Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/14/2008US7436068 Components for film forming device
10/14/2008US7436067 Methods for forming conductive structures and structures regarding same
10/14/2008US7436065 Electrode contact structure
10/14/2008US7436064 Laser process for reliable and low-resistance electrical contacts
10/14/2008US7436063 Packaging substrate and semiconductor device
10/14/2008US7436062 Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method
10/14/2008US7436061 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
10/14/2008US7436060 Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly
10/14/2008US7436059 Thermoelectric cooling device arrays
10/14/2008US7436058 Reactive solder material
10/14/2008US7436057 Elastomer interposer with voids in a compressive loading system
10/14/2008US7436056 Electronic component package
10/14/2008US7436055 Packaging method of a plurality of chips stacked on each other and package structure thereof
10/14/2008US7436054 MEMS microphone with a stacked PCB package and method of producing the same
10/14/2008US7436053 Optical device and method for fabricating the same
10/14/2008US7436052 Repatterned integrated circuit chip package
10/14/2008US7436051 Component for fabricating an electronic device and method of fabricating an electronic device
10/14/2008US7436049 Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package
10/14/2008US7436048 Multichip leadframe package
10/14/2008US7436047 Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same
10/14/2008US7436041 Electrostatic discharge protection circuit using a double-triggered silicon controlling rectifier
10/14/2008US7436040 Method and apparatus for diverting void diffusion in integrated circuit conductors
10/14/2008US7436039 Gallium nitride semiconductor device
10/14/2008US7436027 Semiconductor device and fabrication method for the same
10/14/2008US7436023 High blocking semiconductor component comprising a drift section
10/14/2008US7436012 Solid state imaging apparatus and method for fabricating the same
10/14/2008US7436008 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
10/14/2008US7436000 Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source
10/14/2008US7435993 High temperature, high voltage SiC void-less electronic package
10/14/2008US7435991 Micromechanical sensor
10/14/2008US7435990 Arrangement for testing semiconductor chips while incorporated on a semiconductor wafer
10/14/2008US7435927 Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
10/14/2008US7435910 Multilayer printed circuit board
10/14/2008US7435626 Rearrangement sheet, semiconductor device and method of manufacturing thereof
10/14/2008US7435623 Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
10/14/2008US7435619 Method of fabricating a 3-D package stacking system
10/14/2008US7434309 Method and apparatus for supporting a circuit component having solder column interconnects using an external support
10/14/2008US7434306 Integrated transformer
10/09/2008WO2008121925A2 Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor
10/09/2008WO2008121780A1 Thermal dissipation in chip substrates
10/09/2008WO2008121619A1 An integrated circuit structure incorporating an inductor, an associated design method and an associated design system
10/09/2008WO2008121511A1 Method and structure for reducing cracks in a dielectric layer in contact with metal
10/09/2008WO2008121500A1 Method for fabricating a low cost integrated circuit (ic) package
10/09/2008WO2008121479A2 Method and structure for making a top-side contact to a substrate
10/09/2008WO2008121443A1 Methods and apparatus for multi-stage molding of integrated circuit package
10/09/2008WO2008121038A1 A power semiconductor arrangement and a semiconductor valve provided therewith
10/09/2008WO2008120787A1 Aromatic polyimide and process for production thereof
10/09/2008WO2008120764A1 Polyamic acid resin composition, cured film produced using the resin composition, and semiconductor device
10/09/2008WO2008120755A1 Circuit board incorporating functional element, method for manufacturing the circuit board, and electronic device
10/09/2008WO2008120705A1 Semiconductor device
10/09/2008WO2008120564A1 Mounting structure of electronic component and method for mounting electronic component
10/09/2008WO2008120418A1 Semiconductor device, and its manufacturing method
10/09/2008WO2008120369A1 Semiconductor device and method of manufacturing the same
10/09/2008WO2008120358A1 Heat sink
10/09/2008WO2008120348A1 Process for producing semiconductor device
10/09/2008WO2008120270A1 System control method at the time of abnormal cpu temperature
10/09/2008WO2008119309A2 Heat sink, and assembly or module unit comprising a heat sink
10/09/2008WO2008101433A9 Surface mount device and manufacturing method thereof
10/09/2008WO2008097321A3 Method for growing arrays of aligned nanostructures on surfaces
10/09/2008WO2008075223A3 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
10/09/2008WO2008014197A3 Array-processed stacked semiconductor packages
10/09/2008WO2007112393A3 Semiconductor device with solderable loop contacts
10/09/2008WO2007100404A3 Semiconductor interconnect having adjacent reservoir for bonding and method for formation
10/09/2008US20080249220 Encapsulated semiconductor; diodes; crosslinked polymer; photostability; radiation and heat resistance
10/09/2008US20080248598 Method and apparatus for determining characteristics of a stressed material using scatterometry
10/09/2008US20080248326 Includes metal plate, ceramic base plate joined to the metal plate, and a release agent; used in semiconductor device for controlling high current and high voltage of for example, an electric automobile or an electric rolling stock
10/09/2008US20080248304 Growth of single crystal nanowires
10/09/2008US20080247432 Semiconductor Laser Equipment
10/09/2008US20080247162 Light-Emitting Diode Cluster Lamp
10/09/2008US20080247149 Chip package structure
10/09/2008US20080247148 Semiconductor Device
10/09/2008US20080247145 Integrated circuit carrier arrangement with electrical connection islands
10/09/2008US20080247144 Integrated circuit carrier assembly
10/09/2008US20080246168 Semiconductor device and method of manufacturing the same
10/09/2008US20080246167 Layout Structure for Chip Coupling
10/09/2008US20080246166 Semiconductor device and method of manufacturing same
10/09/2008US20080246165 Novel interconnect for chip level power distribution
10/09/2008US20080246164 Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component
10/09/2008US20080246163 Semiconductor Device
10/09/2008US20080246162 Stack package, a method of manufacturing the stack package, and a digital device having the stack package
10/09/2008US20080246161 Damascene conductive line for contacting an underlying memory element
10/09/2008US20080246160 Standard cell and semiconductor device including the same
10/09/2008US20080246159 Planarized passivation layer for semiconductor devices
10/09/2008US20080246158 Method for Realizing a Nanometric Circuit Architecture Between Standard Electronic Components and Semiconductor Device Obtained with Said Method
10/09/2008US20080246157 Surface mount devices with minimum lead inductance and methods of manufacturing the same
10/09/2008US20080246156 Semiconductor device and method of manufacturing the same
10/09/2008US20080246155 Semiconductor device and method of fabricating the same
10/09/2008US20080246154 Top layers of metal for high performance IC's
10/09/2008US20080246153 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device
10/09/2008US20080246152 Semiconductor device with bonding pad
10/09/2008US20080246151 Interconnect structure and method of fabrication of same
10/09/2008US20080246150 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region
10/09/2008US20080246149 Semiconductor device and method for forming device isolation film of semiconductor device
10/09/2008US20080246148 Electrical Interconnect Structures Having Carbon Nanotubes Therein and Methods of Forming Same
10/09/2008US20080246147 Novel substrate design for semiconductor device
10/09/2008US20080246146 Wiring substrate and wiring substrate manufacturing method
10/09/2008US20080246145 Mobile binding in an electronic connection
10/09/2008US20080246144 Method for fabricating contact pads
10/09/2008US20080246143 Embedded metal heat sink for semiconductor
10/09/2008US20080246142 Heat dissipation unit and a semiconductor package that has the heat dissipation unit
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