| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/01/2008 | CN100423248C Semiconductor device and unit equipped with the same |
| 10/01/2008 | CN100423247C Routing design to minimize electromigration damage to solder bumps |
| 10/01/2008 | CN100423246C Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level |
| 10/01/2008 | CN100423245C Metal silicide nano-wire and its making method |
| 10/01/2008 | CN100423244C Integration computer chip liquid cooler |
| 10/01/2008 | CN100423243C Miniature efficient self-circulating electronic cooler |
| 10/01/2008 | CN100423242C Thermal-conductive substrate package |
| 10/01/2008 | CN100423241C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 10/01/2008 | CN100423240C Multilayer ceramic substrate with single via anchored pad and method of forming |
| 10/01/2008 | CN100423236C Method of forming bit line of flash memory device |
| 10/01/2008 | CN100423228C Dual-metal inserting structure and producing method thereof |
| 10/01/2008 | CN100423217C Substrate for device bonding, device bonded substrate, and method for producing same |
| 10/01/2008 | CN100423216C Method for forming suspended transmission line structures in back end of line processing |
| 10/01/2008 | CN100423207C Process monitor and system for producing semiconductor |
| 10/01/2008 | CN100423185C Apparatus and method for alignment of a bonding tool |
| 10/01/2008 | CN100422365C ISIC leading wire frame copper tape and its production process |
| 10/01/2008 | CN100422240C Organosilicate polyer and insulating film therefrom |
| 10/01/2008 | CN100422235C Electric insulated resin pulp used for chip carrying and packaging |
| 10/01/2008 | CN100421861C Soldering flux |
| 09/30/2008 | US7430359 Micromechanical system containing a microfluidic lubricant channel |
| 09/30/2008 | US7430122 Electronic device assembly with clips for mounting a heat sink thereon |
| 09/30/2008 | US7430121 Heat sink fastener |
| 09/30/2008 | US7430119 Impeller and aligned cold plate |
| 09/30/2008 | US7429800 Molding composition and method, and molded article |
| 09/30/2008 | US7429799 Land patterns for a semiconductor stacking structure and method therefor |
| 09/30/2008 | US7429798 Integrated circuit package-in-package system |
| 09/30/2008 | US7429797 Electronic device and carrier substrate |
| 09/30/2008 | US7429796 Semiconductor device and fabrication process thereof |
| 09/30/2008 | US7429795 Bond pad structure |
| 09/30/2008 | US7429794 Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip |
| 09/30/2008 | US7429793 Semiconductor device having an electronic circuit disposed therein |
| 09/30/2008 | US7429792 Stack package with vertically formed heat sink |
| 09/30/2008 | US7429791 Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof |
| 09/30/2008 | US7429790 Semiconductor structure and method of manufacture |
| 09/30/2008 | US7429789 Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 09/30/2008 | US7429788 Thin multichip flex-module |
| 09/30/2008 | US7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
| 09/30/2008 | US7429786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides |
| 09/30/2008 | US7429785 Stacked integrated circuit chip assembly |
| 09/30/2008 | US7429784 Package structure |
| 09/30/2008 | US7429783 Image sensor package |
| 09/30/2008 | US7429782 Semiconductor stack block comprising semiconductor chips and methods for producing the same |
| 09/30/2008 | US7429781 Memory package |
| 09/30/2008 | US7429780 Fuse circuit and semiconductor device including the same |
| 09/30/2008 | US7429774 Electrostatic discharge (ESD) protection MOS device and ESD circuitry thereof |
| 09/30/2008 | US7429765 Nonvolatile semiconductor memory |
| 09/30/2008 | US7429758 Optoelectronic component and method for producing it |
| 09/30/2008 | US7429704 Electronic component, electro-optical device, and electronic apparatus |
| 09/30/2008 | US7429703 Methods and apparatus for integrated circuit device power distribution via internal wire bonds |
| 09/30/2008 | US7429528 Method of fabricating a pad over active circuit I.C. with meshed support structure |
| 09/30/2008 | US7429522 Dicing die-bonding film |
| 09/30/2008 | US7429501 Lid and method of employing a lid on an integrated circuit |
| 09/30/2008 | US7429498 Integrated circuitry and method for manufacturing the same |
| 09/30/2008 | US7429497 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor |
| 09/30/2008 | US7428777 Method of making a heatsink device |
| 09/30/2008 | CA2587998A1 Pump expansion vessel |
| 09/30/2008 | CA2336889C A thermal management device and method of making such a device |
| 09/25/2008 | WO2008116089A1 Leadframe array with riveted heat sinks |
| 09/25/2008 | WO2008115608A2 Method and apparatus for cooling integrated circuit chips using recycled power |
| 09/25/2008 | WO2008115468A2 Integrated circuits and interconnect structure for integrated circuits |
| 09/25/2008 | WO2008115453A1 Integrated circuit socket |
| 09/25/2008 | WO2008114784A1 Metal paste for sealing, method for hermetical sealing of piezoelectric element, and piezoelectric device |
| 09/25/2008 | WO2008114766A1 Novel polyvalent hydroxy compound, method for producing the compound, epoxy resin and epoxy resin composition each using the compound, and cured product of the composition |
| 09/25/2008 | WO2008114711A1 Water soluble pressure sensitive adhesive for fine solder ball replacement |
| 09/25/2008 | WO2008114634A1 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting |
| 09/25/2008 | WO2008114616A1 Cleaning composition and process for producing semiconductor device |
| 09/25/2008 | WO2008114610A1 High frequency circuit device, active circuit device and transmitting/receiving device |
| 09/25/2008 | WO2008114572A1 Vibration generating/cooling apparatus |
| 09/25/2008 | WO2008114465A1 Method of forming solder bumps and solder bump-forming assembly |
| 09/25/2008 | WO2008114434A1 Mount substrate, process for producing the same, semiconductor device and process for producing the same |
| 09/25/2008 | WO2008114430A1 Stacked package element, method for forming terminal of stacked package element, stacked package, and method for forming stacked package |
| 09/25/2008 | WO2008114381A1 Heat sink, electronic device, and method of manufacturing electronic device |
| 09/25/2008 | WO2008114374A1 Semiconductor device and method of manufacturing same |
| 09/25/2008 | WO2008114208A2 Metal pads with reduced parasitic capacitance |
| 09/25/2008 | WO2008114094A1 Thin profile packaging with exposed die attach adhesive |
| 09/25/2008 | WO2008089474A3 Apparatus and method for reduced delamination of an integrated circuit module |
| 09/25/2008 | WO2008086871A3 Method for applying markings to substrate surfaces by means of a transfer method |
| 09/25/2008 | WO2008082942A3 High-z structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
| 09/25/2008 | WO2008051184A3 Enhancement of thermal interface conductivities with carbon nanotube arrays |
| 09/25/2008 | WO2008011459A3 Power semiconductor devices having integrated inductor |
| 09/25/2008 | WO2007051142A3 Metal cuboid semiconductor device and method |
| 09/25/2008 | WO2006113288A3 Guardwall structures for esd protection |
| 09/25/2008 | US20080235644 Semiconductor integrated circuit with multi-cut via and automated layout method for the same |
| 09/25/2008 | US20080234409 Sealant Epoxy-Resin Molding Material, and Electronic Component Device |
| 09/25/2008 | US20080233761 Fabrication method of semiconductor integrated circuit device |
| 09/25/2008 | US20080233733 Method of wire bonding over active area of a semiconductor circuit |
| 09/25/2008 | US20080233729 Method of forming micro pattern in semiconductor device |
| 09/25/2008 | US20080233684 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
| 09/25/2008 | US20080233677 Semiconductor device and method of manufacturing the same |
| 09/25/2008 | US20080233667 Microdisplay packaging system |
| 09/25/2008 | US20080233422 Coated nickel-containing powders |
| 09/25/2008 | US20080232065 Mounting Plate for Electronic Components |
| 09/25/2008 | US20080232011 Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection |
| 09/25/2008 | US20080231306 Integrated circuit burn-in test system and associated methods |
| 09/25/2008 | US20080231305 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 09/25/2008 | US20080231303 Semiconductor device for electrical contacting semiconductor devices |
| 09/25/2008 | US20080231293 Device and method for electrical contacting for testing semiconductor devices |
| 09/25/2008 | US20080231288 Semiconductor package having projected substrate |
| 09/25/2008 | US20080230929 Overlay mark of semiconductor device and semiconductor device including the overlay mark |
| 09/25/2008 | US20080230928 Module comprising a semiconductor chip |