE STRUCTURE |
| 09/11/2008 | US20080217779 Semiconductor structure and the forming method thereof |
| 09/11/2008 | US20080217778 Method to create flexible connections for integrated circuits |
| 09/11/2008 | US20080217777 Embedded barrier for dielectric encapsulation |