| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/23/2014 | CN103943574A To壳体及其制造方法 To the casing and its manufacturing method |
| 07/23/2014 | CN103943562A 一种具有石墨烯的互连线及其制备方法 A graphene interconnects its preparation method |
| 07/23/2014 | CN103943553A 半导体器件和形成具有垂直互连单元的低轮廓扇出式封装的方法 And forming a semiconductor device having a vertical low-profile interconnection unit package method of fan-out |
| 07/23/2014 | CN103943552A 半导体集成电路制造方法 The semiconductor integrated circuit manufacturing method |
| 07/23/2014 | CN103943464A 对准标记的形成方法 The method for forming alignment marks |
| 07/23/2014 | CN103941509A 阵列基板与液晶面板 The array substrate and the liquid crystal panel |
| 07/23/2014 | CN103937433A 一种高可靠性环保型底部填充材料及其制备方法 A highly reliable environment-friendly underfill material and method |
| 07/23/2014 | CN103937168A 用于高密度互连倒装晶片的底部填充料 The bottom of the flip chip interconnection for high density filler |
| 07/23/2014 | CN103180942B 半导体模块 Semiconductor Modules |
| 07/23/2014 | CN103109366B 半导体模块 Semiconductor Modules |
| 07/23/2014 | CN103091971B 掩模板及其制造方法、以及监测掩模板雾状污染的方法 Mask and its manufacturing method, and a method of monitoring the mask mist contamination |
| 07/23/2014 | CN102629560B 封装载板及其制作方法 Package carrier board and its manufacturing method |
| 07/23/2014 | CN102479684B 薄膜电阻器及其制造方法 Thin film resistor and its manufacturing method |
| 07/23/2014 | CN102386320B 半导体装置及其检测方法和电子设备 Semiconductor device and detection method and electronic equipment |
| 07/23/2014 | CN102208394B 半导体器件 Semiconductor devices |
| 07/23/2014 | CN102194705B 具有保护性中介层的嵌入式裸片 Embedded die having an intermediary protective layer |
| 07/23/2014 | CN102113116B 高品质因数变压器集成电路、封装集成电路及其形成方法 High quality factor transformer IC, package and method of forming an integrated circuit |
| 07/23/2014 | CN102099910B 功率电子装置 Power electronic device |
| 07/23/2014 | CN101930935B 用于改善可靠性的引线框设计 For improving the reliability of the design of a lead frame |
| 07/23/2014 | CN101577280B 显示装置 The display device |
| 07/22/2014 | US8787999 Fault current limited system with current splitting device |
| 07/22/2014 | US8786712 Luminance measurement method, luminance measurement device, and image quality adjustment technique using the method and device |
| 07/22/2014 | US8786173 Master glass having structure capable of preventing damage caused by static electricity |
| 07/22/2014 | US8786165 QFN/SON compatible package with SMT land pads |
| 07/22/2014 | US8786112 Leadframe, semiconductor device, and method of manufacturing the same |
| 07/22/2014 | US8786111 Semiconductor packages and methods of formation thereof |
| 07/22/2014 | US8786110 Semiconductor device and manufacturing method thereof |
| 07/22/2014 | US8786109 Conductive structure and method for forming the same |
| 07/22/2014 | US8786108 Package structure |
| 07/22/2014 | US8786107 Semiconductor module |
| 07/22/2014 | US8786106 Semiconductor device and method for manufacturing semiconductor device |
| 07/22/2014 | US8786105 Semiconductor device with chip having low-k-layers |
| 07/22/2014 | US8786104 Three-dimensional multichip module |
| 07/22/2014 | US8786103 Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer |
| 07/22/2014 | US8786102 Semiconductor device and method of manufacturing the same |
| 07/22/2014 | US8786101 Contact structure in a memory device |
| 07/22/2014 | US8786100 Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die |
| 07/22/2014 | US8786099 Wiring substrate and semiconductor package |
| 07/22/2014 | US8786098 Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same |
| 07/22/2014 | US8786097 Method of forming vias in semiconductor substrates and resulting structures |
| 07/22/2014 | US8786095 Interconnect for an optoelectronic device |
| 07/22/2014 | US8786094 Semiconductor devices and methods of manufacture thereof |
| 07/22/2014 | US8786093 Chip package and method for forming the same |
| 07/22/2014 | US8786092 Semiconductor integrated circuit device |
| 07/22/2014 | US8786091 Semiconductor apparatus having a high-aspect penetrating electrode and manufacturing method thereof |
| 07/22/2014 | US8786089 Manufacturing method of semiconductor device, semiconductor device and electronic apparatus |
| 07/22/2014 | US8786088 Semiconductor device including ultra low-K (ULK) metallization stacks with reduced chip-package interaction |
| 07/22/2014 | US8786087 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrate |
| 07/22/2014 | US8786085 Semiconductor structure and method for making same |
| 07/22/2014 | US8786084 Semiconductor package and method of forming |
| 07/22/2014 | US8786083 Impedance controlled packages with metal sheet or 2-layer RDL |
| 07/22/2014 | US8786082 Semiconductor structure having no adjacent bumps between two adjacent pads |
| 07/22/2014 | US8786081 Method and device for circuit routing by way of under-bump metallization |
| 07/22/2014 | US8786080 Systems including an I/O stack and methods for fabricating such systems |
| 07/22/2014 | US8786079 Antenna switch modules and methods of making the same |
| 07/22/2014 | US8786078 Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features |
| 07/22/2014 | US8786077 Semiconductor device having a first substrate containing circuit element connected to radiation plate on a cover plate with metal vias |
| 07/22/2014 | US8786076 Semiconductor device and method of forming a thermally reinforced semiconductor die |
| 07/22/2014 | US8786075 Electrical circuit with component-accommodating lid |
| 07/22/2014 | US8786074 Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity |
| 07/22/2014 | US8786073 Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity |
| 07/22/2014 | US8786072 Semiconductor package |
| 07/22/2014 | US8786071 Wiring pattern having a stub wire |
| 07/22/2014 | US8786070 Microelectronic package with stacked microelectronic elements and method for manufacture thereof |
| 07/22/2014 | US8786069 Reconfigurable pop |
| 07/22/2014 | US8786068 Packaging of electronic circuitry |
| 07/22/2014 | US8786067 Semiconductor package having improved heat spreading performance |
| 07/22/2014 | US8786066 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same |
| 07/22/2014 | US8786065 Substrate, light emitting device and method for manufacturing substrate |
| 07/22/2014 | US8786064 Semiconductor package and method for manufacturing the same and semiconductor package module having the same |
| 07/22/2014 | US8786063 Integrated circuit packaging system with leads and transposer and method of manufacture thereof |
| 07/22/2014 | US8786062 Semiconductor package and process for fabricating same |
| 07/22/2014 | US8786061 Semiconductor device |
| 07/22/2014 | US8786060 Semiconductor package integrated with conformal shield and antenna |
| 07/22/2014 | US8786059 Passivation layer surface topography modifications for improved integrity in packaged assemblies |
| 07/22/2014 | US8786056 Semiconductor light emitting elements comprising a plating substrate with a projecting tab, or comprising an exposed seed layer |
| 07/22/2014 | US8786055 Solid-state imaging device, method for manufacturing solid-state imaging device, method for manufacturing solid-state imaging element, and semiconductor device |
| 07/22/2014 | US8786054 Structure for integrated circuit alignment |
| 07/22/2014 | US8786045 Power semiconductor devices having termination structures |
| 07/22/2014 | US8786032 P-type semiconductor device and method for manufacturing the same |
| 07/22/2014 | US8786024 Semiconductor device comprising bipolar and unipolar transistors including a concave and convex portion |
| 07/22/2014 | US8786021 Semiconductor structure having an active device and method for manufacturing and manipulating the same |
| 07/22/2014 | US8785980 Semiconductor memory device having a low resistance wiring line and method of manufacturing the same |
| 07/22/2014 | US8785974 Bumped, self-isolated GaN transistor chip with electrically isolated back surface |
| 07/22/2014 | US8785971 Transient voltage suppressor without leakage current |
| 07/22/2014 | US8785956 Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same |
| 07/22/2014 | US8785931 Semiconductor device |
| 07/22/2014 | US8785930 Method for indexing dies comprising integrated circuits |
| 07/22/2014 | US8785839 Optical sensor and method of manufacturing the optical sensor |
| 07/22/2014 | US8785792 Case structure having film type electronic circuit and method of manufacturing the same |
| 07/22/2014 | US8785321 Low resistance and reliable copper interconnects by variable doping |
| 07/22/2014 | US8785318 Semiconductor device and a method of manufacturing the same |
| 07/22/2014 | US8785317 Wafer level packaging of semiconductor chips |
| 07/22/2014 | US8785253 Leadframe for IC package and method of manufacture |
| 07/22/2014 | US8785252 Resin sealed semiconductor device and manufacturing method therefor |
| 07/22/2014 | US8785250 Methods and apparatus for flip-chip-on-lead semiconductor package |
| 07/22/2014 | US8785034 Lithium battery, method for manufacturing a lithium battery, integrated circuit and method of manufacturing an integrated circuit |
| 07/22/2014 | US8782882 Method of manufacturing multi-layer printed circuit board |
| 07/22/2014 | DE202014005393U1 Befestigungssystem für Lüfter an Wärmetauschern Mounting system for fans of heat exchangers |
| 07/17/2014 | WO2014110557A1 Evaporative heat transfer system |