Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/08/2008CN101281897A Matrix type structure for testing integrality of gate oxic horizon
10/08/2008CN101281896A Flexible circuit board
10/08/2008CN101281895A Electric connecting structure of circuit board embedding with semiconductor chip
10/08/2008CN101281894A Semiconductor component bearing structure and splicing structure
10/08/2008CN101281893A Semiconductor device
10/08/2008CN101281892A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/08/2008CN101281891A Semiconductor device with bonding pad
10/08/2008CN101281890A Semiconductor module in pressure contact design and method for production of the same
10/08/2008CN101281889A Loading plate structure for embedded burying semiconductor chip
10/08/2008CN101281888A Semiconductor encapsulation construction and manufacturing method thereof
10/08/2008CN101281880A Semiconductor component and manufacturing method thereof
10/08/2008CN101281879A Double-stage self-aligning contact window and manufacturing method thereof
10/08/2008CN101281876A Method of manufacturing semiconductor device and semiconductor device
10/08/2008CN101281875A Grain automatic positioning, and stack type encapsulation structure as well as manufacturing method thereof
10/08/2008CN101281874A Grain automatic positioning, and stack type encapsulation structure as well as manufacturing method thereof
10/08/2008CN101281872A Wiring substrate and wiring substrate manufacturing method
10/08/2008CN101281735A Gradation voltage selection circuit and display control circuit
10/08/2008CN101281612A Modularized memory card apparatus capable of dividing memory body magnetic region
10/08/2008CN101281333A LCOS chip pixel device structure and manufacturing method thereof
10/08/2008CN101279710A Method for judging wafer backside alignment overlay accuracy and wafer thereof
10/08/2008CN101279306A Glue solution injector driven by electromagnetic expulsive force
10/08/2008CN101279305A Glue solution injector driven by electromagnetic attraction
10/08/2008CN100425110C Processing method for planing pattern fin slices radiator and tools thereof
10/08/2008CN100424900C Side view LED package having lead frame structure designed to improve resin flow
10/08/2008CN100424873C A semiconductor structure for electrostatic discharge protection
10/08/2008CN100424872C Light source structure of luminous diode
10/08/2008CN100424871C Overhang support for a stacked semiconductor device, and method of forming thereof
10/08/2008CN100424869C Semiconductor device, wafer and method of designing and manufacturing the same
10/08/2008CN100424868C A semiconductor device and method for manufacturing the semiconductor device
10/08/2008CN100424867C Interconnect structure of integrated circuit
10/08/2008CN100424866C Tape circuit substrate and semiconductor chip package using the same
10/08/2008CN100424865C Semiconductor device with a protected active die region and method therefor
10/08/2008CN100424864C Conducting wire frame for improving package reliability and its packaging structure
10/08/2008CN100424863C Chip buried base plate encapsulation structure
10/08/2008CN100424862C Semiconductor device and manufacturing method thereof, circuit board, electro-optic device, electronic device
10/08/2008CN100424861C Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication
10/08/2008CN100424860C Heat elimination type structure for packing complex crystal
10/08/2008CN100424859C Electronic device and producing method thereof
10/08/2008CN100424858C Electronic device and producing method thereof
10/08/2008CN100424857C Card with embedded IC and electrochemical cell
10/08/2008CN100424848C Wiring structure to minimize stress induced void formation
10/08/2008CN100424847C Method for preparing transistor and combined improved structure obtained thereby
10/08/2008CN100424846C Light emitting diode with static damage protective function and its producing method
10/08/2008CN100424845C Semiconductor device and manufacturing method of the same
10/08/2008CN100424844C Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
10/08/2008CN100424842C Wiring board and method of producing the same
10/08/2008CN100424573C Thin-film transistor array panel and its making method
10/07/2008US7433655 Battery-operated wireless-communication apparatus and method
10/07/2008US7433202 Electronic device and method of manufacturing thereof
10/07/2008US7433201 Oriented connections for leadless and leaded packages
10/07/2008US7433190 Liquid cooled electronic chassis having a plurality of phase change material reservoirs
10/07/2008US7433189 Electronic device and heat dissipation module thereof
10/07/2008US7433188 Electronic package with direct cooling of active electronic components
10/07/2008US7433187 Heat spreader module
10/07/2008US7433178 Plasma display apparatus
10/07/2008US7433008 Liquid crystal display device with data and gate link lines having holes for resistance compensation for providing constant current flow therebetween
10/07/2008US7432792 High frequency thin film electrical circuit element
10/07/2008US7432783 Filter device substrate and filter device
10/07/2008US7432778 Arrangement and method impedance matching
10/07/2008US7432775 High speed electronics interconnect having a dielectric system with cylindrical holes therein
10/07/2008US7432605 Overlay mark, method for forming the same and application thereof
10/07/2008US7432604 Semiconductor component and system having thinned, encapsulated dice
10/07/2008US7432603 Semiconductor encapsulating epoxy resin composition and semiconductor device
10/07/2008US7432602 Semiconductor device
10/07/2008US7432600 System having semiconductor component with multiple stacked dice
10/07/2008US7432599 Memory module having interconnected and stacked integrated circuits
10/07/2008US7432597 Semiconductor device and method of manufacturing the same
10/07/2008US7432596 Apparatus and method for bonding silicon wafer to conductive substrate
10/07/2008US7432595 System and method to reduce metal series resistance of bumped chip
10/07/2008US7432594 Semiconductor chip, electrically connections therefor
10/07/2008US7432593 Semiconductor package assembly and method for electrically isolating modules
10/07/2008US7432592 Integrated micro-channels for 3D through silicon architectures
10/07/2008US7432590 Ceramic package, assembled substrate, and manufacturing method therefor
10/07/2008US7432589 Semiconductor device
10/07/2008US7432588 Semiconductor device and method of fabricating the same
10/07/2008US7432587 Integrated device including connections on a separate wafer
10/07/2008US7432586 Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
10/07/2008US7432585 Semiconductor device electronic component, circuit board, and electronic device
10/07/2008US7432584 Leadframe for use in a semiconductor package
10/07/2008US7432583 Leadless leadframe package substitute and stack package
10/07/2008US7432582 Method of forming a through-substrate interconnect
10/07/2008US7432580 Semiconductor device with a substrate having a spiral shaped coil
10/07/2008US7432575 Two-layer electrical substrate for optical devices
10/07/2008US7432557 FinFET device with multiple channels
10/07/2008US7432556 Semiconductor device with dummy conductors
10/07/2008US7432555 Testable electrostatic discharge protection circuits
10/07/2008US7432532 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
10/07/2008US7432213 Electrical connection pattern in an electronic panel
10/07/2008US7432204 Wafer and the manufacturing and reclaiming methods thereof
10/07/2008US7432191 Method of forming a dual damascene structure utilizing a developable anti-reflective coating
10/07/2008US7432170 Semiconductor device and fabrication method thereof
10/07/2008US7432151 Semiconductor device and method for fabricating the same
10/07/2008US7432132 Integrated diamond carrier method for laser bar arrays
10/07/2008US7432127 Chip package and package process thereof
10/07/2008US7432115 Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit
10/07/2008US7431990 Epoxyphenylphenolic resin, phenolic resin, inorganic filler, curing accelerator, silane coupling agent, and compound containing naphthalene ring in which at least two adjacent carbon atoms are coupled to hydroxyl groups; flowability, moldability, crack resistance during soldering, flame retardance
10/07/2008US7431072 Heat sink with increased cooling capacity and semiconductor device comprising the heat sink
10/06/2008CA2629050A1 Process for the manufacture of carbon nanotubes from renewable raw materials
10/02/2008WO2008118947A1 Method for producing heterogeneous composites
10/02/2008WO2008118404A1 Integrated circuit with flexible planer leads
1 ... 869 870 871 872 873 874 875 876 877 878 879 880 881 882 883 884 885 886 887 888 889 ... 2262