Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2008
10/02/2008WO2008118194A2 Partial solder mask defined pad design
10/02/2008WO2008118193A2 Wafer-level interconnect for high mechanical reliability applications
10/02/2008WO2008117839A1 Novel polyvalent hydroxy compound, method for producing the same, epoxy resin using the compound, and epoxy resin composition and cured product thereof
10/02/2008WO2008117736A1 Interposer substrate, lsi chip and information terminal device using the interposer substrate, interposer substrate manufacturing method, and lsi chip manufacturing method
10/02/2008WO2008117702A1 Method for metal patterned wiring formation and semiconductor device produced using the method
10/02/2008WO2008117582A1 Method for forming metal film using carbonyl material, method for forming multilayered wiring structure, method for manufacturing semiconductor device, and film forming apparatus
10/02/2008WO2008117522A1 Semiconductor sealing resin composition and semiconductor device using the resin composition
10/02/2008WO2008117489A1 Adhesive film for producing semiconductor device
10/02/2008WO2008117436A1 Cooling system
10/02/2008WO2008117434A1 Semiconductor part, and semiconductor part manufacturing method
10/02/2008WO2008117431A1 Semiconductor device and method for manufacturing semiconductor device
10/02/2008WO2008117426A1 Semiconductor device and process for producing the same
10/02/2008WO2008117421A1 Printed board unit and electronic apparatus
10/02/2008WO2008117385A1 Electronic device, electronic apparatus with packaged electronic device, article with mounted electronic device, and method for manufacturing electronic device
10/02/2008WO2008117384A1 Electronic device, electronic equipment in which electronic device is packaged, article to which electronic device is mounted, and electronic device manufacturing method
10/02/2008WO2008117383A1 Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device
10/02/2008WO2008117382A1 Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device
10/02/2008WO2008116947A1 Production of composite materials with high thermal conductivity
10/02/2008WO2008116677A1 Method for fitting an electrical component to a contacting element and contacting element with an electrical component
10/02/2008WO2008091985A3 Dielectric cap having material with optical band gap to substantially block uv radiation during curing treatment, and related methods
10/02/2008WO2008091474A3 Stackable leadless electronic package
10/02/2008WO2008079430A3 Method, apparatus and system for carbon nanotube wick structures
10/02/2008WO2008067249A3 Chip on leads
10/02/2008WO2008054785A3 Ball grid array resonator
10/02/2008WO2008045422A3 Edge connect wafer level stacking
10/02/2008WO2007137221A3 Dual side cooling integrated transistor module and methods of manufacture
10/02/2008WO2007120232A9 Self-aligning optical sensor package
10/02/2008WO2006052481A3 Semiconductor device having post-mold nickel/palladium/gold plated leads
10/02/2008US20080242768 Heat and chemical resistance, dimensional stability; controlled surface resistivity of encapsulated molded product, electrical insulating property; epoxy resin, curing agent, resistive carbon precursor and conductive filler
10/02/2008US20080241999 Semiconductor device and manufacturing method therefor
10/02/2008US20080241994 Print Mask and Method of Manufacturing Electronic Components Using The Same
10/02/2008US20080241992 Method of assembling chips
10/02/2008US20080241977 Semiconductor device with electrode pad having probe mark
10/02/2008US20080241519 Semiconductor Wafer and Process For Its Production
10/02/2008US20080241489 Method of forming resist pattern and semiconductor device manufactured with the same
10/02/2008US20080239792 Metal silicide alloy local interconnect
10/02/2008US20080239786 Logic coding in an integrated circuit
10/02/2008US20080239672 Cooling of High Power Density Devices Using Electrically Conducting Fluids
10/02/2008US20080239671 Semiconductor Element Mounting Substrate, Semiconductor Module, And Electric Vehicle
10/02/2008US20080239663 Cooling device for electronic component and power converter equipped with the same
10/02/2008US20080239217 Semi-Transmissive/Semi-Reflective Electrode Substrate, Method for Manufacturing Same, and Liquid Crystal Display Using Such Semi-Transmissive/Semi-Reflective Electrode Substrate
10/02/2008US20080238582 Flexible Capacitive Coupler Assembly And Method Of Manufacture
10/02/2008US20080238469 Semiconductor Device and Semiconductor Device Module
10/02/2008US20080238462 Test device for semiconductor devices
10/02/2008US20080237898 Semiconductor device, method for manufacturing the same, heat sink, semiconductor chip, interposer substrate, and glass plate
10/02/2008US20080237897 Semiconductor die molded from a bis(epoxyalkyl) derivative of an aromatic initiator, e.g., 1,4-cyclohexylene bis(p-glycidyloxy)benzoate of or 4,4'-bis(4-(glycidyloxy)butoxyphenyl)stilbene; melting point of less than 140 degrees C.; are liquid crystalline at greater than 150 degrees C.
10/02/2008US20080237896 Wafer level packages capable of reducing chipping defect and manufacturing methods thereof
10/02/2008US20080237895 Semiconductor device
10/02/2008US20080237894 Integrated circuit package and method for the same
10/02/2008US20080237893 Anti Pad To Reduce Parasitic Capacitance And Improve Return Loss In A Semiconductor Die And Package
10/02/2008US20080237892 Semiconductor device
10/02/2008US20080237891 Semiconductor device
10/02/2008US20080237890 Semiconductor Device and Wiring Board
10/02/2008US20080237889 Semiconductor package, method of fabricating the same, and semiconductor package mold
10/02/2008US20080237888 Multichip semiconductor device, chip therefor and method of formation thereof
10/02/2008US20080237887 Semiconductor die stack having heightened contact for wire bond
10/02/2008US20080237886 Three-dimensional crossbar array systems and methods for writing information to and reading information stored in three-dimensional crossbar array junctions
10/02/2008US20080237885 Method for Improving Design Window
10/02/2008US20080237884 Packaging substrate structure
10/02/2008US20080237883 Semiconductor device and method of manufacturing the same
10/02/2008US20080237882 Annular via drilling (AVD) technology
10/02/2008US20080237881 Recessed solder socket in a semiconductor substrate
10/02/2008US20080237880 Integrated circuit package system with protected conductive layers
10/02/2008US20080237879 Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for wlp and method of the same
10/02/2008US20080237878 Semiconductor device and method of producing the same
10/02/2008US20080237877 Semiconductor device
10/02/2008US20080237876 Semiconductor device and method for manufacturing the same
10/02/2008US20080237875 Semiconductor device and method for manufacturing the same
10/02/2008US20080237874 Method of Producing a Silicon Oxide-Based Material with a Low Dielectric Constant
10/02/2008US20080237873 Integrated circuit package system with bonding in via
10/02/2008US20080237872 Semiconductor Device and Method For Manufacturing Same
10/02/2008US20080237871 Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtained With Such a Method
10/02/2008US20080237870 Semiconductor device
10/02/2008US20080237869 Structure and method for low resistance interconnections
10/02/2008US20080237868 Method and structure for ultra narrow crack stop for multilevel semiconductor device
10/02/2008US20080237867 Low contact resistance metal contact
10/02/2008US20080237866 Semiconductor device with strengthened pads
10/02/2008US20080237865 Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor
10/02/2008US20080237864 Metal interconnection structure of a semiconductor device having low resistance and method of fabricating the same
10/02/2008US20080237863 Semiconductor device and manufacturing method of semiconductor device
10/02/2008US20080237862 Implementation of diffusion barrier in 3D memory
10/02/2008US20080237861 Novel Fluorine-Free Precursors and Methods for the Deposition of Conformal Conductive Films for Nanointerconnect Seed and Fill
10/02/2008US20080237860 Interconnect structures containing a ruthenium barrier film and method of forming
10/02/2008US20080237859 Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication
10/02/2008US20080237858 Electronic device and method of manufacturing the same
10/02/2008US20080237857 Semiconductor package
10/02/2008US20080237856 Semiconductor Package and Method for Fabricating the Same
10/02/2008US20080237855 Ball grid array package and its substrate
10/02/2008US20080237854 Method for forming contact pads
10/02/2008US20080237853 Semiconductor device and manufacturing method of the same
10/02/2008US20080237852 Semiconductor device
10/02/2008US20080237851 Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
10/02/2008US20080237850 Compliant bump structure and bonding structure
10/02/2008US20080237849 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
10/02/2008US20080237848 Semiconductor device
10/02/2008US20080237847 Power semiconductor module, and power semiconductor device having the module mounted therein
10/02/2008US20080237846 Semiconductor device and manufacturing method thereof
10/02/2008US20080237845 Systems and methods for removing heat from flip-chip die
10/02/2008US20080237844 Microelectronic package and method of manufacturing same
10/02/2008US20080237843 Microelectronic package including thermally conductive sealant between heat spreader and substrate
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