Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/16/2008US20080251916 UBM structure for strengthening solder bumps
10/16/2008US20080251915 Structure of semiconductor chip and package structure having semiconductor chip embedded therein
10/16/2008US20080251914 Semiconductor device
10/16/2008US20080251913 Semiconductor device including wiring substrate having element mounting surface coated by resin layer
10/16/2008US20080251912 Multi-Chip Module
10/16/2008US20080251911 System and method having evaporative cooling for memory
10/16/2008US20080251910 Fabricating method of semiconductor package and heat-dissipating structure applicable thereto
10/16/2008US20080251909 Power Semiconductor Module for Inverter Circuit System
10/16/2008US20080251907 Electronic Device With Stress Relief Element
10/16/2008US20080251906 Package-on-package secure module having BGA mesh cap
10/16/2008US20080251905 Package-on-package secure module having anti-tamper mesh in the substrate of the upper package
10/16/2008US20080251904 Curing layers of a semiconductor product using electromagnetic fields
10/16/2008US20080251903 Semiconductor module
10/16/2008US20080251902 Half-etching a processed sheet; attaching the sheet to a semiconductor device supporting tape; connecting the inner terminals to the semiconductor device with bond wires;sealing the processed sheet and the semiconductor device held between a pair of flat molding plates, removing plates
10/16/2008US20080251901 Stacked integrated circuit package system
10/16/2008US20080251900 Conductor Frame For an Electronic Component and Method For the Production Thereof
10/16/2008US20080251899 Semiconductor device
10/16/2008US20080251898 Semiconductor device
10/16/2008US20080251897 Semiconductor device
10/16/2008US20080251896 Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same
10/16/2008US20080251895 Apparatus for shielding integrated circuit devices
10/16/2008US20080251894 Mounted Body and Method for Manufacturing the Same
10/16/2008US20080251893 Mounting clips for use with electromagnetic interference shielding and methods of using the same
10/16/2008US20080251892 Insulating film for semiconductor integrated circuit
10/16/2008US20080251891 Semiconductor having passivated sidewalls
10/16/2008US20080251890 Method of Forming Buffer Layer for Nitride Compound Semiconductor Light Emitting Device and Nitride Compound Semiconductor Light Emitting Device Having the Buffer Layer
10/16/2008US20080251885 Fuse structure, semiconductor device, and method of forming the semiconductor device
10/16/2008US20080251875 Semiconductor package
10/16/2008US20080251868 Standard component for calibration and electron-beam system using the same
10/16/2008US20080251859 Semiconductor Module
10/16/2008US20080251846 Method and structure for low capacitance esd robust diodes
10/16/2008US20080251828 Enhanced atomic layer deposition
10/16/2008US20080251805 Heat dissipation package for heat generation element
10/16/2008US20080251788 Wafer-level package having test terminal
10/16/2008US20080251787 Thin film transistor substrate and flat panel display comprising the same
10/16/2008US20080251779 Apparatus of memory array using finfets
10/16/2008US20080251286 Method For Increasing a Routing Density For a Circuit Board and Such a Circuit Board
10/16/2008US20080251239 Heat sink
10/16/2008DE202008010977U1 Kühlmodul für Leuchtdiode Cooling module for LED
10/16/2008DE202008010716U1 Kühlrippe Fin
10/16/2008DE202007016535U1 Einrichtung zum Kühlen thermisch hochbelasteter Bauelemente Means for cooling thermally highly stressed components
10/16/2008DE19904138B4 Verfahren zur Herstellung von Kontakthügeln für die Chipeinbettung in Dünnfilmanordnungen Process for the preparation of bumps for the chip embedding in thin film devices
10/16/2008DE112005003802T5 Elektronisches Bauteil und ein Verfahren zum Herstellen eines elektronischen Bauteils Electronic component and a method of manufacturing an electronic component
10/16/2008DE10338078B4 Halbleiterelement mit verbesserten Haftungseigenschaften der nichtmetallischen Oberflächen und Verfahren zu dessen Herstellung Semiconductor element with improved adhesion properties of the non-metallic surfaces and process for its preparation
10/16/2008DE10331560B4 Halbleitervorrichtung mit einem Verbundbereich und ein Verfahren zur Herstellung derselben A semiconductor device comprising a composite region and a method of manufacturing the same
10/16/2008DE10331335B4 Leistungs-Halbleitervorrichtung Power semiconductor device
10/16/2008DE102008016665A1 Verkapselungsverfahren und Vorrichtung Encapsulation methods and apparatus
10/16/2008DE102008016324A1 Halbleiterbausteinpackung mit einem Chip aufnehmendem Durchgangsloch und doppelseitigen Aufbauschichten auf beiden Oberflächenseiten für WLP und ein Verfahren dazu Semiconductor device package with a chip aufnehmendem through hole and double-sided structure layers on both surfaces for WLP and a method thereof
10/16/2008DE102007017641A1 Aushärtung von Schichten am Halbleitermodul mittels elektromagnetischer Felder Curing of coatings on semiconductor module by means of electromagnetic fields
10/16/2008DE102007014389A1 Semiconductor components producing method, involves placing semiconductor elements in hollow spaces, where number of hollow spaces is filled with housing material, and removing carrier
10/16/2008DE102007006125B3 Element e.g. thermoelectric element, arrangement producing method for use in electronic field, involves producing layer formed of indium and tin on element, and performing section-wise connecting of another layer with former layer
10/16/2008DE102004052903B4 System, und Verfahren zum Betreiben eines Systems, welches ein Halbleiter-Bauelement aufweist System and method of operating a system comprising a semiconductor device
10/16/2008DE102004013056B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
10/16/2008DE10139555B4 Verfahren zum Aufbringen einer Haftvermittlerschicht auf einer Metallschicht eines Chips A method of applying an adhesive layer on a metal layer of a chip
10/15/2008EP1981323A2 Electromagnetic-shielding device
10/15/2008EP1981319A1 Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package
10/15/2008EP1981084A2 Solid-state imaging device, its production method, camera with the solid-state imaging device and light-receiving chip
10/15/2008EP1981081A1 Cooling structure of power semiconductor element and inverter
10/15/2008EP1981080A2 Heat sink
10/15/2008EP1979943A2 Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof
10/15/2008EP1979942A1 Stress buffering package for a semiconductor component
10/15/2008EP1979941A2 Structure and method for making high density mosfet circuits with different height contact lines
10/15/2008EP1979940A2 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
10/15/2008EP1979939A1 Miniaturized high conductivity thermal/electrical switch
10/15/2008EP1979938A1 Electronic module and a method of assembling such a module
10/15/2008EP1979932A2 Low resistance and inductance backside through vias and methods of fabricating same
10/15/2008EP1725775B1 Arrangement with an electronically commutated external rotor motor
10/15/2008EP1495153B1 Method for coating metal surfaces
10/15/2008EP1356477B1 Compliant and crosslinkable thermal interface materials
10/15/2008CN201135010Y Heat radiation fin
10/15/2008CN201135009Y Heat radiation module with changeable positioning
10/15/2008CN201135008Y Heat radiation module with changeable positioning
10/15/2008CN201135007Y Heat radiating device and fastening piece of heat radiating base
10/15/2008CN201135006Y Radiating fin with latching structure
10/15/2008CN201135005Y Radiating fin with latching structure
10/15/2008CN201135004Y Electronic module heat radiator and outdoor set of air-conditioner mounted with the same
10/15/2008CN201135003Y Electronic module heat radiator and outdoor set of air-conditioner mounted with the same
10/15/2008CN201135001Y Heat radiator
10/15/2008CN201134949Y White light LED illuminating apparatus
10/15/2008CN201134441Y LED apparatus
10/15/2008CN201134440Y Improved structure of LED encapsulation
10/15/2008CN201134437Y Optoelectronic component
10/15/2008CN201134432Y Protective circuit of chip electrostatic prevention
10/15/2008CN201134431Y Series arrangement with quickly replaceable thyristor
10/15/2008CN201134428Y High-power LED encapsulation structure
10/15/2008CN201134427Y Insulated reinforced packaging structure with radiating fin exposed outside
10/15/2008CN201134426Y Chip packaging structure
10/15/2008CN201134425Y Cylinder ceramic sealed diode
10/15/2008CN201134424Y Fully pressure welded high-power IGBT multi-formwork ceramic cartridge
10/15/2008CN201134070Y Side blowing heat radiator of CPU
10/15/2008CN201133639Y Illuminating apparatus possessing radiation structure
10/15/2008CN201133637Y Large power LED bulb
10/15/2008CN201133636Y Large power flat-plate LED heat radiating device
10/15/2008CN201133635Y Radiation structure and lamp possessing the radiation structure
10/15/2008CN201133634Y Large power LED lamp
10/15/2008CN201133633Y Large power LED landscape lamp
10/15/2008CN201133631Y Large power LED tunnel lamp
10/15/2008CN201133630Y Luminous diode large power lighting lamp
10/15/2008CN201133628Y Large power LED explosion-proof lamp
10/15/2008CN201133613Y Illuminating light source of light emitting diode
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